RB520S30T1G, RB520S30T5G Schottky Barrier Diode
These Schottky barrier diodes are designed for high−speed switching applications, circuit protection, and voltage clamping. Extremely low forward voltage reduces conduction loss. Miniature surface mount package is excellent for hand−held and portable applications where space is limited.
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• • • • •
Extremely Fast Switching Speed Extremely Low Forward Voltage 0.6 V (max) @ IF = 200 mA Low Reverse Current ESD Rating: Class 3B per Human Body Model Class C per Machine Model These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
30 VOLT SCHOTTKY BARRIER DIODE
1 CATHODE
2 ANODE
2
MAXIMUM RATINGS
Rating Reverse Voltage Forward Current DC Symbol VR IF Value 30 200 Unit Vdc mA
1 SOD−523 CASE 502
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
MARKING DIAGRAM
THERMAL CHARACTERISTICS
Characteristic Total Device Dissipation FR−5 Board, (Note 1) TA = 25°C Derate above 25°C Thermal Resistance, Junction−to−Ambient Junction and Storage Temperature Range 1. FR−5 Minimum Pad. Symbol PD Max 200 1.57 RqJA TJ, Tstg 635 −55 to +150 Unit mW mW/°C °C/W °C
1
5J M G G
2
5J = Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation position may vary depending upon manufacturing location.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Reverse Leakage (VR = 10 V) Forward Voltage (IF = 200 mA) Symbol IR VF Min − − Typ − − Max 1.0 0.60 Unit mA Vdc
ORDERING INFORMATION
Device RB520S30T1G RB520S30T5G Package SOD−523 (Pb−Free) SOD−523 (Pb−Free) Shipping† 4 mm Pitch 3000/Tape & Reel 4 mm Pitch 8000/Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
July, 2011 − Rev. 9
1
Publication Order Number: RB520S30T1/D
RB520S30T1G, RB520S30T5G
820 W +10 V 2k 100 mH 0.1 mF DUT 50 W Output Pulse Generator 50 W Input Sampling Oscilloscope IF 0.1 mF t
r
tp 10%
t
IF trr t
90% VR IR INPUT SIGNAL
iR(REC) = 1 mA OUTPUT PULSE (IF = IR = 10 mA; measured at iR(REC) = 1 mA)
Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (IF) of 10 mA. Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA. Notes: 3. tp » trr
Figure 1. Recovery Time Equivalent Test Circuit
200 100 IF, FORWARD CURRENT (mA)
1000 100 IR, REVERSE CURRENT (mA)
TA = 150°C TA = 125°C
10
1 50°C
10 1.0 TA = 85°C 0.1 0.01 TA = 25°C
1 25°C 85°C 25°C
1.0
− 40°C
− 55°C 0.4 0.5 0.6
0.1 0.0
0.001 0.1 0.2 0.3 0 5 10 15 20 25 30 VF, FORWARD VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Forward Voltage
Figure 3. Leakage Current
14 12 CT, TOTAL CAPACITANCE (pF) 10 8 6 4 2 0 0 5 10 15 20 25 30
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Total Capacitance
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RB520S30T1G, RB520S30T5G
PACKAGE DIMENSIONS
SOD−523 CASE 502−01 ISSUE E
−X− D −Y− E
2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM A b c D E HE L L2 MILLIMETERS MIN NOM MAX 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 1.10 1.20 1.30 0.70 0.80 0.90 1.50 1.60 1.70 0.30 REF 0.15 0.20 0.25
b 0.08
1
M
2
XY
TOP VIEW
A
c
HE
SIDE VIEW
2X
RECOMMENDED SOLDERING FOOTPRINT*
L 0.48
2X
1.80 0.40
2X
2X
L2
PACKAGE OUTLINE
DIMENSION: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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RB520S30T1/D
