SFT1341-C-TL-W

FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 16790HC Generic Copy Issue Date: 11-Aug-2014 TITLE: Final PCN for wafer fab transfer from Gifu in Japan to Niigata in Japan (Group HC). PROPOSED FIRST SHIP DATE: starting on 15-Nov-2014 (the actual ship date will be different by each product, please check the responsible Sales person). AFFECTED CHANGE CATEGORY(S): Wafer Fabrication Location Change FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or Yasuhiro.Igarashi@onsemi.com. SAMPLES: Contact your local ON Semiconductor Sales Office or Shigehito.Matsumoto@onsemi.com . ADDITIONAL RELIABILITY DATA: May be available Contact your local ON Semiconductor Sales Office or Kazutoshi.Kitazume@onsemi.com NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. FPCNs are issued at least 90 days prior to implementation of the change. ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact DESCRIPTION AND PURPOSE: This is a Final Process Change Notification to announce about the transfer of products from ON Semiconductor wafer fabrication sites located in Gifu Japan to the wafer fabrication ON Semiconductor Niigata Co., Ltd. (OSNC). OSNC is located in Niigata, Japan, obtained ISO9001 certification. The product design and electrical specifications will remain identical. A full electrical characterization over the temperature range will be performed for each product to check the device functionality and electrical specifications. Qualification tests are designed to show that the reliability of transferred devices will continue to meet or exceed ON Semiconductor standards. Issue Date: 11-Aug-2014 Rev. 06-Jan-2010 Page 1 of 2 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 16790HC RELIABILITY DATA SUMMARY Group HC Test: Conditions: Interval: Results Steady State Operating Life Tj=150degC 1000 hrs Pass High Temperature Reverse Bias Ta=150degC,VDSS =max 1000 hrs Pass 1000 hrs Pass Temp Humidity Storage Ta=85degC, RH=85% Temperature Cycle Ta=-55degC to 150degC 30min each 100 cycles Pass 50 hrs Pass Pressure Cooker Ta=121degC,2.03×105Pa,100% High Temperature Storage Ta=150degC 1000 hrs Pass Low Temperature Storage Ta=-55degC 1000 hrs Pass Resistance to Soldering heat(Reflow) Solder Temp.:260degC±5degC 10s Pass Solderability Solder Temp.: 245degC±5degC 5s Pass ELECTRICAL CHARACTERISTIC SUMMARY There is no change in the electrical performance. Datasheet specifications remain unchanged. CHANGED PART IDENTIFICATION No change to current part marking will occur. Marking traceability codes will be able to identify wafer fab die source. List of affected Generic parts: Group HC PART_ID BBL4001 BBL4001-1E CPH6354-TL-H MCH3477-TL-H MCH6342-TL-H MCH6421-TL-E MCH6436-TL-E MCH6448-TL-H SFT1341-C-TL-E SFT1341-E SFT1341-TL-E SFT1342-E SFT1342-TL-E Issue Date: 11-Aug-2014 Rev. 06-Jan-2010 Page 2 of 2