SD05T1G

SD05T1Series, SZSD05T1Series ESD Protrection Diode SOD−323 Diodes for ESD Protection These surge protection diodes are designed for applications requiring transient overvoltage protection capability. They are intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. These devices are ideal for situations where board space is at a premium. www.onsemi.com MARKING DIAGRAM Specification Features: • • • • • • • • • • • Steady State Power Routing of 300 mW Peak Power − 350 W (8 20 ms) Low Leakage Cathode Indicated by Polarity Band Package Weight: 4.507 mg/wmt Meets IEC61000−4−2 Level 4, 15 kV (Air), 8 kV (Contact) Meets IEC6100−4−4 Level 4, 40 A Meets IEC6100−4−5 (Lightning), 24 A Meets 16 kV Human Body Model ESD Requirements SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant xx = Specific Device Code ZA = SD05T1 ZC = SD12T1 M = Month Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device SZSD05T1G Epoxy Meets UL 94, V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any SD12T1G Package Shipping† SOD−323 (Pb−Free) 3000/Tape & Reel SZSD12T1G QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements Use the Device Number to order the 7 inch/3,000 unit reel. Replace the “T1” with “T3” in the Device Number to order the 13 inch/10,000 unit reel. November, 2017 − Rev. 5 SOD−323 CASE 477 STYLE 1 SD05T1G Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic © Semiconductor Components Industries, LLC, 2014 xx MG G 1 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: SD05T1/D SD05T1 Series, SZSD05T1 Series MAXIMUM RATINGS Rating Symbol Value Unit Ppk 350 Watts ±15 ±8.0 kV 40 A Peak Power Dissipation @ 20 ms (Note 1) @ TL ≤ 25°C IEC 61000−4−2 (ESD) Air Contact IEC 61000−4−4 (EFT) ESD Voltage (Human Body Model (HBM) Waveform per IEC 61000−4−2) VPP 30 kV Total Power Dissipation on FR−4 Board (Note 2) @ TA = 25°C Derate above 25°C °PD° 300 2.4 °mW° mW/°C Thermal Resistance, Junction−to−Ambient RqJA 416 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C TL 260 °C Lead Solder Temperature − Maximum (10 Second Duration) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. *Other voltages may be available upon request. 1. Nonrepetitive current pulse, per Figure 6. 2. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm2. ELECTRICAL CHARACTERISTICS I (TA = 25°C unless otherwise noted) Symbol IF Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM Working Peak Reverse Voltage IR Maximum Reverse Leakage Current @ VRWM VBR Breakdown Voltage @ IT IT Test Current IF Forward Current VF Forward Voltage @ IF VC VBR VRWM V IR VF IT IPP Uni−Directional ELECTRICAL CHARACTERISTICS VBR, Breakdown Voltage (V) Max Capacitance (pF) Max IT mA VC @ IPP = 5 A (Note 3) (V) Max IPP (Note 3) (A) VC @ Max IPP (Note 3) (V) 6.2 7.3 1.0 9.8 24 14.5 350 13.3 15.75 1.0 19 15 25 150 Device VRWM (V) IR @ VRWM (mA) Min SD05T1G 5.0 10 SD12T1G 12 1.0 VR = 0 V f = 1.0 MHz Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. 8 × 20 ms pulse waveform. *Include SZ−prefix devices where applicable. www.onsemi.com 2 SD05T1 Series, SZSD05T1 Series TYPICAL CHARACTERISTICS 280 140 120 240 C, CAPACITANCE (pF) C, CAPACITANCE (pF) 260 220 200 180 160 140 100 60 40 20 120 100 80 0.5 0 1 1.5 2 2.5 3 BIAS (V) 3.5 4 4.5 0 5 0 Figure 1. SD05 Typical Capacitance versus Bias Voltage 8 12 10 100 LEAKAGE CURRENT (nA) LEAKAGE CURRENT (nA) 6 BIAS (V) Figure 2. SD12 Typical Capacitance versus Bias Voltage 1000 100 10 −55 −35 −15 5 25 45 65 85 TEMPERATURE (°C) 10 1 0.1 −55 105 125 145 −30 Figure 3. SD05 Typical Leakage Current versus Temperature 100 100 90 90 80 80 70 60 50 40 30 20 10 0 −5 20 45 70 TEMPERATURE (°C) 95 120 145 Figure 4. SD12 Typical Leakage Current versus Temperature % OF PEAK PULSE CURRENT PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25°C 4 2 PEAK VALUE IRSM @ 8 ms tr PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms 70 60 HALF VALUE IRSM/2 @ 20 ms 50 40 30 tP 20 10 0 25 50 75 100 125 150 175 TA, AMBIENT TEMPERATURE (°C) 200 0 0 Figure 5. Pulse Derating Curve 20 40 t, TIME (ms) 60 Figure 6. 8 × 20 ms Pulse Waveform www.onsemi.com 3 80 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 2 1 STYLE 1 SOD−323 CASE 477−02 ISSUE H 2 SCALE 4:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 5. DIMENSION L IS MEASURED FROM END OF RADIUS. HE D b 1 2 E A3 A C NOTE 3 DATE 13 MAR 2007 1 STYLE 2 L A1 NOTE 5 MILLIMETERS DIM MIN NOM MAX A 0.80 0.90 1.00 A1 0.00 0.05 0.10 A3 0.15 REF b 0.25 0.32 0.4 C 0.089 0.12 0.177 D 1.60 1.70 1.80 E 1.15 1.25 1.35 L 0.08 HE 2.30 2.50 2.70 INCHES NOM MAX 0.035 0.040 0.002 0.004 0.006 REF 0.010 0.012 0.016 0.003 0.005 0.007 0.062 0.066 0.070 0.045 0.049 0.053 0.003 0.090 0.098 0.105 MIN 0.031 0.000 GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT* XX M 0.63 0.025 STYLE 1 0.83 0.033 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 2.85 0.112 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DESCRIPTION: 98ASB17533C SOD−323 STYLE 2 XX = Specific Device Code M = Date Code 1.60 0.063 DOCUMENT NUMBER: XX M STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE STYLE 2: NO POLARITY Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative