PACVGA201
VGA Port Companion Circuit
Product Description
The PACVGA201 provides seven channels of ESD protection for
all signal lines commonly found in a VGA port. ESD protection is
implemented with current−steering diodes designed to safely handle
the high surge currents encountered with IEC−61000−4−2 Level−4
ESD Protection (8 kV contact discharge). When a channel is
subjected to an electrostatic discharge, the ESD current pulse is
diverted via the protection diodes into the positive supply rail or
ground where it may be safely dissipated.
Separate positive supply rails are provided for the VIDEO,
DDC_OUT and SYNC channels to facilitate interfacing with
low−voltage video controller ICs and to provide design flexibility in
multiple−supply−voltage environments.
An internal diode (D1, in schematic below) is provided such that
VCC2 is derived from VCC3 (VCC2 does not require an external power
supply input). In applications where VCC3 may be powered down,
diode D1 blocks any DC current path from the DDC_OUT pins back to
the powered down VCC3 rail via the upper ESD protection diodes.
Two non−inverting drivers provide buffering for the HSYNC and
VSYNC signals from the Video Controller IC (SYNC_IN1,
SYNC_IN2). These buffers accept TTL input levels and convert them
to CMOS output levels that swing between Ground and VCC3.
When the PWR_UP input is driven LOW, the SYNC outputs are
driven LOW and the SYNC inputs can float: no current will be drawn
from the VCC3 supply.
The PACVGA201 is housed in a 16−pin QSOP package with RoHS
compliant lead−free finishing.
Features
Seven Channels of ESD Protection for All VGA Port Connector
Pins
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QSOP16
QR SUFFIX
CASE 492
MARKING DIAGRAM
PACVGA
201QR
YYWWG
PACVGA 201QR
YY
WW
G
= Specific Device Code
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping†
PACVGA201QR
QSOP16
(Pb−Free)
2500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Meets IEC−61000−4−2 Level−4 ESD Requirements
(8 kV Contact Discharge)
Very Low Loading Capacitance from ESD Protection Diodes on
VIDEO Lines, 4pF Typical
TTL to CMOS Level−Translating Buffers with Power Down
Mode for HSYNC and VSYNC Lines
Three Power Supplies for Design Flexibility
Compact 16−Pin QSOP Package
These Devices are Pb−Free and are RoHS Compliant
Applications
ESD Protection and Termination Resistors for VGA (Video) Port
Interfaces
Desktop PCs
Notebook Computers
LCD Monitors
Semiconductor Components Industries, LLC, 2011
October, 2011 − Rev. 4
1
Publication Order Number:
PACVGA201/D
PACVGA201
SIMPLIFIED ELECTRICAL SCHEMATIC
VCC1
2
VCC2
VCC3
D1
8
VIDEO_1
VIDEO_2
VIDEO_3
GND
DDC_OUT1
DDC_OUT2
SYNC_IN1
SYNC_IN2
1
15
3
4
5
RB
16
6
9
14
12
GND
7
10
RP
11
13
GND
PACKAGE / PINOUT DIAGRAMS
Top View
VCC3
1
16
SD2
VCC1
2
15
SD1
VIDEO_1
3
14
SYNC_OUT2
VIDEO_2
4
13
SYNC_IN2
VIDEO_3
5
12
SYNC_OUT1
GND
6
11
SYNC_IN1
PWR_UP
7
10
DDC_OUT2
VCC2
8
9
DDC_OUT1
16−Pin QSOP
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2
SD1
SD2
SYNC_OUT2
SYNC_OUT1
PWR_UP
PACVGA201
Table 1. PIN DESCRIPTIONS
Pin(s)
Name
1
VCC3
VCC3 supply pin. This is an isolated supply input for the two sync buffers and SD1 and SD2 ESD
protection circuits.
Description
2
VCC1
VCC1 supply pin. This is an isolated supply pin for the VIDEO_1, VIDEO_2 and VIDEO_3 ESD
protection circuits.
3
VIDEO_1
Video signal ESD protection channel. This pin is typically tied one of the video lines between the VGA
controller device and the video connector.
4
VIDEO_2
Video signal ESD protection channel. This pin is typically tied one of the video lines between the VGA
controller device and the video connector.
5
VIDEO_3
Video signal ESD protection channel. This pin is typically tied one of the video lines between the VGA
controller device and the video connector.
6
GND
7
PWR_UP
Ground reference supply pin.
Enables the sync buffers when high. When PWR_UP is low the sync outputs are forced low and the
inputs can be floated.
8
VCC2
VCC2 supply pin. This is an isolated supply pin for the DDC_OUT1 and DDC_OUT2 ESD protection
circuits. Internally, VCC2 is derived from the VCC3 input if the VCC2 input is not connected to a supply
voltage.
9
DDC_OUT1
DDC_OUT1 ESD protection channel.
10
DDC_OUT2
DDC_OUT2 ESD protection channel.
11
SYNC_IN1
Sync signal buffer input. Connects to the VGA Controller side of one of the sync lines.
12
SYNC_OUT1
13
SYNC_IN2
14
SYNC_OUT2
15
SD1
ESD protection channel input.
16
SD2
ESD protection channel input.
Sync signal buffer output. Connects to the video connector side of one of the sync lines.
Sync signal buffer input. Connects to the VGA Controller side of one of the sync lines.
Sync signal buffer output. Connects to the video connector side of one of the sync lines.
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
VCC1, VCC2 and VCC3 Supply Voltage Inputs
Diode Forward Current (One Diode Conducting at a Time)
DC Voltage at Inputs
VIDEO_1, VIDEO_2, VIDEO_3
DDC_OUT1, DDC_OUT2
SYNC_IN1, SYNC_IN2
Rating
Units
[GND − 0.5] to +6.0
V
20
mA
[GND − 0.5] to [VCC1 + 0.5]
[GND − 0.5] to [VCC2 + 0.5]
[GND − 0.5] to [VCC3 + 0.5]
Operating Temperature Range
Storage Temperature Range
Package Power Rating
V
0 to +70
C
−65 to +150
C
750
mW
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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3
PACVGA201
SPECIFICATIONS (Cont’d)
Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter
Conditions
Min
Typ
Units
10
mA
ICC1
VCC1 Supply Current
VCC1 = 5.0 V
ICC3
VCC3 Supply Current
VCC3 = 5 V, SYNC Inputs at GND
or VCC3, PWR_UP pin at VCC3,
SYNC Outputs Unloaded
10
mA
VCC3 = 5 V, SYNC Inputs at 3.0 V,
PWR_UP Pin at VCC3, SYNC
Outputs Unloaded
200
mA
VCC3 = 5 V, PWR_UP Input at
GND, SYNC Outputs Unloaded
VCC2
VCC2 Pin Open Circuit Voltage
VCC2 Voltage Internally Derived
from VCC3 via Diode D1,
No External Current Drawn
VIH
Logic High Input Voltage
VCC3 = 5 V (Note 2)
VIL
Logic Low Input Voltage
VCC3 = 5 V (Note 2)
VOH
Logic High Output Voltage
IOH = −4 mA, VCC3 = 5.0 V (Note 3)
VOL
Logic Low Output Voltage
IOL = 4 mA, VCC3 = 5.0 V (Note 3)
Resistor Value
PWR_UP = VCC3 = 5.0 V
IIN
Input Current
VIDEO_x Pins
HSYNC, VSYNC Pins
VCC1 = 5.0 V, VIN = VCC1 or GND
VCC3 = 5.0 V, VIN = VCC3 or GND
CIN
Input Capacitance on
VIDEO_1, VIDEO_2 and VIDEO_3
Pins
RB, RP
1.
2.
3.
4.
Max
10
[VCC3 − 0.80]
V
2.0
V
0.8
4.4
0.5
V
V
1
0.4
V
2
MW
1
1
VCC1 = 5.0 V, VIN = 2.5 V,
Measured at 1 MHz
VCC1 = 2.5 V, VIN = 1.25 V,
Measured at 1 MHz
mA
mA
pF
4
4.5
tPLH
SYNC Buffer L H Propagation Delay
CL = 50 pF, VCC3 = 5.0 V,
Input tR and tF 5 ns
8
12
ns
tPHL
SYNC Buffer H L Propagation Delay
CL = 50 pF, VCC3 = 5.0 V,
Input tR and tF 5 ns
8
12
ns
tR, tF
SYNC Buffer Output Rise & Fall Times
CL = 50 pF, VCC3 = 5.0 V,
Input tR and tF 5 ns
7.0
VESD
ESD Withstand Voltage
VCC1 = VCC2 = VCC3 = 5 V (Note 4)
8
ns
kV
All parameters specified over standard operating conditions unless otherwise noted.
These parameters apply only to SYNC_IN1, SYNC_IN2 and PWR_UP.
These parameters apply only to SYNC_OUT1 and SYNC_OUT2.
Per the IEC−61000−4−2 International ESD Standard, Level 4 contact discharge method. VCC1, VCC2 and VCC3 must be bypassed to GND
via a low impedance ground plane with a 0.2 mF or greater, low inductance, chip ceramic capacitor at each supply pin. ESD pulse is applied
between the applicable pins and GND. ESD pulse can be positive or negative with respect to GND. Applicable pins are: VIDEO_1, VIDEO_2,
VIDEO_3, SYNC_OUT1, SD1, SYNC_OUT2, SD2, DDC_OUT1 and DDC_OUT2. All other pins are ESD protected to the industry standard
2 kV per the Human Body model (MIL−STD−883, Method 3015).
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4
PACVGA201
APPLICATION INFORMATION
To Video
DAC VCC
5V
0.2 mF
0.2 mF
0.2 mF
2
8
VCC1
H−Sync
13
Video Controller
V−Sync
10
DDC_Data
9
DDC_Clk
Blue
GND
SYNC_IN1
SYNC_IN2
PWR_UP
GND
6
7
DDC_OUT2
DDC_OUT1
Red
Green
VCC3
PACVGA201
SYNC_OUT2
12
14
3
4
5
VIDEO_1
SD1
SD2
VIDEO_2
VIDEO_3
15
16
SF**
ÎÎÎ
Î
ÎÎ
ÎÎÎ
SF**
VF**
VF**
VF**
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
SYNC_OUT1
Video Connector
11
1
VCC2
H−Sync
V−Sync
DDC_Data
DDC_Clk
Red
Green
Blue
VF** − VIDEO EMI Filter
SF** − SYNC EMI Filter
Figure 1. Typical Connection Diagram
A resistor may be necessary between the VCC2 pin and ground if protection against a stream of ESD pulses is required while
the PACVGA201 is in the power−down state. The value of this resistor should be chosen such that the extra charge deposited
into the VCC2 bypass capacitor by each ESD pulse will be discharged before the next ESD pulse occurs. The maximum ESD
repetition rate specified by the IEC−61000−4−2 standard is one pulse per second. When the PACVGA201 is in the power−up
state, an internal discharge resistor is connected to ground via a FET switch for this purpose.
For the same reason, VCC1 and VCC3 may also require bypass capacitor discharging resistors to ground if there are no other
components in the system to provide a discharge path to ground.
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5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QSOP16
CASE 492−01
ISSUE A
DATE 23 MAR 2011
2X
SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION.
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH,
PROTRUSIONS, OR GATE BURRS SHALL NOT EX
CEED 0.005 PER SIDE. DIMENSION E1 DOES NOT
INCLUDE INTERLEAD FLASH OR PROTRUSION. IN
TERLEAD FLASH OR PROTRUSION SHALL NOT EX
CEED 0.005 PER SIDE. D AND E1 ARE DETERMINED
AT DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
0.20 C D
D
16
L2
D
A
9
GAUGE
PLANE
SEATING
PLANE
E
E1
C
L
C
DETAIL A
2X
2X 10 TIPS
0.20 C D
1
8
16X
e
B
b
0.25
A2
0.10 C
0.10 C
A1
16X
C
0.25 C D
M
C A-B D
h x 45 _
A
SEATING
PLANE
M
1.12
9
XXXXXXX
XXXXXXX
YYWWG
6.40
1
8
0.635
PITCH
DOCUMENT NUMBER:
DESCRIPTION:
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
1.24
---0.20
0.30
0.19
0.25
4.89 BSC
6.00 BSC
3.90 BSC
0.635 BSC
0.22
0.50
0.40
1.27
0.25 BSC
0_
8_
16X
0.42
16
DETAIL A
INCHES
MIN
MAX
0.053
0.069
0.004
0.010
0.049
---0.008
0.012
0.007
0.010
0.193 BSC
0.237 BSC
0.154 BSC
0.025 BSC
0.009
0.020
0.016
0.050
0.010 BSC
0_
8_
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT
16X
H
DIM
A
A1
A2
b
c
D
E
E1
e
h
L
L2
M
XXXXX
YY
WW
G
= Specific Device Code
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb−Free indicator, “G”, may
or not be present.
DIMENSIONS: MILLIMETERS
98AON04472D
QSOP16
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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