RB751S40T1G

RB751S40T1 Schottky Barrier Diode These Schottky barrier diodes are designed for high−speed switching applications, circuit protection, and voltage clamping. Extremely low forward voltage reduces conduction loss. Miniature surface mount package is excellent for hand−held and portable applications where space is limited. Features http://onsemi.com • • • • • Extremely Fast Switching Speed Extremely Low Forward Voltage − 0.28 V (Typ) @ IF = 1.0 mAdc Low Reverse Current Lead−Free Plating Pb−Free Package is Available 40 V SCHOTTKY BARRIER DIODE 1 CATHODE 2 ANODE 2 MAXIMUM RATINGS Rating Peak Reverse Voltage Reverse Voltage Forward Continuous Current (DC) Peak Forward Surge Current Symbol VRM VR IF IFSM Value 40 30 30 500 Unit V V mA mA 1 SOD−523 CASE 502 PLASTIC MARKING DIAGRAM 5E MG G 1 2 5E = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) ESD Rating: Class 1C per Human Body Model Class A per Machine Model Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Total Device Dissipation FR−5 Board, (Note 1) TA = 25°C Derate above 25°C Thermal Resistance, Junction−to−Ambient Junction and Storage Temperature Range 1. FR−5 Minimum Pad. Symbol PD Max 200 1.57 RqJA TJ, Tstg 635 −55 to +150 Unit mW mW/°C °C/W °C ORDERING INFORMATION Device RB751S40T1 RB751S40T1G Package SOD−523 SOD−523 (Pb−Free) Shipping † 4000/Tape & Reel 4000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2006 1 January, 2006 − Rev. 3 Publication Order Number: RB751S40T1/D RB751S40T1 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Reverse Breakdown Voltage (IR = 10 mA) Total Capacitance (VR = 1.0 V, f = 1.0 MHz) Reverse Leakage (VR = 30 V) Forward Voltage (IF = 1.0 mAdc) Symbol V(BR)R CT IR VF Min 30 − − − Typ − 2.0 300 0.28 Max − 2.5 500 0.37 Unit V pF nAdc Vdc 10 IF, FORWARD CURRENT (mA) IR , REVERSE CURRENT (μA) 1000 100 10 1.0 0.1 25°C 0.01 85°C 0.1 0.15 0.2 25°C 0.25 −40 °C 0.3 0.35 −55 °C 0.4 0.45 0.5 0.001 TA = 150°C 125°C 85°C 1.0 150 °C 125 °C 0 0.05 0.1 0 5 VF, FORWARD VOLTAGE (VOLTS) 10 15 20 25 VR, REVERSE VOLTAGE (VOLTS) 30 35 Figure 1. Typical Forward Voltage Figure 2. Reverse Current versus Reverse Voltage 3.0 2.5 C T, CAPACITANCE (pF) 2.0 1.5 1.0 0.5 0 0 2.0 4.0 6.0 8.0 10 12 14 16 18 VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Capacitance http://onsemi.com 2 RB751S40T1 PACKAGE DIMENSIONS SOD−523 CASE 502−01 ISSUE B −X− A −Y− B 1 D 2 PL 0.08 (0.003) M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. MILLIMETERS MIN NOM MAX 1.10 1.20 1.30 0.70 0.80 0.90 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 0.15 0.20 0.25 1.50 1.60 1.70 INCHES NOM MAX 0.047 0.051 0.032 0.035 0.024 0.028 0.012 0.014 0.0055 0.0079 0.008 0.010 0.063 0.067 2 TXY DIM A B C D J K S MIN 0.043 0.028 0.020 0.010 0.0028 0.006 0.059 C K J S −T− SEATING PLANE SOLDERING FOOTPRINT* 1.40 0.0547 0.40 0.0157 0.40 0.0157 SCALE 10:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 3 RB751S40T1 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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