P2I2304NZF-08-TR

ASM2P2304NZ Four Output PCI-X and General Purpose Buffer Features Functional Description One input to four Output Buffer/Driver General-purpose or PCI-X clock buffer Buffers all frequencies from DC to 140MHz Output-to-output skew less than 100pS Available in 8-pin TSSOP and SOIC Packages 3.3V operation The ASM2P2304NZ is a low-cost buffer designed to distribute high-speed clocks for PCI-X and other applications. The device operates at 3.3V and outputs can run up to 140MHz. Table 1. Function Table. Inputs Outputs BUF_IN OE Output [1:4] L H L H L L H H L L L H Block Diagram OE Logic Control BUF_ IN OUTPUT 1 OUTPUT 2 OUTPUT 3 OUTPUT 4 ©2010 SCILLC. All rights reserved. JANUARY 2010 – Rev. 2 Publication Order Number: ASM2P2304/D ASM2P2304NZ Pin Configuration BUF_IN 1 8 OUTPUT 4 OE 2 7 OUTPUT 3 OUTPUT 1 3 ASM2P2304NZ NZ GND 4 6 VDD 5 OUTPUT 2 Pin Description Pin # 1 1 BUF_IN 2 OE 3 Output 1 4 GND 5 Output 2 6 VDD 7 8 Notes: Pin Name 2 2 Type Description I Input clock. 5V Tolerant Input. I Input pin for Output Enable, active HIGH. Connect to VDD. O Output 1. P Ground. O Output 2. P 3.3V Voltage Supply. Output 3 2 O Output 3. Output 4 2 O Output 4. 1. Weak pull down on input. 2. Weak pull down on all outputs. Rev. 2 | Page 2 of 9 | www.onsemi.com ASM2P2304NZ Absolute Maximum Ratings Parameter Description Min Max Supply Voltage to Ground Potential -0.5 7 V DC Input Voltage (Except BUF_IN) -0.5 VDD + 0.5 V DC Input Voltage (BUF_IN) -0.5 7 V Storage Temperature -65 +150 °C Max. Soldering Temperature (10 sec) 260 °C Junction Temperature 150 °C Static Discharge Voltage (As per JEDEC STD22- A114-B) 2000 V Note: These are stress ratings only and functional usage is not implied. Exposure to absolute maximum ratings for prolonged periods can affect device reliability. Operating Conditions Parameter Description Min Max Unit VDD Supply Voltage 3.0 3.6 V TA Operating Temperature (Ambient Temperature) -40 85 °C CL Load Capacitance 25 pF CIN Input Capacitance 7 pF BUF_IN, OUTPUT [1:4] tPU Operating Frequency DC 140 MHz Power-up time for all VDD’s to reach minimum specified Voltage (Power ramps must be monotonic) 0.05 50 mS Rev. 2 | Page 3 of 9 | www.onsemi.com ASM2P2304NZ Electrical Characteristics Parameter Description VIL Input LOW Voltage VIH Input HIGH Voltage IIL Input LOW Current VIN = 0V -5 5 µA IIH Input HIGH Current VIN = VDD -5 12 µA IOL = 24mA 0.8 V VOL Output LOW Voltage IOL = 12mA 0.55 V VOH IDD Notes: Test Conditions Min 1 1 Unit 0.8 V 2.0 V 2 Output HIGH Voltage IOH = -24mA 2.0 V IOH = -12mA 2.4 V 2 Supply Current Unloaded outputs at 66.66MHz 25 mA 1. BUF_IN input has a threshold voltage of VDD/2. 2. Parameter is guaranteed by design and characterization. It is not 100% tested in production. Switching Characteristics for Commercial and Industrial Temperature Devices Parameter Notes: Max Name Description 2 Measured at 1.5V 3 Min Typ Max Unit 40.0 50.0 60.0 % tD Duty Cycle = t2 ÷t1 t3 Rise Time Measured between 0.8V and 2.0V 1.50 nS t4 Fall Time 2 Measured between 2.0V and 0.8V 1.50 nS t5 Output to Output Skew All outputs equally loaded For Commercial parts 100 For Industrial parts 150 t6 Propagation Delay, BUF_IN Rising Edge to 2 OUTPUT Rising Edge Measured at VDD/2 2 2 1. BUF_IN input has a threshold voltage of VDD/2. 2. Parameter is guaranteed by design and characterization. It is not 100% tested in production. 3. All parameters specified with loaded outputs. Rev. 2 | Page 4 of 9 | www.onsemi.com 2.5 3.5 5 pS nS ASM2P2304NZ Switching Waveforms Duty Cycle Timing All Outputs Rise/Fall Time Output-Output Skew Input-Output Propagation Delay Rev. 2 | Page 5 of 9 | www.onsemi.com ASM2P2304NZ Package Information 8-lead Thin Shrunk Small Outline Package (4.40-MM Body) H E D A2 A C e A1 L B Dimensions Symbol Inches Min Millimeters Max A Min Max 0.043 1.10 A1 0.002 0.006 0.05 0.15 A2 0.033 0.037 0.85 0.95 B 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.028 0.50 0.70 θ 0° 8° 0° 8° Rev. 2 | Page 6 of 9 | www.onsemi.com ASM2P2304NZ Package Information 8-lead (150-mil) SOIC Package H E D A2 A D C e A1 L B Dimensions Symbol Inches Millimeters Min Max Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.010 0.18 0.25 D 0.193 BSC 4.90 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 0.41 1.27 θ 0° 8° 0° 8° Rev. 2 | Page 7 of 9 | www.onsemi.com ASM2P2304NZ Ordering Code Part Number Marking Package Type Temperature P2P2304NZF-08ST 2P2304NZF 8-pin SOIC - Tube, Pb Free Commercial P2P2304NZF-08SR 2P2304NZF 8-pin SOIC - Tape and Reel, Pb Free Commercial ASM2I2304NZF-08-ST 2I2304NZF 8-pin SOIC - Tube, Pb Free ASM2I2304NZF-08-SR 2I2304NZF 8-pin SOIC - Tape and Reel, Pb Free ASM2P2304NZF-08-TT 2P2304NZF 8-pin TSSOP - Tube, Pb Free Commercial P2P2304NZF-08TR 2P2304NZF 8-pin TSSOP - Tape and Reel, Pb Free Commercial P2I2304NZF-08TT 2I2304NZF 8-pin TSSOP - Tube, Pb Free Industrial P2I2304NZF-08-TR 2I2304NZF 8-pin TSSOP - Tape and Reel, Pb Free Industrial Industrial Industrial Device Ordering Information A S M 2 P 2 3 0 4 N Z F - 0 8 - T R R = Tape & Reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70 DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved ON Semiconductor Mixed Signal Product Licensed under US patent #5,488,627, #6,646,463 and #5,631,920. Rev. 2 | Page 8 of 9 | www.onsemi.com ASM2P2304NZ Note: This product utilizes US Patent #6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. U.S Patent Pending; Timing-Safe and Active Bead are trademarks of PulseCore Semiconductor, a wholly owned subsidiary of ON Semiconductor. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. 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