SC339DR2G

FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #20682 Generic Copy Issue Date: 14-Jan-2015 TITLE: G700LS Mold Compound Qualification for SOIC8_14 products assembled with Cu Wire in OSPI PROPOSED FIRST SHIP DATE: 21-Apr-2015 AFFECTED CHANGE CATEGORY(S): FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or SAMPLES: Contact your local ON Semiconductor Sales Office ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. implementation of the change. FPCNs are issued at least 90 days prior to ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact . DESCRIPTION AND PURPOSE: ON Semiconductor is notifying of the intent to change from Sumitomo Bakelite G600 to Sumitomo Bakelite G700LS mold compound. This change will affect products which are assembled with copper wire in SOIC 8 and 14 lead packages in the ON Semiconductor Philippines (OSPI) location. There are no changes to product design, electrical specifications, or physical dimensions as a result of this notification. Full reliability information has been completed and all products will continue to meet or exceed ON Semiconductor reliability standards. Issue Date: 14-Jan-2015 Rev. 06-Jan-2010 Page 1 of 4 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #20682 RELIABILITY DATA SUMMARY: NCV2901DR2G (SOIC 14) End Point Req’s Test Results Read Point Test Name Test Conditions ELFR Early Life Failure Rate Temp = +150°C for 48 hours c = 0, Room, Hot HTOL High Temp Op Life Temp = +150°C for 1008 hours c = 0, Room, Hot (rej/ ss) Lot A Lot B Lot C Lot 2 48 Hrs 0/800 0/800 0/800 504 Hrs 0/80 0/80 0/80 0/80 0/80 0/80 1008 Hrs 0/80 0/80 0/80 0/80 0/80 0/80 508 Hrs 0/80 0/80 0/80 0/80 0/80 0/80 Lot D Lot E ongoing ongoing ongoing Temp = +150°C for 1008 hours c = 0, Room, Hot 1008 Hrs 0/80 0/80 0/80 0/80 0/80 0/80 DPA following 1008hrs HTSL AEC-Q101004 2 units minimum 0/2 0/2 0/2 0/2 0/2 0/2 3x IR @ 260 deg C c = 0, Room 0/240 0/240 0/240 0/240 0/240 0/240 Temp = -65°C to +150°C; for 500 cycles 0/80 0/80 0/80 0/80 0/80 0/80 Temp Cycle + Preconditioning c = 0, Room, Hot 500 cyc 0/80 0/80 0/80 0/80 0/80 0/80 1000 cyc 0/80 0/80 0/80 0/80 0/80 0/80 Destructive Physical Analysis Custom Destructive Physical Analysis DPA following 500 cyc TC + PC Wire Bond Pull Test following 500 cyc TC + PC AEC-Q101004 2 units minimum 0/2 0/2 0/2 0/2 0/2 0/2 Minimum reading of 3 grams 5 units minimum 0/5 0/5 0/5 0/5 0/5 0/5 Highly Accelerated Stress Test + Preconditioning Temp = +130°C; RH = 85%, psig ~28 for 96hr Post PC Electrical 0/80 0/80 0/80 0/80 0/80 0/80 HASTPC 96 Hrs 0/80 0/80 0/80 n/a n/a n/a DPA Destructive Physical Analysis 2 units minimum 0/2 0/2 0/2 n/a n/a n/a Post PC Electrical 0/80 0/80 0/80 0/80 0/80 0/80 96 Hrs 0/80 0/80 0/80 0/80 0/80 0/80 0/30 0/30 0/30 0/30 0/30 0/30 0/15 0/15 0/15 0/15 0/15 0/15 0/10 0/10 0/10 0/10 0/10 0/10 0/30 0/30 0/30 0/30 0/30 0/30 0/30 0/30 0/30 0/30 0/30 0/30 HTSL Destructive Physical Analysis MSL1 Preconditioning DPA PC TC-PC DPA CDPA AC-PC RSH SD PD BPS BS Test High Temp Storage Life (rej/ss) (rej/ss) (rej/ss) (rej/ss) (rej/ss) DPA following 96 hrs HAST + PC Temp = Autoclave + +121°C; RH = Preconditioning 100%, psig ~15 for 96hr Resistance to 260 C Solder Heat Immersion Solder Temp= Solderability 245oC Physical Dimension Cpk > 1.33 Inspection Bond Pull Cpk >1.33 Strength Bond Shear Cpk >1.33 Name c = 0, Room, Hot AEC-Q101004 c = 0, Room c = 0, Room Visual Inspection Post Electrical Post PC Electrical Post PC Electrical 15 units minimum Inspection 10 units minimum 5 parts minimum 5 parts minimum 30 bonds minimum 30 bonds minimum Test Conditions End Point Req’s Test Results Read Point (rej/ (rej/ (rej/ (rej/ ss) ss) ss) ss) Lot F Lot G Lot H Lot I PC MSL1 Preconditioning 3x IR @ 260 deg C c = 0, Room Post Electrical 0/80 0/80 0/80 0/80 SAT Scanning Acoustic Tomography Compare for Delamination before and after PC Compare to existing data Results 0/25 0/25 0/25 0/25 Issue Date: 14-Jan-2015 Rev. 06-Jan-2010 Page 2 of 4 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #20682 MC14069DR2G (SOIC14) Test Name Test Conditions End Point Req’s Test Results Read Point (rej/ ss) (rej/ ss) (rej/ ss) (rej/ ss) (rej/ ss) Lot A Lot B Lot C Lot D Lot E Prep Sample preparation and initial part testing various --- Initial Electrical done done done done Done PC MSL1 Preconditioning 3x IR @ 260 deg C c = 0, Room Post Electrical 0/80 0/80 0/80 0/80 0/80 SAT Scanning Acoustic Tomography Compare for Delamination before and after PC Compare to existing data Results 0/25 0/25 0/25 0/25 0/25 NCV2931DR2G (SOIC08) Issue Date: 14-Jan-2015 Rev. 06-Jan-2010 Page 3 of 4 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #20682 ELECTRICAL CHARACTERISTIC SUMMARY: There are no changes in electrical performance. Datasheet specifications are not affected by this change. CHANGED PART IDENTIFICATION: There will be no change to part nomenclature or ordering code. Product implementation will be controlled by date code and material will not ship prior to the PCN effectivity date provided on page 1, unless early customer acceptance is provided. List of affected General Parts: CD8447DR2G NCV2901DR2G NCV2902DR2G NCV33074ADR2G NCV33074DR2G SOIC14 NCV33079DR2G NLV14069UBDG NCV33204DR2G NLV14069UBDR2G NCV33274ADG SC224DR2G NCV33274ADR2G NCV34074VDR2G TY30577DR2G SOIC8 FMC33202DR2G NCV2951CDR2G NCV33172DR2G NCV1455BDR2G NCV3063DR2G NCV33201VDR2G NCV2903DR2G NCV3064DR2G NCV33202VDR2G NCV2904DR2G NCV3066DR2G NCV33272ADR2G NCV2931ACDR2G NCV317LBDG NCV5230DR2G NCV2931AD-5.0R2G NCV317LBDR2G NCV78L05ABDG NCV2931CDR2G NCV33063AVDR2G NCV78L05ABDR2G NCV2931D-5.0R2G NCV33072ADR2G NCV78L08ABDR2G NCV2951ACD3.3R2G NCV33072DR2G NCV78L12ABDG NCV2951ACDR2G NCV33078DR2G NCV78L12ABDR2G Issue Date: 14-Jan-2015 Rev. 06-Jan-2010 SC2901DR2G SC2901VDR2G SC2902DR2G SC339DR2G NCV78L15ABDR2G NCV833DR2G SC2903DR2G SC2903VDR2G SC2904DR2G SCV2903DR2G SE5532AD8R2G TY30533R2G Page 4 of 4