S1GHE

Surface Mount Rectifiers, 1 A, 400 V - 600 V S1GHE, S1JHE Features • • • • • • • • Low Profile Package with < 0.75 mm Package Height High Efficiency Moisture Sensitivity Level 1 per J−STD−020 Glass Passivated Chip Junction UL Flammability 94V−0 Classification Green Mold Compound NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant www.onsemi.com 1 Cathode 2 Anode Rectifier 2 1 Specifications ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Value Parameter Symbol S1GHE S1JHE Unit 400 600 V VRRM Maximum Repetitive Peak Reverse Voltage IF(AV) Maximum Average Forward Rectified Current 1 A IFSM Peak Forward Surge Current, 8.3 ms Single Half Sine−Wave Superimposed on Rated Load 20 A Operating Junction Temperature Range −55 to +175 °C Storage Temperature Range −55 to +175 °C TJ TSTG Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. SOD−323EP CASE 477AD MARKING DIAGRAM &Y &Z**&G Band Indicates Cathode &Y &Z ** &G = Binary Calendar Year Coding Scheme = Assembly Plant Code = Specific Device Code − (A5, A7) = Single Digit Weekly Data Code ORDERING INFORMATION Part Number Device Code Marking Package Shipping† S1GHE A5 SOD−323EP (Pb−Free/Halogen Free) 3000 / Tape & Reel A7 SOD−323EP (Pb−Free/Halogen Free) 3000 / Tape & Reel NRVS1GHE S1JHE NRVS1JHE †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2020 May, 2021 − Rev. 2 1 Publication Order Number: S1JHE/D S1GHE, S1JHE THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Note 1) Symbol Value Unit ΨJL Junction to Lead Thermal Resistance Thermocouple Soldered to Cathode Characteristic 26.5 °C/W RqJA Junction to Ambient Thermal Resistance 200 °C/W 1. Per JESD51−3 Recommended Thermal Test Board. Device mounted on FR−4 PCB, board size = 76.2 mm x 114.3 mm. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Parameter VF Instantaneous Forward Voltage (Note 2) IR Reverse Current at Rated VR Trr Reverse Recovery Time IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A CJ Junction Capacitance VR = 4.0 V, f = 1 MHz Conditions Min Typ Max Unit IF = 1 A 0.96 1.1 V TJ = 25°C 0.02 1 mA TJ = 125°C 10.35 50 782 ns 3 pF Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Pulse test with PW = 300 ms, 1% duty cycle. www.onsemi.com 2 S1GHE, S1JHE TYPICAL PERFORMANCE CHARACTERISTICS PEAK FORWARD SURGE URRENT(A) AVERAGE FORWARD CURRENT (A) 1.2 1 0.8 0.6 0.4 RESISTIVE OR INDUCTIVE LOAD 0.2 0 0 25 50 75 100 125 150 100 8.3ms Single Half Sine Wave 10 1 175 1 10 LEAD TEMPERATURE (°C) Figure 1. Forward Current Derating Curve Figure 2. Maximum Non−Repetitive Forward Surge Current 1000 10 IR − LEAKAGE CURRENT (mA) o IF − FORWARD CURRENT (A) 100 NUMBER OF CYCLES AT 60 Hz o TA = 175 C 1 o TA = 150 C o TA = 125 C 0.1 o TA = 25 C TA = 175 C 100 o o o TA = 150 C TA = 75 C TA = 125 C 10 1 0.1 0.01 0.001 o TA = −40 C 1E−4 o TA = −55 C 0.01 0.4 0.6 0.8 1.0 1.2 o 1.4 1.6 VF − FORWARD VOLTAGE (V) 40 o o TA = 25 C 1E−5 20 TA = −55 C TA = −40 C 60 80 100 PERCENT OF RATED REVERSE VOLTAGE (%) Figure 3. Typical Forward Characteristics Figure 4. Typical Reverse Characteristics CJ − JUNCTION CAPACITANCE (pF) 100 10 1 0.1 0.1 1 10 100 1000 VR − REVERSE BIAS VOLTAGE (V) Figure 5. Typical junction Capacitance Figure 6. Reverse Recovery Time Characteristics and Test Circuit Diagram www.onsemi.com 3 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOD−323EP CASE 477AD ISSUE O DATE 31 AUG 2016 2.30 1.75 0.50 1.40 1.15 1.10 1.00 2.00 TOP VIEW 0.80 LAND PATTERN RECOMMENDATION 0.75 0.55 2.70 2.30 FRONT VIEW 1.55 1.10 0.80 0.40 0.95 0.65 0.20 0.10 NOTES: A. THIS PACKAGE DOES NOT CONFORM TO ANY STANDARDS. B. ALL DIMENSIONS ARE IN MILLIMETERS. 0.85 C. DIMENSIONS ARE EXCLUSIVE OF BURRS, 0.45 MOLD FLASH AND TIE BAR PROTRUSIONS. BOTTOM VIEW DOCUMENT NUMBER: DESCRIPTION: 98AON13727G SOD−323EP Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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