R261

BelaSigna R261 Advance Information Advanced Noise Reduction Solution for Voice Capture Devices BelaSigna® R261 is a complete system−on−chip (SoC) solution that provides advanced dual−microphone noise reduction in voice capture applications such as laptops, mobile phones, webcams, tablet computers and other applications that will benefit from improved voice clarity. Featuring a novel approach to removing mechanical, stationary and non−stationary noise, the chip preserves voice naturalness for greater speech intelligibility even when the talker is further away or not optimally aligned with microphones providing unmatched freedom of movement for end−users. Designed to be compatible with a wide range of codecs, baseband chips and microphones without the need for calibration, BelaSigna R261 is easy to integrate, improving manufacturers’ speed to market. Additional features include the ability to customize multiple voice capture modes and tune the algorithm to the unique needs of a manufacturer’s device. The chip includes a highly optimized DSP−based application controller with industry−leading energy efficiency and is packaged in two highly compact 5.3 mm2 WLCSPs to fit into even the most sized−constrained architectures and allow the use of the cheapest printed circuit board design technologies. Key Features Introduction http://onsemi.com WLCSP−30 W SUFFIX CASE 567CT WLCSP−26 W SUFFIX CASE 567CY MARKING DIAGRAMS 1 BR261 W30 ALYW BR261 W30 W26 A L YW 1 BR261 W26 ALYW • • • • • • • • • • • • • • • • • Advanced Two−Microphone Noise Reduction Algorithm Preserves Voice Naturalness Supports Close−Talk and Far−Talk Conference Mode enables 360 Degrees Voice Pick−up Configurable Algorithm Performance Ultra Low Power Consumption Ultra Miniature Form Factor Complete System−on−Chip (SoC) Highly Flexible Clocking Architecture Hardware Configuration Interfaces Prototyping Tools These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Laptop Computers Mobile Phones Tablet PCs Webcams Any Portable Audio Application with Voice Pick−up = BelaSigna R261 = 30−ball version = 26−ball version = Assembly Location = Wafer Lot = Date Code Year & Week = Pb−Free Package = A1 Corner Indicator ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 28 of this data sheet. Typical Applications This document contains information on a new product. Specifications and information herein are subject to change without notice. © Semiconductor Components Industries, LLC, 2010 November, 2010 − Rev. P2 1 Publication Order Number: BR261/D BelaSigna R261 Table 1. ABSOLUTE MAXIMUM RATINGS Parameter Power Supply (Applies on VBAT, VBATRCVR and VDDO for “Max” and for VSSA, VSSRCVR and VSSD for “Min”) (Note 1) Digital input pin voltage Operating temperature range Storage temperature range Min −0.3 VSSA − 0.3 V −40 −40 Max 4.0 VDDO + 0.3 V 85 85 Unit V V °C °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Time limit at maximum voltage must be less than 100 ms. NOTE: Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. This device series incorporates ESD protection and is tested by the following methods: − ESD Human Body Model (HBM) tested per AEC−Q100−002 (EIA/JESD22−A114) − ESD Machine Model (MM) tested per AEC−Q100−003 (EIA/JESD22−A115) − ESD Charge Discharge Model (CDM) tested per ESD−STM 5−3−1−1999. This device series incorporates latch−up immunity and is tested in accordance with JESD78: Electrical Performance Specifications Table 2. ELECTRICAL CHARACTERISTICS (The typical parameters in Table 2 were measured at 20°C with a clean 3.3 V supply voltage (unless noted differently). Parameters marked as screened are tested on each chip. Other parameters are qualified for all process corners but not tested on every part.) Parameter OVERALL Supply voltage Maximum risetime Current consumption VBAT VBAT_RISE Between 0 V and 1.8 V 15 2.5 1.2 40 3 2 1.8 3.3 3.63 10 V ms mA mA mA mA Symbol Test Conditions / Notes Min Typ Max Unit Screened IBAT_ACTIVE Active mode, VBAT = 3.3 V IBAT_BPASS IBAT3_LOUT Bypass mode, VBAT = 3.3 V Lineout mode, VBAT = 3.3 V IBAT4_SLEEP Sleep mode, VBAT = 3.3 V VREG (1 mF External Capacitor) Output voltage PSRR Load regulation Load current Line regulation VREG VREG_PSRR Without load, or with microphone attached (0 to 200 mA) @ 1 kHz 0.95 54 1 1.05 V dB VREG_LdReg @ 2 mA VREG_ILoad VREG_LnReg 6 2 0.065 mV/mA mA mV/V VDDA (1 mF External Capacitor on VDDA + 100 nF External Capacitor on CAP0/CAP1) Output voltage PSRR Load regulation VDDA VDDA_PSRR Unloaded with VREG = 1 V @ 1 kHz 1.8 45 110 70 140 100 1 0.126 2 2.1 V dB mV/mA mV/mA mA mV/V VDDA_LdReg @ 1 mA, MCLK = 1.28 MHz @ 1 mA, MCLK = 2.56 MHz Load current Line regulation VDDD (1 mF External Capacitor) Output voltage VMIC Output voltage VDDA_ILoad VDDA_LnReg VDDD 1.62 1.8 1.98 V VMIC_VREG VMIC_VDDA VMIC = VREG VMIC = VDDA 0.98 1.95 1.0 1.98 1.01 2.01 V V http://onsemi.com 2 BelaSigna R261 Table 2. ELECTRICAL CHARACTERISTICS (continued) (The typical parameters in Table 2 were measured at 20°C with a clean Parameter VMIC Load Regulation VMIC_LdReg VMIC_LdReg Maximum Load Current VMIC_ILoad VMIC = VREG VMIC = VDDA VMIC = VREG VMIC = VDDA POWER ON RESET POR Threshold POR_THR_UP Active on VBAT POR_THR_DN Active on VBAT POR Duration INPUT STAGE Sampling frequency Analog input voltage SF Vin_AI1_3 Vin_MIC0_2 Preamplifier gain tolerance Input impedance Vin_Amp_Toll Vin_Rin Defined by ROM−based application. No preamp gain on AI1 and AI3 30 dB preamp gain by default on MIC0 and MIC2 1 kHz 0 dB preamplifier gain, MCLK = 1.28 MHz All other gain settings Line−Out Input offset voltage Vin_Offset Vin_Offset Channel cross coupling Analog Filter cut−off frequency Vin_Coupling AnaIF_FC1 AnaIF_FC2 Analog Filter passband flatness Analog filter stopband attenuation Digital Filter cut−off frequency Digital Filter cut−off stopband attenuation Total Harmonic Distortion + Noise (Peak value) Dynamic Range Equivalent Input Noise DIGITAL MICROPHONE OUTPUT DMIC input clock frequency DMIC_CLK1 DMIC_CLK2 With presets 0 or 5 selected on CONFIG_SEL With preset 1 selected on CONFIG_SEL 2.048 2.4 MHz MHz AnaIF_PB_F AnaIF_SB_A DigIF_FC DigIF_SB_A AI_THDN AI_DR EIN 30 dB preamplifier gain VBAT = 3.3 V 30 dB preamplifier gain VBAT = 3.3 V 30 dB preamplifier gain VBAT = 3.3 V 80 −64 −77 −68 −78 3.25 0 dB preamp gain All other gains Any 2 channels LPF enabled LPF disabled 10 50 −1 60 8 1 −84 20 0 0 −2 220 510 5.2 16 2 63.25 2 254 585 5.35 7 0.6 −60 30 kHz Vpp mVpp dB kW kW kW mV mV dB kHz kHz dB dB kHz dB dB dB mV POR_TIME 1.55 1.55 3.9 1.65 1.6 5.8 1.71 1.65 11.6 V V ms 40 146 2 1 mV/mA mV/mA mA mA Symbol Test Conditions / Notes Min Typ Max Unit 3.3 V supply voltage (unless noted differently). Parameters marked as screened are tested on each chip. Other parameters are qualified for all process corners but not tested on every part.) Screened http://onsemi.com 3 BelaSigna R261 Table 2. ELECTRICAL CHARACTERISTICS (continued) (The typical parameters in Table 2 were measured at 20°C with a clean Parameter DIGITAL MICROPHONE OUTPUT DMIC input clock frequency DMIC_CLK3 DMIC_CLK4 Clock duty cycle Input clock jitter Setup time Hold time ANALOG OUTPUT STAGE Signal Range AO_Range One single ended DAC used Two DACs used as one differential output Attenuator gain tolerance Output impedance Vout_Att_Tol AO_Rout @ 12 dB output attenuation @ 0 dB output attenuation Channel cross coupling Analog Filter cut−off frequency AO_Coupling AnaOF_FC1 LPF Enabled LPF Disabled Analog Filter passband flatness Analog filter stopband attenuation Digital Filter cut−off frequency Digital Filter cut−off stopband attenuation Total Harmonic Distortion + Noise (Peak value) Dynamic Range NoiseFloor AnaOF_PB_F AnaOF_SB_A > 60 kHz DigOF_FC DigOF_SB_A AO_THDN AO_DR AO_NF 80 −64 −80 −68 −82 100 13 25 −1 90 8 0 0 −2 2 4 2 16 3 −65 13.5 26 1 Vpp Vpp dB kW kW dB kHz kHz dB dB kHz dB dB dB mV DMIC_DC With preset 3 elected on CONFIG_SEL With preset 2 selected on CONFIG_SEL Any clock configuration 40 2.8 3.072 50 60 10 0.5 10 1.5 100 MHz MHz % ns SYSCLK cycles ns Symbol Test Conditions / Notes Min Typ Max Unit 3.3 V supply voltage (unless noted differently). Parameters marked as screened are tested on each chip. Other parameters are qualified for all process corners but not tested on every part.) Screened DMIC_JITTER Maximum allowed jitter on the DMIC_CLK DMIC_SETUP DMIC_OUT setup time relative to DMIC_CLK edge DMIC_HOLD DMIC_OUT hold time relative to DMIC_CLK edge DIRECT DIGITAL OUTPUT (available only through custom mode) Supply voltage Signal Range VBATRCVR RCVR_Range One Differential Output Driver used @ 1 kHz Single ended Output Driver used @ 1 kHz Output Impedance Maximum Current Total Harmonic Distortion + Noise (Peak value) Dynamic Range NoiseFloor RCVR_Rout RCVR_IMax RCVR_THDN RCVR_DR RCVR_NF −70 −85 −71 −86 73 Load between 1 mA and 30 mA 1.8 0 0 3 3.3 3.63 2*VBAT RCVR VBATRC VR 4 90 V Vpp Vpp W mA dB dB mV http://onsemi.com 4 BelaSigna R261 Table 2. ELECTRICAL CHARACTERISTICS (continued) (The typical parameters in Table 2 were measured at 20°C with a clean Parameter LOW−SPEED A/D Input voltage Sampling frequency Input impedance Offset error Gain error INL DNL DIGITAL PADS (VDDO = 1.8 V) Voltage level for Low input Voltage level for High input Pull−up resistance Pull−down resistance Rise and Fall Time DIGITAL PADS (VDDO = 3.3 V) Voltage level for Low input Voltage level for High input Pull−up resistance Pull−down resistance Rise and Fall Time VIL_3V3 VIH_3V3 Rup_3V3 Rdn_3V3 Trf_3V3 20 pF load −0.3 1.8 33 87 1 46 153 1.5 0.8 3.6 61 215 2 V V kW kW ns VIL_1V8 VIH_1V8 Rup_1V8 Rdn_1V8 Trf_1V8 20 pF load −0.3 1.3 63 87 2 114 153 3 0.4 1.98 162 215 5 V V kW kW ns LSAD_Vin LSAD_SF LSAD_RIN LSAD_O_Err LSAD_G_Err LSAD_INL LSAD_DNL Input at VREG Input at VREG For each LSAD channel, MCLK = 1.28 MHz 0 0.5 100 −7 −6 −4 −1 1.6 1 4 108 5 6 4 1.6 V kHz kW LSB LSB LSB LSB Symbol Test Conditions / Notes Min Typ Max Unit 3.3 V supply voltage (unless noted differently). Parameters marked as screened are tested on each chip. Other parameters are qualified for all process corners but not tested on every part.) Screened DIGITAL PADS (Common parameters) Drive Strength ESD PAD_DR PAD_HBM PAD_MM PAD_CDM Latch−up CLOCKING CIRCUITRY External clock frequency EXT_CLK1 EXT_CLK2 Reference clock duty cycle External Input clock jitter I2C INTERFACE Maximum speed I2C_SPEED In Sleep mode All other modes 100 400 kbps kbps EXT_CLK_DC EXT_CLK_JT Maximum allowed jitter on EXT_CLK With presets 6 selected on CONFIG_SEL (Note 2) With presets 4 or 7 selected on CONFIG_SEL (Note 2) 40 19.2 26 50 60 10 MHz MHz % ns PAD_LU Human Body Model Machine Model Charge Discharge Model 25°C, V < GNDO, V > VDDO 2 200 500 100 12 mA kV V V mA 2. Many other clock frequencies are available through custom configuration of the internal PLL and clocking subsystem. See later in this document and in the BelaSigna R261 Configuration and Communications Guide for more information on custom mode usage. http://onsemi.com 5 BelaSigna R261 Table 3. PIN CONNECTIONS Pin Index G1 E5* E1 E3 D6* E7 G7 F8 A1 B2 F2 A3 A7 A9 B8 C9 C7 C5* C3 C1 D4* F6 G9 G5 B6 B4 G3 F4 A5 E9 Pin Name MIC0 AI1/LOUT1 MIC2 AI3/VMIC/LOUT0 A_OUT0 A_OUT1 CAP0 CAP1 DEBUG_RX DEBUG_TX RESERVED EXT_CLK SPI_CLK/CONFIG_SEL SPI_CS/ATT_SEL SPI_SERO/ALGO_CTRL SPI_SERI/SLEEP_CTRL DMIC_OUT BOOT_SEL I2C_SDA I2C_SCL NRESET VBAT VBATRCVR VDDA VDDD VDDO VREG VSSA VSSD VSSRCVR Description First microphone input Direct audio input / line−out preamp 1 Second microphone input Direct audio input / microphone bias / line−out preamp 0 Audio output 0 Audio output 1 Charge pump capacitor connection Charge pump capacitor connection RS232 debug port serial input RS232 debug port serial output connect to VSSA External clock input SPI clock / Configuration selection SPI chip select / Attenuation selection SPI serial output / Algorithm control SPI serial input / Sleep mode control Digital microphone output Boot selector I2C data I2C clock Reset Power supply Output driver power supply Analog supply voltage Digital power supply Digital I/O power supply Analog supply voltage Analog ground Digital ground Output driver ground D D/A D/A D/D D D D D D D P P P P P P P P P I O/I O/I O/I I/I O I I/O I/O I I I O O I O I I I L U U U U −/U U/U U A/D/P A A A A A A A A D D I/O I I/O I I/O O O I/O I/O I O L L U Active Pull * Pins C5, D4, D6 and E5 are not available on the WLCSP26 package. All pins are available on the WLCSP30 package. http://onsemi.com 6 BelaSigna R261 Application Diagrams VDDO VREG 2.2 kW Microphone 0 Microphone 2 10 nF MIC0 MIC2 AI1/LOUT1 Preamps Decimation A/D MUX VDDA Two−Microphone Noise Reduction (BSE) DSP−Based Application Controller Custom Mode Handler Boot Selection I2C Command Handler Mode Switching Algorithm Control Sleep Mode Control H/W Config Selection System Monitoring DMIC_OUT ALGO_CTRL** SLEEP_CTRL** I2C_SDA I2C_SCL EXT_CLK NRESET CONFIG_SEL** ATT_SEL** Optional EEPROM (16 kbit) SPI_CLK** SPI_SERI** SPI_SERO** DEBUG_RX DEBUG_TX BOOT_SEL SPI UART PCM/I2S Debug Port Timers Interrupt Controller Algorithm Protection VSSRCVR VSSA GPIO I2C PLL and Clock Detection Power Mgt LSAD BelaSigna R261 RESERVED VSSD CAP0 CAP1 AGND VSSD VREG AGND ** Multiplexed with other functionalities 100 nF Figure 1. Typical Application Diagram for 30−ball WLCSP Package Option http://onsemi.com 7 Laptop Codec or Baseband Chip VREG AI3/VMIC/LOUT0 SPI_CS** A/D Interpolation Ch0 Output Driver0 D/A Ch1 D/A DMIC VDDD VBAT VSSA VSSA VBATRCVR 1.8 V − 3.3 V Note: VDDA or VREG + − can also be used VMIC** 1 mF 1 mF 1 mF 4.7 mF 1 mF 1 mF VSSA VSSRCVR VSSD VSSD A_OUT0 A_OUT1 BelaSigna R261 Application Diagrams VREG VDDO VSSA 2.2 kW Microphone 0 Microphone 1 AI3/VMIC/LOUT0 Optional EEPROM (16 kbit) SPI_CS** SPI_CLK** SPI_SERI** SPI_SERO** 10 nF MIC0 MIC2 VBAT VSSA VBATRCVR VREG (1V) or VDDA (2V) Depends on microphone 1 mF 1 mF 1 mF VSSA VDDA 1 mF VSSD 1 mF VSSD VDDD Preamps Decimation A/D MUX Interpolation Two−Microphone Noise Reduction (BSE) DSP−Based Application Controller Custom Mode Handler Boot Selection I2C Command Handler Mode Switching Algorithm Control Sleep Mode Control H/W Config Selection System Monitoring Ch0 Output Driver0 Ch1 D/A DMIC Connector DMIC_OUT ALGO_CTRL** GPIO I2C PLL and Clock Detection Power Mgt CONFIG_SEL** LSAD BelaSigna R261−W26 RESERVED ATT_SEL** AGND ** Multiplexed with other functionalities VREG SLEEP_CTRL** I2C_SDA I2C_SCL EXT_CLK Test Points A_OUT1 3.3 V A/D DMIC SPI UART VDDO DEBUG_RX DEBUG_TX PCM/I2S Debug Port Timers Interrupt Controller Algorithm Protection VSSRCVR VSSA VSSD VSSD Figure 2. Typical Application Diagram for 26−ball WLCSP Package Option http://onsemi.com 8 CAP0 100 nF CAP1 BelaSigna R261 Applications Information Recommended Circuit Design Guidelines Recommended Ground Design Strategy BelaSigna R261 is designed to allow both digital and analog processing in a single system. Due to the mixed−signal nature of this system, careful design of the printed circuit board (PCB) layout is critical to maintain the high audio fidelity of BelaSigna R261. To avoid coupling noise into the audio signal path, keep the digital traces away from the analog traces. To avoid electrical feedback coupling, isolate the input traces from the output traces. 1.8 V − 3.3 V The ground plane should be partitioned into two parts: the analog ground plane (VSSA) and the digital ground plane (VSSD). These two planes should be connected together at a single point, known as the star point. The star point should be located at the ground terminal of a capacitor on the output of the power regulator as illustrated in Figure 3. LDO VBAT VBATRCVR BelaSigna R261 VDDA VREG VDDO VDDD + Battery VSSA VSSD VSSRCVR Analog Ground Plane (place under analog side of BR261) Digital Ground Plane (keep away from analog ground place) System Ground Plane VSSRCVR Ground (route separately to system ground plane) Figure 3. Schematic of Ground Scheme http://onsemi.com 9 BelaSigna R261 Analog Ground Plane G G1 = MIC0 E1 = MIC2 F2 = RESERVED G3 = VREG E3 = VMIC F4 = VSSA D4 = NRESET G5 = VDDA E5 = AI1 F6 = VBAT D6 = A_OUT0 G7 = CAP0 E7 = A_OUT1 F8 = CAP1 G9 = VBATRCVR E9 = VSSRCVR F E D C B A C1 = I2C_SCL A1 = DEBUG_RX B2 = DEBUG_TX C3 = I2C_SDA A3 = EXT_CLK B4 = VDDO C5 = BOOT_SEL A5 = VSSD B6 = VDDD C7 = DMIC_OUT A7 = SPI_CLK CONFIG_SEL B8 = SPI_SERO ALGO_CTRL A9 C9 = SPI_SERI SLEEP_CTRL A9 = SPI_CS ATT_SEL Digital Ground Plane 1 G1 E1 C1 A1 2 F2 B2 3 G3 E3 C3 A3 4 F4 D4 B4 5 G5 E5 C5 A5 6 F6 D6 B6 7 G7 E7 C7 A7 8 F8 B8 9 G9 E9 C9 Figure 4. Analog Portion of BelaSigna R261 (Bumps facing up) The VSSD plane is used as the ground return for digital circuits and should be placed under digital circuits. The VSSA plane should be kept as noise−free as possible. It is used as the ground return for analog circuits and it should surround analog components and pins. It should not be connected to or placed under any noisy circuits such as RF chips, switching supplies or digital pads of BelaSigna R261 itself. Analog ground returns associated with the audio output stage should connect back to the star point on separate individual traces. For details on which signals require special design consideration, see Table 4 and Table 5. In some designs, space constraints may make separate ground planes impractical. In this case a star configuration strategy should be used. Each analog ground return should connect to the star point with separate traces. Internal Power Supplies Power management circuitry in BelaSigna R261 generates separate digital (VDDD) and analog (VREG, VDDA) regulated supplies. Each supply requires an external decoupling capacitor, even if the supply is not used externally. Decoupling capacitors should be placed as close as possible to the power pads. The digital I/O levels are defined by a separate power supply pin on BelaSigna R261 (VDDO). This pin must be externally connected by the application PCB, usually to VBAT. Note that the voltage on VDDO will influence the behavior of the LSAD dividers. The system is designed with the assumption that a 3.3 V power supply voltage is provided on VBAT, and that VDDO connects to VBAT on the application PCB. Further details on these critical signals are provided in Table 4. Non−critical signals are outlined in Table 5. More information on the power supply architecture can be found in the Power Supply Unit section. http://onsemi.com 10 BelaSigna R261 Table 4. CRITICAL SIGNALS Pin Name VBAT VREG, VDDA Description Power supply Internal regulator for analog blocks Connection Guidelines Place 1 mF (min) decoupling capacitor close to pin Connect negative terminal of capacitor to analog ground plane Place separate 1 mF decoupling capacitors close to each pin Connect negative capacitor terminal to analog ground plane Keep away from digital traces and output traces VREG and VDDA may be used to generate microphone bias Connect to analog ground plane Place 1 mF decoupling capacitor close to pin Connect negative terminal of capacitor to VSSD Connect to digital ground plane Place 1 mF decoupling capacitor close to pin Connect to VBAT, unless the pad ring must use different voltage levels Keep traces as short as possible Keep away from all digital traces and audio outputs Avoid routing in parallel with other traces Keep away from audio inputs Differential traces should be of approximately the same length Ideally, route lines parallel to each other Connect to star ground point Keep away from all analog audio inputs Minimize trace length Keep away from analog signals If possible, surround with digital ground Minimize trace length Keep away from analog signals If possible, surround with digital ground VSSA VDDD VSSD VDDO MIC0, MIC2, AI1/LOUT1, AI3/VMIC/LOUT0 A_OUT0, A_OUT1 Analog ground return Internal regulator for digital core Digital ground return Digital I/O power Audio inputs / Microphone bias Audio outputs VSSRCVR EXT_CLK Output stage ground return External clock input DMIC_OUT Digital Microphone Output http://onsemi.com 11 BelaSigna R261 Table 5. NON−CRITICAL SIGNALS Pin Name CAP0, CAP1 I2C_SDA, I2C_SCL ALGO_CTRL, SLEEP_CTRL CONFIG_SEL, ATT_SEL BOOT_SEL SPI_CLK, SPI_CS, SPI_SERO, SPI_SERI NRESET DEBUG_RX, DEBUG_TX RESERVED VBATRCVR Description Internal charge pump − capacitor connection I2C port Control GPIOs (Multiplexed with SPI port) Low−speed A/D converters (Multiplexed with SPI port) Control GPIO Serial peripheral interface port (Multiplexed with LSAD and GPIOs) Reset Debug Port Reserved pin Output driver power supply Connection Guidelines Place 100 nF capacitor very close to pins Keep as short as possible. Place pull−up resistors (10 k) to VDDO Not critical when used as GPIO Not critical when used as LSAD Not critical Keep away from analog input lines when used as SPI signals Not critical Leave unconnected if unused Not critical If possible, connect to test points Leave unconnected If the output driver is being used: − Place a separate 4.7 mF (min. 2.2 mF) decoupling capacitor close to pin − Connect positive terminal of capacitor to VBAT & VBATRCVR − Connect negative terminal of capacitor to VSSRCVR If the analog outputs or the DMIC output are being used: − Decoupling capacitor is not required − Connect VBATRCVR to VDDA Audio Inputs The audio input traces should be as short as possible. The input impedance of each audio input pad (e.g., MIC0, AI1, MIC2, AI3) is high (approximately 500 kW with PAs enabled); therefore a 10 nF capacitor is sufficient to decouple the DC bias. This capacitor and the internal resistance form a first−order analog high pass filter whose cut−off frequency can be calculated by f3dB (Hz) = 1/(R x C x 2π), which results in ~30 Hz for a 10 nF capacitor. This 10 nF capacitor value applies when the preamplifier is being used, in other words, when a non−unity gain is applied to the signals; for MIC0 and MIC2, the preamplifier is enabled by the ROM−based application. When the preamplifier is by−passed, the impedance is reduced; hence, the cut−off frequency of the resulting high−pass filter could be too high. In such a case, the use of a 30−40 nF serial capacitor is recommended. In cases where line−level analog inputs without DC bias are used, the capacitor may be omitted for transparent bass response. ON Semiconductor recommends avoiding SMT capacitors with X7R dielectric, as it is known to be microphonic, sensitive to temperature and increase THD. NPO or COG dielectric capacitors have demonstrated good performance. BelaSigna R261 provides a microphone power supply (VMIC) and ground (VSSA). In case VMIC cannot be used for PCB routing issues, the power supplies VREG (1.0 V) or VDDA (2.0 V) can alternatively be used. Keep audio input traces strictly away from output traces. Audio outputs must be kept away from microphone inputs to avoid cross−coupling. Audio Outputs The audio output traces should be as short as possible. The trace length of the two signals should be approximately the same to provide matched impedances. Recommendation for Unused Pins Table 6 shows the connection details for each pin when they are not used. Table 6. UNUSED PIN RECOMMENDATIONS Signal Name A_OUT0 A_OUT1 AI3/VMIC/LOUT0 Connection Guidelines Do not connect Do not connect Do not connect when configured as VMIC (default) Connect to VSSA otherwise Connect to VSSA Do not connect Do not connect Do not connect Do not connect AI1/LOUT1 DMIC_OUT SPI_SERO/ALGO_CTRL SPI_SERI/SLEEP_CTRL NRESET http://onsemi.com 12 BelaSigna R261 Architecture Detailed Information The architecture of BelaSigna R261 is shown in Figure 5. Interpolation Preamps MUX A/D A/D Decimation Two−Microphone Noise Reduction (BSE) DSP−Based Application Controller Custom Mode Handler Ch0 Output Driver0 D/A Ch1 D/A DMIC SPI Algorithm Control GPIO UART PCM/I2S Debug Port Timers Interrupt Controller Algorithm Protection Mode Switching System Monitoring LSAD BelaSigna R261 I2C Command Handler H/W Config Selection Boot Selection Sleep Mode Control I2C PLL and Clock Detection Power Mgt Figure 5. BelaSigna R261 Architecture: A Complete Audio Processing System Two−Microphone Noise Reduction System Blind Speech Extraction (BSE) from Exaudio AB Algorithm Modes BelaSigna R261 contains the BSE algorithm inside its ROM memory. Exaudio offers a unique solution to the problem of blindly extracting wave propagating signals using one or more sensors without having any prior knowledge about source’s or sensor’s positions. The solution operates simultaneously in the frequency, temporal and the spatial domain using one global optimization criterion, with no constraints on the number of sources vs. the number of sensors. The solution is Signal−to−Noise Ratio (SNR) independent, meaning that it operates optimally in both low SNR as in high SNR environments and at the same time it performs de−reverberation of the received signals. The solution is ideal for electronic communication devices such as mobile phones and portable computers where it is desired to extract useful speech signals hidden in various noise fields. The flexibility offered by Exaudio’s solution allows for flexible microphone positioning and arbitrary placement of the self adaptive device in the actual environment. The noise reduction algorithm built into BelaSigna R261 has two algorithm modes called Algorithm Mode 0 and Algorithm Mode 1. Algorithm Mode 0 is optimized for far−talk applications where the end user can be very far from the microphones (up to 6 meters) such as laptops or speakerphones (including cell phones in a speakerphone mode). This algorithm mode is also known as “Conference Mode”. Algorithm Mode 1 is optimized for close−talk applications where the end user is close to the microphones (< 5 cm) such as telephony handset (including cell phones in a handset mode). A Custom Algorithm Mode is also available in BelaSigna R261; it allows supporting special configurations and tuning by loading new algorithm parameters via an external EEPROM or the I2C control interface. The algorithm performance can be optimized for specific applications, microphones types and positioning as well as other system parameters via this mechanism. For additional details on the custom mode handler and algorithm performance tuning options, please refer to “BelaSigna R261 Configuration & Communications Guide.” http://onsemi.com 13 BelaSigna R261 Microphone Placement & Selection The flexibility of the BelaSigna R261 ROM−based noise reduction algorithm offers a variety of possible microphone placements, but the default algorithm will operate optimally when the microphones are placed in the following configuration: • The two microphones are facing the user’s mouth • The microphone centers are located within 10 to 25 mm from each other As mentioned, other configurations that differ from the above guidelines can be supported through the use of the custom mode, as described earlier. BelaSigna R261 does not require any acoustic microphone calibration procedure. The selection of the microphones should be made in cooperation with ON Semiconductor, such as the built−in algorithm can operate seamlessly. The following guidelines can be used for a pre−selection: • Two omni−directional microphones with similar characteristics should be used Table 7. OPERATING MODES SUMMARY Operating Mode Active Switching Active mode is the default operating mode. The chip normally enters Active mode upon boot−up and when exiting Sleep mode. Active mode can also be entered via I2C from another mode. Bypass mode can only be entered via an I2C command. • The microphone sensitivity should be −42 dB (where • The microphones are two terminal microphones • The microphone power supply is either 1 V, or 2 V if it • 0 dB = 1 V/Pa, at 1 kHz) • has to be provided by BelaSigna R261 The dynamic range of BelaSigna R261 on its analog input channels is 2.0 V peak−to−peak, after amplification by the default gain value of 30 dB using BelaSigna R261’s input preamplifiers When higher sensitivity microphones have to be used, the preamp gain will be adjustable to match the 2.0 Vpp input voltage swing on BelaSigna R261, but this will require a custom tuning operation, as described later. Operating Modes The default application in ROM on BelaSigna R261 has five Operating Modes. The Operating Modes are summarized in Table 7. Description In Active mode, the two−microphone noise reduction algorithm is executed on the audio inputs and both the processed and unprocessed signals are sent to the audio outputs. In Bypass mode, no signal processing is done on the audio inputs. The inputs are passed directly to the audio outputs. While in Bypass mode, BelaSigna R261 collects statistics on the input signals that can be retrieved via I2C. These signal statistics can be used for level calibration and other debugging. For more information using Bypass mode for calibration and debugging see the “BelaSigna R261 Configuration and Communications Guide” Bypass Line−Out Line−Out mode can only be entered via an I2C command. In Line−Out mode, no signal processing or digital processing of the audio inputs is done. The analog signals from the input stage preamplifiers are routed back via the lineout pins (LOUT0 and LOUT1). When in this mode, BelaSigna R261 runs off an internal clock source, thereby allowing the external clock to be disabled. Note that LOUT1 is not available on the 26−ball WLCSP package. In Sleep mode no signal processing is done. All analog blocks of the chip are disabled and the digital core continues to run off an internal low−speed oscillator, thereby allowing the external clock to be disabled when the chip is asleep. This is BelaSigna R261’s lowest power operating mode. Sleep Sleep mode can be entered via I2C commands or by using the SLEEP_CTRL pin. When Sleep mode is entered via I2C, the chip will exit Sleep mode only based on activity on the I2C_SCL pin. When put to Sleep mode via the SLEEP_CTRL pin, the chip will exit Sleep mode only when the SLEEP_CTRL pin is toggled again. Sleep mode will be automatically entered if BelaSigna R261 detects that a required external clock is no longer present. For more information, see the Sleep Control section below. Stand−By Stand−By mode is an intermediate mode that is only used when exiting sleep mode by an I2C command. When I2C is used to exit Sleep mode, the application will transition to Stand−By mode, and will wait until the master I2C device issues a Switch_Mode command to enter another processing mode like Active, Bypass or Line−Out. http://onsemi.com 14 BelaSigna R261 Digital Control, Hardware Configuration and Interfaces Boot Control At power−on−reset, BelaSigna R261 will normally execute the application stored in ROM with the default hardware and algorithm configuration. Additional built−in hardware and algorithm configuration options are available as described later in this section by using the CONFIG_SEL and ATT_SEL pins. These settings are selected at boot−time based on the pin voltage levels. Table 8. BOOT CONTROL OPTIONS Boot Method EEPROM Boot (Automatic boot selection) Condition BOOT_SEL high (or floating/not available on package) The BOOT_SEL pin controls the booting method of BelaSigna R261. There are in fact two alternate methods to boot a custom application or hardware/algorithm configuration. These methods, along with the default boot method, are described in Table 9. Note that the BOOT_SEL pin is not available on the WLCSP−26 package option, consequently, this signal is left floating and the automatic boot selection described below applies for all applications using this reduced ball package variant. Description Enables SPI interface and attempts to boot from external EEPROM. EEPROM may contain a custom application or configuration. If no EEPROM, or bad content, loads the default application in ROM with hardware and algorithm configuration determined by CONFIG_SEL and ATT_SEL pins. See the “BelaSigna R261 Configuration and Communications Guide” for more information. Loads default application in ROM. Hardware and algorithm configuration determined by CONFIG_SEL and ATT_SEL pins. The I2C control interface can be used to download a custom application, or to re−configure the default application. See the “BelaSigna R261 Configuration and Communications Guide” for more information. LSAD Boot I2C Boot BOOT_SEL low Connect to BelaSigna R261 via I2C after default boot−up When the automatic boot selection process is being used, either when selecting the 26−ball package version, or simply when leaving the BOOT_SEL pin unconnected on the application PCB, it is very important to ensure that the SPI pins will not be driven by any external hardware component. Typically, a custom application may want to use the PCM interface, which is also multiplexed with the SPI port. Extreme care must be taken in such use cases, to ensure that the SPI ports remain at high impedance during the boot process. Contact your local technical support for more information on this particular use case. Reset at least 100 ns. Note: NRESET is not available on the 26−ball WLCSP package. Algorithm Control BelaSigna R261 can be forced to execute a power−on−reset by pulling the NRESET pin to ground for 10 ms (min) ALGO_CTRL BelaSigna R261 has provisions to control whether the noise reduction algorithm processed signal is output, or an unprocessed signal is output. This effectively enables or disables the algorithm. The algorithm can be controlled via the I2C interface or by use of the ALGO_CTRL pin. When using the ALGO_CTRL pin, the algorithm state is toggled whenever the digital signal transitions to low and stays low for at least 10 ms, as shown in Figure 6. The actual transition between algorithm enable/disable states can occur at any time during the 10 ms low period of the signal. 10 ms (min) Algorithm State Enabled Disabled Enabled Figure 6. ALGO_CTRL Timing Diagram BelaSigna R261 has two processing channels (Channel 0 and Channel 1), when the noise reduction algorithm is enabled, Channel 0 contains the processed signal and Channel 1 contains the unprocessed signal. The effect of toggling the algorithm state is to swap Channel 0 and Channel 1, i.e. disabling the algorithm causes Channel 0 to contain the unprocessed signal and Channel 1 to contain the processed signal. These two output channels represent the internal DSP output signals with BelaSigna R261. The DMIC and analog audio outputs can each be configured to use either channel. See the Output stage section to see how Channel 0 and Channel 1 are used by the various configuration options of BelaSigna R261’s output stage. Sleep Control As described in the modes of operation, there are multiple methods to enter and exit from Sleep mode. Each of these methods is meant to be used independently, i.e. methods of http://onsemi.com 15 BelaSigna R261 putting the system into Sleep mode and waking it up from Sleep mode cannot be mixed in the same system design. The first Sleep mode control mechanism is the SLEEP_CTRL pin. When using SLEEP_CTRL, the application will transition into or out of Sleep mode whenever the digital signal transitions to low and stays low for at least 20 ms, as shown in Figure 7. The actual transition between modes can occur at any time during the 20 ms low 20 ms (min) SLEEP_CTRL period of the signal. When SLEEP_CTRL is used to put the chip into Sleep mode, only another high−to−low transition on SLEEP_CTRL or a reset will take the system out of Sleep mode. The operating mode after exiting Sleep mode using the SLEEP_CTRL mechanism is always the same as it was before entering Sleep mode (Active mode in the case of Figure 7). 20 ms (min) Operating Mode Active Sleep Active Figure 7. SLEEP_CTRL Timing Example The second method for Sleep mode control is via the I2C interface. The Switch_Mode command can be used directly to switch the system into and out of Sleep mode. If the Switch_Mode command is used to put the chip into Sleep mode, only another Switch_Mode command or a reset will take the system out of Sleep mode. When waking−up by I2C commands, the following I2C operations have to be performed by the master I2C to ensure proper wake−up: 1. Send a NOP command to wake up the I2C interface. This command will not be interpreted by BelaSigna R261, so the master will have to deal with any I2C errors that result. 2. Send the Get_Status command in a while−type loop, until a response from BelaSigna R261 is sent, and that confirms that the application is in Standby Mode. 3. Send a Switch_Mode command to enter the desired mode (Active, Bypass or Line−Out). When the NOP command is sent and the chip wakes up, the master has about one second to complete the above procedure before the chip goes back to Sleep mode. This mechanism was put in place to deal with I2C bus traffic that would wake the chip up unintentionally (i.e. communications between the master and another slave on the I2C bus). The final mechanisms for entering Sleep mode are considered fail safes to maintain a graceful system shutdown in the case of invalid operating conditions which could be that the clock source suddenly stopped. Under this circumstance, the chip will enter sleep mode to ensure proper shutdown. More information on this can be found in the system monitoring section. The SLEEP_CTRL pin must not be used when the automatic boot selection method is being used, as described in Table 9, as BelaSigna R261 will start by searching for an SPI EEPROM on the multiplexed pins. Consequently, the SLEEP_CTRL pin must stay unconnected in this mode. Other mechanisms for controlling sleep mode have to be used in such cases. This limitation is always there with the 26−ball WLCSP package of BelaSigna R261, since the BOOT_SEL pin is not available, and hence is always floating. Clocking, Output Stage & Algorithm Configuration As mentioned in the Boot Control section, BelaSigna R261 can be controlled by hardware configuration when no EEPROM is present on the application, or when the BOOT_SEL signal was tied low. The CONFIG_SEL signal is sampled by BelaSigna R261 during its booting process using a low−speed A/D converter (LSAD). Based on the actual voltage that the chip will read on this pin, it will automatically select a particular clock, output stage and algorithm configuration, as described in Table 9: http://onsemi.com 16 BelaSigna R261 Table 9. CLOCKING, OUTPUT STAGE AND ALGORITHM CONFIGURATION OPTIONS Voltage Range (V) Clock, Output Stage & Algorithm Configuration External Clock Frequency (MHz) 2.048 2.4 3.072 2.8 19.2 26 Output Stage Configuration DMIC Stereo Analog Mono X X Mode0 X X Mode0 X X Mode0 Far−Talk X X Mode0 X Mode0 X X X Mode1 X Mode1 Close−Talk X Mode1 0 (High) 0.93−1.00 X X X X X X 1 0.79−0.91 2 0.65−0.77 3 0.50−0.63 4 0.36−0.49 5 0.22−0.35 X 6 0.08−0.21 7 (Low) 0 − 0.07 Algorithm Mode http://onsemi.com 17 BelaSigna R261 The use of a resistive divider, as shown in Figure 8, allows the application schematic to select the appropriate combination of clock, output stage and algorithm mode. The LSAD is using a voltage range between 0 and 1 V. The actual VREG voltage levels that need to be guaranteed by the application schematic are also mentioned in Figure 8. The figure proposes actual resistor values to reach the eight different presets. Preset R1 10 kW 16 kW 39 kW 75 kW 100 kW 100 kW 100 kW − R2 − 100 kW 100 kW 100 kW 75 kW 39 kW 16 kW 10 kW Voltage Range 0.93 − 1.00 V 0.79 − 0.91 V 0.65 − 0.77 V 0.50 − 0.63 V 0.36 − 0.49 V 0.22 − 0.35 V 0.08 − 0.21 V 0 − 0.07 V R1 0 1 CONFIG_SEL R2 2 3 4 5 Figure 8. Resistive Dividers for LSAD Preset Selection 6 7 It is important to note that the configuration is only read by the chip at boot time, and consequently, it will not be dynamically updated. So if the voltage on the CONFIG_SEL is changing during operation, it will only have an impact at the next reboot operation. Analog Output Attenuation Control The hardware configuration method described above, using an LSAD and a resistive divider is also being used on another signal called ATT_SEL, such that the application Table 10. OUTPUT ATTENUATION CONTROL OPTIONS schematic can select an analog output attenuation to be applied on the analog output signals. Typically, when interfacing BelaSigna R261 with a baseband chipset in a cell phone application, it is very often required to match the amplitude of the output signals to the input range requirements of the baseband processor. Table 10 describes the available values, and their corresponding preset. The resistive dividers described in Figure 8 can also be used to configure the ATT_SEL pin. Voltage Range ATT_SEL: Analog Output Attenuation Select Output Attenuation (Ch0 & Ch1) 0 (High) 0.93−1.00 0 dB 1 0.79−0.91 12 dB 2 0.65−0.77 15 dB 3 0.50−0.63 18 dB 4 0.36−0.49 21 dB 5 0.22−0.35 24 dB 6 0.08−0.21 27 dB 7 (Low) 0 − 0.07 30 dB The BelaSigna R261 ROM application contains an I2C based command and control interface, allowing many aspects of the chip’s operation and hardware configuration to be controlled via I2C. This I2C interface is the recommended way to control the chip and to configure the application at run−time. The default I2C address of BelaSigna R261 is 0x61. The I2C interface protocol is fully supported by the SignaKlara Device Utility (SKDU). For more information on the I2C interface, please refer to the I2C interface section of this document, and to the “BelaSigna R261 Configuration and Communications Guide.” System Monitoring I2C Command Handler system reset will occur. System sanity is also monitored by the clock detection mechanism; the chip will automatically enter Sleep mode if it is in Active or Bypass mode and detects that the external clock source (the signal on EXT_CLK) is stopped. In this case, the system will only exit Sleep mode when it detects that the external clock source has been restored or a reset occurs. The power supply blocks of the system also monitor for minimum supply voltages as part of the power supervision strategy, as described in the Power Management section. Analog Blocks Input Stage The application software within BelaSigna R261 is equipped with a few blocks that monitor system sanity. A watchdog timer is used to ensure proper execution of the signal processing application. It is always active and is periodically acknowledged as a check that the application is still running. Once the watchdog times out, a hardware The BelaSigna R261 analog audio input stage is shown in Figure 9. The input stage is comprised of two individual channels. There are four configurable aspects of each channel – input multiplexing, preamplifier gain, filtering and lineout. The input multiplexing allows one input to be selected from any of the four possible input and then routed to the inputs of the preamplifier. Each preamplifier can be http://onsemi.com 18 BelaSigna R261 configured for bypass or gain values of 12 to 30 dB in 3 dB steps. The filters can be configured as well; the DC removal high−pass filter can be bypassed, or set to a cut−off frequency of 5 Hz, 10 Hz or 20 Hz (default). The low−pass filter can be either enabled with a 20 kHz cut−off frequency (default), or bypassed. The lineout selection allows the preamplifier outputs to be routed back out via the auxiliary audio input pins. Note that the AI1/LOUT1 pin is not available on the WLCSP−26 package option. Two oversampled 16−bit sigma−delta analog−to−digital converters then convert the analog signals into the digital domain. The ADCs are running at a sampling rate of 16 kHz in both Bypass and Active mode. The sampling rate can potentially be changed using the I2C interface. Changing the sampling rate in Active mode will cause the noise cancellation algorithm to stop operating properly, so this should not be done; however, the sampling rate in Bypass mode could potentially be changed to other values. Contact your local technical support for more information. Input signal amplitudes can also be adjusted in the digital domain; digital gain for both converted signals can be adjusted by using I2C commands. The ROM−based application pre−configures all these parameters in the input stage such that the algorithm operates properly. These parameters can be changed using the I2C interface, but extreme care should be taken when doing so, as this could alter the performance of the algorithm. The AI3 pin is multiplexed with the microphone power supply. The default mode for the microphone bias is to be used as a 2 V power supply. Consequently, any application that plans to use the AI3 input pin or the LOUT0 functionality has to change the VMIC settings to high-impedance mode, such as the pin can be properly used as an analog input or a line-out. MIC0 AI1/LOUT1 MIC2 AI3/VMIC/LOUT0 Line out M U X PA1 LPF1 M U X PA0 LPF0 ADC0 Decimation Filter Input Stage Channel 0 To IOP ADC1 Decimation Filter Input Stage Channel 1 Digital To IOP Line out Analog Figure 9. Input Stage Output Stage At all times, the application will produce two output channels. The content of each channel is determined by the state of the algorithm enable/disable bit, as explained in the Algorithm Control section. When the algorithm is enabled, Channel 0 will contain the processed signal and Channel 1 will contain the un−processed signal. Toggling the algorithm bit will swap these two channels. These two output channels will then be transmitted to the output stage hardware block. Independently from the actual output stage that was selected, the amplitude of both the processed and the non−processed channels can be controlled by I2C commands. A first parameter determines the number of output shifts (6 dB attenuation or amplification, depending on the sign) that will be applied to the channels. A second parameter is a finer mechanism that allows applying a fractional, broadband gain on the channels. With these two mechanisms, applied in the digital domain by the application processor, a great level of flexibility is provided to match the output level requirements of the target application, independently for the two output channels. The ROM−based application has initialized these parameters for proper operation of the algorithm and correct output levels, so extreme care should be taken when modifying these parameters. The BelaSigna R261 output stage is shown in Figure 10. The output stage processes the two channels although, depending on the configuration, one or both of the output signals are available on the output pins. There are four options for audio outputs from BelaSigna R261 – a digital microphone (DMIC) interface, a low−impedance output driver, a stereo single−ended analog output or a mono differential analog output. All outputs are generated from a sigma−delta modulator which produces a pulse density modulated (PDM) output signal and then provides it to the appropriate output system, based on the system configuration. http://onsemi.com 19 BelaSigna R261 DMIC_OUT Combiner From Application Channel 0 Delay , inversion and muxing A_OUT0 Output Driver 0 A_OUT1 DAC0 OA0 LPF Interpolation Filter Output Modulator Output Stage Channel 0 From Application Channel 1 Inversion Interpolation Filter Output Modulator M U X DAC1 OA1 LPF Output Stage Channel 1 Digital Analog Figure 10. Output Stage The digital microphone interface provides the PDM signals directly on a pin (DMIC_OUT), for interfacing with the DMIC input of external systems. When using this interface, the EXT_CLK input to BelaSigna R261 must be given a DMIC_CLK signal and the system’s clocking must be set up properly, such as proper synchronization can happen between the incoming DMIC_CLK and the output data produced by BelaSigna R261 on its DMIC_OUT pin. Various DMIC_CLK frequencies are supported through hardware configuration on the CONFIG_SEL pin, as discussed earlier. Other frequencies could also be supported under certain conditions, see the clocking section of this document for more information on the supported DMIC clock frequencies. The DMIC output can be configured to carry a mono or stereo signal. In fact both left and right signals can be configured to either contain output stage channel 0 or output stage channel 1. Also, both left and right can be configured to be muted independently (driving a ‘0’ all the time). Figure 11 shows the timing of the DMIC output data relative to the incoming DMIC_CLK signal. See Table 2 for electrical specifications of the timing parameters. DMIC_CLK DMIC_DATA Right Data 0 Left Data 0 Right Data 1 Left Data 1 Right Data 2 DMIC_ HOLD DMIC_ HOLD DMIC_ SETUP DMIC_ SETUP Figure 11. DMIC Timing Diagram The ROM−based application pre−configures the DMIC interface, such as it always outputs a stereo signal with Channel 0 as the right signal, and Channel 1 as the left signal. Table 11 shows the actual signals on the right and left channels of the DMIC interface, depending on the algorithm enable/disable bit. Table 11. DMIC OUTPUT SIGNALS Algorithm Enabled Right Left BSE processed signal Un−processed signal Algorithm Disabled Un−processed signal BSE Processed signal http://onsemi.com 20 BelaSigna R261 The DMIC host can consequently ignore the algorithm enable/disable functionality, as both processed and un−processed signals are always output for all pre−defined DMIC configurations. This functionality can still be used with custom DMIC configurations, such as mono. These custom configurations can be made over the I2C interface. When the DMIC interface is not required or needed, the analog outputs can be used for interfacing at line−levels or other signal levels, e.g. microphone levels for an external system which expects low level signals (e.g. an analog baseband chipset). There are three configurable aspects of the analog output stage – the selection of stereo (two single ended outputs) or mono (one differential output), the output attenuation and the reconstruction filter. When a stereo single−ended option is selected, each channel is filtered to generate an analog signal which is then scaled by a configurable output attenuator (OA in Figure 10). In mono differential mode, channel 1 is replaced by an inverted version of channel 0 such that the two output pins contain a differential signal for channel 0. In this latter case, both output attenuators are used, so it is mandatory to ensure that they have the same attenuation settings. This can be configured using I2C commands. As defined with the CONFIG_SEL pin, some pre−defined configurations have been designed specifically for use with analog output instead of DMIC interface. For these configurations, a differential mono analog output is pre−configured by the ROM−based application. Consequently, the host processor will have to use the algorithm enable/disable pin (ALGO_CTRL) or the I2C interface, to swap between the processed and the non−processed signal, as shown on Table 12: Table 12. ANALOG MONO DIFFERENTIAL OUTPUT SIGNAL Algorithm Enabled A_OUT0 − A_OUT1 BSE processed signal Algorithm Disabled Un−processed signal The reconstruction filters can also be altered by I2C commands; typically, the cut−off frequency can be switched between 13 kHz (default) and 26 kHz. The WLCSP-26 package option doesn’t provide access to the A_OUT0 pin. Consequently, only A_OUT1 is available as an analog output. For the predefined configurations (using CONFIG_SEL), the analog output stage is configured to provide a mono differential output signal, as described on Table 12. The A_OUT1 signal will thus be an inverted version of the processed output channel. Access to the un-processed signal will have to be done with an I2C command, or potentially with the ALGO_CTRL signal, with the precautions discussed earlier concerning the automatic booting process (See the Boot Control section for additional details). A third output method is available on BelaSigna R261, using the Class−D output driver which can drive an output transducer without the need for a separate power amplifier. The output driver can also be configured for single ended stereo or differential mono, through the same I2C commands as described for the analog outputs. For optimal audio performance it is important to note that the VBATRCVR power supply must be connected differently, depending on whether the output driver or the analog outputs are being used: • When using the analog outputs, VBATRCVR must be connected to VDDA on the application PCB • When using the output driver, VBATRCVR must be connected to VBAT on the application PCB and must be decoupled with an external capacitor When interfacing BelaSigna R261 with other processors like codecs or baseband chipsets, it is not recommended to use the output driver, but rather the analog outputs. Clock Generation Circuitry Alternatively, when stereo analog outputs have been configured through the I2C interface, the signals on the two output pins will be as shown on Table 13: Table 13. ANALOG STEREO OUTPUT SIGNALS Algorithm Enabled A_OUT0 A_OUT1 BSE processed signal Un−processed signal Algorithm Disabled Un−processed signal BSE Processed signal The attenuation of these analog signals can be done by using the ATT_SEL mechanism described earlier, but alternatively, the I2C interface can also be used for this purpose. BelaSigna R261 is equipped with a fully configurable and flexible clocking system, which allows for a large number of clocking configurations for various different use cases. Computing applications would typically require the use of a DMIC interface, which imposes constraints on the BelaSigna R261 clocking system, such as it provides full synchronization between an incoming DMIC clock and the DMIC data that the chip will produce. The input frequencies that these systems usually operate with are in the range of 2.048 to 3.072 MHz. Mobile phone applications would typically use much higher clock frequencies; historically, baseband systems have been using 13 MHz or 26 MHz, or even 19.2 MHz or 38.4 MHz. The variety of clocking use cases that BelaSigna R261 must support forced the integration of a phase locked loop as one of the components of BelaSigna R261’s clock generation circuitry. This highly configurable PLL is shown in Figure 12, in the context of the BelaSigna R261 clocking architecture. http://onsemi.com 21 BelaSigna R261 PLL Output Clock EXT_CLK PLL External Clock Stand−By Clock Activity Detector SYS_CLK / MCLK_DIV DMIC Sync MCLK Figure 12. Clocking Circuitry The ROM−based application has pre−configured the clocking system in the various hardware presets that are available, as described in Table 9, but for extended flexibility, the use of the I2C interface allows changing the clocking configuration to accommodate specific application needs. See BelaSigna R261 Configuration and Communications Guide for more information. SYS_CLK is the clock signal that will be used by the digital signal processing engine inside BelaSigna R261. It can be either the output of the PLL, as described above or it can also be driven by the stand−by clock, which is a very low frequency signal used to minimize power consumption in Sleep mode. Alternatively, the EXT_CLK signal could also be used directly by the system, bypassing the internal PLL. MCLK is the clock signal that is used by the input and output stages of BelaSigna R261. MCLK must be configured to stay within the 1.92 MHz – 3.84 MHz range, to guarantee correct system operation. Among other parameters, an important impact of the MCLK signal is the sampling rate. When the DMIC interface has to be used, BelaSigna R261 automatically synchronizes the EXT_CLK signal and the MCLK signal, as shown on Figure 12. Since MCLK is used to generate the DMIC data output, it must be fully synchronized with the EXT_CLK signal which is the DMIC clock, such as the DMIC host can properly sample the DMIC data. Consequently, the range of supported DMIC clock frequencies is the same as the MCLK range, i.e. 1.92 MHz to 3.84 MHz. As discussed in the System Monitoring section, BelaSigna R261 is equipped with a clock detection mechanism that will permanently monitor activity on the EXT_CLK signal. This will ensure that whenever this clock source disappears, BelaSigna R261 will properly enter a known state, using an internal clocking signal, until the external clock comes back. It has to be noted that the internal PLL of BelaSigna R261 has a free−running mode, whereby it is capable to operate without an external clock reference to be provided. This mode requires special configuration, but can be used when it is not necessary to guarantee an exact clock frequency or when the sampling rate accuracy isn’t important. For more information on the configuration of this clocking architecture, refer to BelaSigna R261 Configuration and Communications Guide. http://onsemi.com 22 BelaSigna R261 Power Supply Unit BelaSigna R261 uses multiple power supplies as can be seen on the simplified representation of the power supply unit in Figure 13. VDDD Regulator Bandgaps & Regulators VREG Regulator Charge Pump 1.8 V VDDD 1V VREG 2V VDDA POR & Power Supervision VBATRCVR VDDO VBAT CAP0 CAP1 VSSD VSSA M U X VMIC Figure 13. Power Supply Structure Digital and analog sections of the chip have their own power supplies to allow exceptional audio quality. Several band gap reference circuits and voltage regulators are used to separate the power supplies to the various blocks that compose the BelaSigna R261 architecture. Table 14 provides a short description of all the power supply pins of BelaSigna R261. Table 14. POWER SUPPLY VOLTAGES Voltage Battery Supply Voltage Output Driver Supply Voltage Internal Digital Supply Voltage Abbreviation VBAT Description The primary voltage supplied to BelaSigna R261 is VBAT. It is typically in the range 1.8 V – 3.3 V. BelaSigna R261 has internal voltage regulator, which allows the application PCB to avoid the use of voltage regulators. If powered independently and the output driver is to be used, VBATRCVR must be connected to VBAT on the application PCB. Alternatively, if the analog outputs are used, VBATRCVR should be connected to VDDA. The internal digital supply voltage is used as the supply voltage for all internal digital components, including being used as the interface voltage at the internal side of the level translation circuitry attached to all of the digital pins. VDDD is provided as an output pad, where a decoupling capacitor to ground has to be placed to filter power supply noise. VDDO is an externally provided power source. It is used by BelaSigna R261 as the external side of the level translation circuitry attached to all of the digital pins. Communication with external devices on digital pins will happen at the level defined on this pin. VREG is a 1 V reference to the analog circuitry. It is available externally to allow for additional noise filtering of the regulated voltages within the system. VREG can also be used as a microphone power supply, when the VMIC pin cannot be used. VDDA is a 2 V reference voltage generated from the internal charge pump. It is a reference to the analog circuitry. It is available externally to allow for additional noise filtering of the regulated voltages within the system. The internal charge pump uses an external capacitor that is periodically refreshed to maintain the 2 V supply. VDDA can also be used as a microphone power supply, when the VMIC pin cannot be used. VMIC is a configurable microphone bias voltage. VMIC can be configured by the application to provide 1 V or 2 V power supply to the microphones. It can also be grounded or put to High−Z mode to save power when the microphones don’t have to be used. The ROM−based application configures VMIC to provide 2 V to the microphones when they are in use, and High−Z when the system is in Sleep mode. VBATRCVR VDDD External I/O Supply Voltage Regulated Supply Voltage Analog Supply Voltage VDDO VREG VDDA Microphone Bias Voltage VMIC http://onsemi.com 23 BelaSigna R261 Power Management Strategy & Battery Monitoring BelaSigna R261 has a built−in power management unit that guarantees valid system operation under any voltage supply condition to prevent any unexpected audio output as the result of any supply irregularity. The unit constantly monitors the power supply and shuts down all functional units (including all units in the audio path) when the power supply voltage goes below a level at which point valid operation can no longer be guaranteed. The power management unit on BelaSigna R261 includes power−on−reset (POR) functionality as well as power supervisory circuitry, as shown in Figure 13. These two components work together to ensure proper device operation under all battery conditions. The POR sequence is designed to ensure proper system behavior during start−up and proper system configuration after start−up. At the start of the POR sequence, the audio output is disabled and all configuration and control registers are asynchronously reset to their default values. The power supervisory circuitry monitors the battery supply voltage (VBAT). This circuit is used to start the system when VBAT reaches a safe startup voltage, and to reset the system when it drops below a relevant voltage threshold. The relevant parameters are shown in Table 15. Table 15. POWER MANAGEMENT PARAMETERS Parameters VBAT startup (POR_THR_UP) VBAT shutdown (POR_THR_DN) POR duration (POR_TIME) Voltage Level 1.65 V ± 80 mV 1.6 V ± 50 mV 5.6 ms Once the ROM application is running, more system monitoring is performed by the application; typically, the software will permanently monitor the presence of an external clock, and take the appropriate actions whenever it disappears. See the system monitoring section for more information. Digital Communication Interfaces Debug Port (UART) BelaSigna R261 has an RS232−based UART that can be used to interface the chip from ON Semiconductor’s communication tools. The debug port cannot be used for customer applications. BelaSigna R261 can only be configured using the I2C interface. See the I2C interface section for information on how communication tools can interface with BelaSigna R261. General−Purpose Input Output (GPIO) Ports The POR sequence consists of two phases: voltage supply stabilization and boot ROM initialization. During the voltage supply stabilization phase, the following steps are performed: 1. The internal regulators are enabled and allowed to stabilize 2. The internal charge pump is enabled and allowed to stabilize 3. SYSCLK is connected to all of the system components (Free−running PLL output) 4. The system runs the ROM application At step 1, once the supply voltage rises above the startup voltage (POR_THR) and remains there for a certain time (POR_TIME), a signal will enable the charge pump. At step 2, another POR_TIME delay is implemented to allow the charge pump to stabilize before toggling the POR signal, and thus enabling the digital core. If the supply is consistent, the internal system voltage will then remain at a fixed nominal voltage. If a spike occurs that causes the voltage to drop below the shutdown internal system voltage (POR_THR), the system will shut down. If the voltage rises again above the startup voltage and remains there for the required time (POR_TIME), a POR sequence will occur again. See the electrical characteristics on Table 2 for details on POR_THR and POR_TIME. BelaSigna R261 has five GPIO ports which are all used with specific functionalities. The five signals are SPI_CLK/CONFIG_SEL, SPI_CS/ATT_SEL, SPI_SERO/ ALGO_CTRL, SPI_SERI/SLEEP_CTRL and BOOT_SEL. The BOOT_SEL pin controls the behavior of the four other GPIOs, as defined in the Booting Control section. When not used as an SPI port, these four other pins will act as GPIOs (ALGO_CTRL and SLEEP_CTRL) or as LSADs (ATT_SEL and CONFIG_SEL). When used as GPIOs, all pins have pull−up resistors (BOOT_SEL, SLEEP_CTRL and ALGO_CTRL). When used as LSADs (ATT_SEL and CONFIG_SEL), the pull−ups are disabled. If left floating in LSAD mode, the pins have a weak pull−down to ground. See the Booting Control, Sleep Mode Control and Algorithm Control sections earlier in this document for details on the behavior of these GPIO ports. The I2C interface is an industry−standard interface that can be used for high−speed transmission of data between BelaSigna R261 and an external device. The interface operates at speeds up to 400 kbit/sec. In product development mode, the I2C interface is used for application debugging purposes, communicating with the BelaSigna R261 development tools, also known as SignaKlara Development Utility (SKDU). The interface always operates in slave mode and the slave address is 0x61. A comprehensive command interface can be used with SKDU. It will offer a variety of support functions grouped in different categories like general system control (system reset, status information), application control (switching between operating modes, enabling or disabling the algorithm), hardware setup (for custom configuration of the various hardware units like clocking, input/output stages), algorithm setup (amplitude management, custom algorithm mode loading) and finally the low−level I2C protocol is also supported. More details on this command interface can be found in the “BelaSigna R261 Configuration and Communications Guide”. I2C Interface http://onsemi.com 24 BelaSigna R261 Serial Peripheral Interface (SPI) Port Interfaces Unused by the ROM−based Application An SPI port is available on BelaSigna R261 for applications such as communication with a non−volatile memory (EEPROM). The I/O levels on this port are defined by the voltage on the VDDO pin. The SPI port operates in master mode only, which supports communications with slave SPI devices. The four signals needed by the SPI port are multiplexed with other functions on BelaSigna R261 (GPIOs, LSADs). The use of the SPI port is excluding the use of these other functions. BelaSigna R261 also contains hardware provisions for a high speed PCM interface, as well as a high speed UART. These two interfaces are not used by the ROM−based application, hence cannot be used by default. Custom applications developed by ON Semiconductor could enable the use of these interfaces, should this be required. Long Term Storage Conditions ON Semiconductor specifies a 24−month maximum storage time for WLCSP devices in pocket tapes and conditioned in dry bags, as stated in Table 16 below and defined in ON Semiconductor’s “Finished Goods Packing and Long Term Storage Procedures”. (Document # 12MRB17500B) Table 16. LONG TERM STORAGE CONDITIONS Storage Condition temperature 18−28°C, humidity 30−65%RH Maximum Storage Time 24 months after die singulation/sawing date Remarks Maximum 12 months storage at condition 18−28°C, 30−65%RH. Afterwards storage in vacuum moisture bag with desiccant and humidity card. Storage in nitrogen cabinet allowed. Re−Flow Information The re−flow profile depends on the equipment that is used for the re−flow and the assembly that is being re−flowed. Care must be taken not to expose the packages to temperatures above the rated features. The WLCSP package is tested to perform reliably up to 3x reflow passes at the maximum reflow peak temperature of 260°C. Use Table 17 from the JEDEC Standard 22−A113D and J−STD−020D as a guideline but note that actual profiles should be developed by customers based on specific process needs and board designs. Table 17. RE−FLOW INFORMATION Profile Feature Preheat & Soak Temperature minimum (TSMIN) Temperature maximum (TSMAX) Time (TSMIN to TSMAC) (TS) Average Ramp−Up Rate (TSMAX to TP) Liquidous temperature and time Temperature (TL) Time (tL) Peak Temperature (TP) Time within 5°C of Actual Peak Temperature Ramp−Down Rate (TP to TSMAX) Time 25°C to Peak Temperature Pb−free Assembly 150°C 200°C 60−120 seconds 3°C/second maximum Miscellaneous Chip Identification Chip identification information can be retrieved by using the Communications Accelerator Adaptor (CAA) tool along with the protocol software provided by ON Semiconductor. For BelaSigna R261, the key identifier components and values are as follows: Chip Family 0x02 (SK2) Chip Version 0x3010 217°C 60−150 seconds 260 +0/−5°C 20−40 seconds 6°C/second maximum 8 minutes maximum http://onsemi.com 25 BelaSigna R261 PACKAGE DIMENSIONS WLCSP30, 2.233x2.388 CASE 567CT−01 ISSUE A D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. DIM A A1 A2 b D E eA eB MILLIMETERS MIN MAX 0.84 1.00 0.17 0.23 0.72 REF 0.24 0.29 2.388 BSC 2.233 BSC 0.252 BSC 0.310 BSC E PIN A1 REFERENCE 2X 2X 0.10 C 0.10 C 0.10 C A 0.05 C NOTE 3 A1 ÈÈ ÈÈ eA A B C D E F G TOP VIEW A2 SIDE VIEW 30X C SEATING PLANE b 0.05 C A B 0.03 C eB 123456789 BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* PACKAGE OUTLINE 0.310 A1 30X 0.504 PITCH 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 26 BelaSigna R261 PACKAGE DIMENSIONS WLCSP26, 2.388x2.233 CASE 567CY−01 ISSUE O D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. DIM A A1 A2 b D E eD eE MILLIMETERS MIN MAX 0.84 1.00 0.17 0.23 0.72 REF 0.24 0.29 2.388 BSC 2.233 BSC 0.252 BSC 0.310 BSC E PIN A1 REFERENCE 2X 2X 0.10 C 0.10 C 0.10 C A 0.05 C NOTE 3 A1 ÈÈ ÈÈ eD A B C D E F G TOP VIEW A2 SIDE VIEW 26X C SEATING PLANE b 0.05 C A B 0.03 C eE 123456789 BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* PACKAGE OUTLINE 0.35 A1 26X 0.504 PITCH 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 27 BelaSigna R261 Assembly / Design Notes For PCB manufacture with BelaSigna R261, ON Semiconductor recommends solder−on−pad (SoP) surface finish. With SoP, the solder mask opening should be non−solder mask−defined (NSMD) and copper pad geometry will be dictated by the PCB vendor’s design requirements. Alternative surface finishes are ENiG and OSP; volume of screened solder paste (#5) should be less than 0.0008 mm3. If no pre−screening of solder paste is used, then the following conditions must be met: 1. the solder mask opening should be >0.3 mm in diameter, 2. the copper pad will have 0.25 mm diameter, and 3. solder mask thickness should be less than 1 mil thick above the copper surface. ON Semiconductor can provide BelaSigna R261 mounting foot print guidelines to assist your PCB design upon request. Table 18. ORDERING INFORMATION Device BR261W30A101E1G BR261W26A101E1G Marking BR261W30 BR261W26 Package WLCSP30 WLCSP26 Shipping † 2500 / Tape & Reel 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. BelaSigna is a registered trademark of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 28 BR261/D