SGP5N60RUFDTU

SGP5N60RUFDTU

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SOT78

  • 描述:

    SGP5N60RUFDTU

  • 数据手册
  • 价格&库存
SGP5N60RUFDTU 数据手册
SGP5N60RUFD Short Circuit Rated IGBT General Description Features Fairchild's RUFD series of Insulated Gate Bipolar Transistors (IGBTs) provide low conduction and switching losses as well as short circuit ruggedness. The RUFD series is designed for applications such as motor control, uninterrupted power supplies (UPS) and general inverters where short circuit ruggedness is a required feature. • • • • • Short circuit rated 10us @ TC = 100°C, VGE = 15V High speed switching Low saturation voltage : VCE(sat) = 2.2 V @ IC = 5A High input impedance CO-PAK, IGBT with FRD : trr = 37ns (typ.) Applications AC & DC motor controls, general purpose inverters, robotics, and servo controls. C G GCE TO-220 Absolute Maximum Ratings Symbol VCES VGES IC ICM (1) IF IFM TSC PD TJ Tstg TL E TC = 25°C unless otherwise noted Description Collector-Emitter Voltage Gate-Emitter Voltage Collector Current Collector Current Pulsed Collector Current Diode Continuous Forward Current Diode Maximum Forward Current Short Circuit Withstand Time Maximum Power Dissipation Maximum Power Dissipation Operating Junction Temperature Storage Temperature Range Maximum Lead Temp. for Soldering Purposes, 1/8” from Case for 5 Seconds @ TC = 25°C @ TC = 100°C @ TC = 100°C @ TC = 100°C @ TC = 25°C @ TC = 100°C SGP5N60RUFD 600 ± 20 8 5 15 8 56 10 60 25 -55 to +150 -55 to +150 Units V V A A A A A us W W °C °C 300 °C Notes : (1) Repetitive rating : Pulse width limited by max. junction temperature Thermal Characteristics Symbol RθJC(IGBT) RθJC(DIODE) RθJA Parameter Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient ©2002 Fairchild Semiconductor Corporation Typ. ---- Max. 2.0 1.25 62.5 Units °C/W °C/W °C/W SGP5N60RUFD Rev. A1 SGP5N60RUFD IGBT C Symbol Parameter = 25°C unless otherwise noted Test Conditions Min. Typ. Max. Units 600 -- -- V VGE = 0V, IC = 1mA -- 0.6 -- V/°C VCE = VCES, VGE = 0V VGE = VGES, VCE = 0V --- --- 250 ± 100 uA nA IC = 5mA, VCE = VGE IC = 5A, VGE = 15V IC = 8A, VGE = 15V 5.0 --- 6.0 2.2 2.5 8.5 2.8 -- V V V VCE = 30V, VGE = 0V, f = 1MHz ---- 354 67 14 ---- pF pF pF --------------- 13 24 34 136 88 107 195 13 26 40 250 103 220 323 --50 200 --280 --60 350 ---- ns ns ns ns uJ uJ uJ ns ns ns ns uJ uJ uJ Off Characteristics BVCES ∆BVCES/ ∆TJ ICES IGES Collector-Emitter Breakdown Voltage Temperature Coefficient of Breakdown Voltage Collector Cut-Off Current G-E Leakage Current VGE = 0V, IC = 250uA On Characteristics VGE(th) VCE(sat) G-E Threshold Voltage Collector to Emitter Saturation Voltage Dynamic Characteristics Cies Coes Cres Input Capacitance Output Capacitance Reverse Transfer Capacitance Switching Characteristics td(on) tr td(off) tf Eon Eoff Ets td(on) tr td(off) tf Eon Eoff Ets Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Tsc Short Circuit Withstand Time Qg Qge Qgc Le Total Gate Charge Gate-Emitter Charge Gate-Collector Charge Internal Emitter Inductance VCC = 300 V, IC = 5A, RG = 40Ω, VGE = 15V, Inductive Load, TC = 25°C VCC = 300 V, IC = 5A, RG = 40Ω, VGE = 15V, Inductive Load, TC = 125°C VCC = 300 V, VGE = 15V 100°C C Diode Forward Voltage trr Diode Reverse Recovery Time Irr Diode Peak Reverse Recovery Current Qrr Diode Reverse Recovery Charge ©2002 Fairchild Semiconductor Corporation -- us 16 3 7 7.5 24 6 14 -- nC nC nC nH Min. -- Typ. 1.4 Max. 1.7 Units TC = 100°C -- 1.3 -- TC = 25°C -- 37 55 TC = 100°C -- 55 -- TC = 25°C -- 3.5 5.0 TC = 100°C -- 4.5 -- TC = 25°C -- 65 138 TC = 100°C -- 124 -- Measured 5mm from PKG Parameter VFM -- ----- VCE = 300 V, IC = 5A, VGE = 15V Electrical Characteristics of DIODE T Symbol 10 @ TC = IF = 8A = 25°C unless otherwise noted Test Conditions TC = 25°C IF = 8A, di/dt = 200 A/us V ns A nC SGP5N60RUFD Rev. A1 SGP5N60RUFD Electrical Characteristics of the IGBT T 20 20V Common Emitter T C = 25℃ 15V 15 12V 10 VGE = 10V Common Emitter V GE = 15V T C = 25℃ ━━ T C = 125℃ ------ 16 Collector Current, IC [A] Collector Current, I C [A] 20 12 8 4 5 0 0 0 2 4 6 1 8 Fig 2. Typical Saturation Voltage Characteristics Fig 1. Typical Output Characteristics 10 4.0 VCC = 300V Load Current : peak of square wave Common Emitter V GE = 15V 3.5 8 10A 3.0 Load Current [A] Collector - Emitter Voltage, VCE [V] 10 Collector - Emitter Voltage, V CE [V] Collector - Emitter Voltage, VCE [V] 2.5 5A 2.0 6 4 IC = 3A 2 1.5 Duty cycle : 50% T C = 100℃ Power Dissipation = 12W 0 1.0 -50 0 50 100 0.1 150 1 10 Case Temperature, TC [℃] 100 1000 Frequency [KHz] Fig 3. Saturation Voltage vs. Case Temperature at Variant Current Level Fig 4. Load Current vs. Frequency 20 20 Common Emitter T C = 25℃ Common Emitter T C = 125℃ Collector - Emitter Voltage, VCE [V] Collector - Emitter Voltage, VCE [V] SGP5N60RUFD 25 16 12 8 10A 4 5A 16 12 8 10A 4 5A IC = 3A IC = 3A 0 0 0 4 8 12 16 Gate - Emitter Voltage, V GE [V] Fig 5. Saturation Voltage vs. VGE ©2002 Fairchild Semiconductor Corporation 20 0 4 8 12 16 20 Gate - Emitter Voltage, V GE [V] Fig 6. Saturation Voltage vs. VGE SGP5N60RUFD Rev. A1 Common Emitter VGE = 0V, f = 1MHz TC = 25℃ 500 400 Switching Time [ns] Capacitance [pF] 600 Cies 300 200 Common Emitter VCC = 300V, V GE = ± 15V IC = 5A TC = 25℃ ━━ TC = 125℃ ------ 100 Ton Tr Coes 100 10 Cres 0 1 10 10 100 Gate Resistance, R G [Ω ] Collector - Emitter Voltage, V CE [V] Fig 8. Turn-On Characteristics vs. Gate Resistance Fig 7. Capacitance Characteristics 1000 Switching Loss [uJ] Switching Time [ns] Common Emitter VCC = 300V, V GE = ± 15V IC = 5A TC = 25℃ ━━ TC = 125℃ -----Toff Tf Toff Eoff Eon Eoff 100 Common Emitter V CC = 300V, VGE = ± 15V IC = 5A T C = 25℃ ━━ T C = 125℃ ------ Tf 100 10 10 100 10 Gate Resistance, R G [Ω ] Fig 9. Turn-Off Characteristics vs. Gate Resistance Fig 10. Switching Loss vs. Gate Resistance Common Emitter VGE = ± 15V, RG = 40 Ω TC = 25℃ ━━ TC = 125℃ ------ Common Emitter VGE = ± 15V, RG = 40 Ω TC = 25℃ ━━ TC = 125℃ ------ 1000 100 Ton Tr Switching Time [ns] Switching Time [ns] 100 Gate Resistance, R G [Ω ] Tf Toff Toff Tf 100 10 3 4 5 6 7 8 Collector Current, IC [A] Fig 11. Turn-On Characteristics vs. Collector Current ©2002 Fairchild Semiconductor Corporation 9 10 3 4 5 6 7 8 9 10 Collector Current, IC [A] Fig 12. Turn-Off Characteristics vs. Collector Current SGP5N60RUFD Rev. A1 SGP5N60RUFD 700 15 Gate - Emitter Voltage, VGE [V] Common Emitter VGE = ± 15V, RG = 40Ω T C = 25℃ ━━ T C = 125℃ ------ Switching Loss [uJ] SGP5N60RUFD 1000 Eoff 100 Eon Common Emitter RL = 60Ω T C = 25℃ 12 300V 200V VCC = 100V 9 6 3 0 3 4 5 6 7 8 9 0 10 3 6 9 12 15 18 Gate Charge, Qg [nC] Collector Current, IC [A] Fig 14. Gate Charge Characteristics Fig 13. Switching Loss vs. Collector Current 50 40 Ic MAX. (Pulsed) 50us 1㎳ DC Operation 1 0.1 100us Ic MAX. (Continuous) Collector Current, I C [A] Collector Current, IC [A] 10 Single Nonrepetitive Pulse TC = 25℃ Curves must be derated linearly with increase in temperature 0.01 0.1 1 10 Safe Operating Area VGE = 20V, TC = 100℃ 1 10 100 1 1000 10 100 1000 Collector-Emitter Voltage, VCE [V] Collector-Emitter Voltage, V CE [V] Fig 16. Turn-Off SOA Characteristics Fig 15. SOA Characteristic Thermal Response, Zthjc [℃/W] 10 1 0.5 0.2 0.1 0.05 0.1 Pdm 0.02 t1 0.01 t2 Duty factor D = t1 / t2 Peak Tj = Pdm × Zthjc + TC single pulse 0.01 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 Rectangular Pulse Duration [sec] Fig 17. Transient Thermal Impedance of IGBT ©2002 Fairchild Semiconductor Corporation SGP5N60RUFD Rev. A1 100 VR = 200V IF = 8A TC = 25℃ ━━ TC = 100℃ ------ Reverse Recovery Current, I rr [A] Forward Current, I F [A] TC = 25℃ ━━ TC = 100℃ ------ 10 1 10 1 0.1 0 1 2 100 3 1000 di/dt [A/us] Forward Voltage Drop, VF [V] Fig 19. Reverse Recovery Current Fig 18. Forward Characteristics 100 500 V R = 200V IF = 8A T C = 25℃ ━━ T C = 100℃ ------ 400 Reverce Recovery Time, t rr [ns] Stored Recovery Charge, Qrr [nC] SGP5N60RUFD 100 300 200 100 0 100 1000 di/dt [A/us] Fig 20. Stored Charge ©2002 Fairchild Semiconductor Corporation 80 V R = 200V IF = 8A T C = 25℃ ━━ T C = 100℃ ------ 60 40 20 0 100 1000 di/dt [A/us] Fig 21. Reverse Recovery Time SGP5N60RUFD Rev. A1 TO-220 4.50 ±0.20 2.80 ±0.10 (3.00) +0.10 1.30 –0.05 18.95MAX. (3.70) ø3.60 ±0.10 15.90 ±0.20 1.30 ±0.10 (8.70) (1.46) 9.20 ±0.20 (1.70) 9.90 ±0.20 (45° 1.52 ±0.10 0.80 ±0.10 2.54TYP [2.54 ±0.20] 10.08 ±0.30 (1.00) 13.08 ±0.20 ) 1.27 ±0.10 +0.10 0.50 –0.05 2.40 ±0.20 2.54TYP [2.54 ±0.20] 10.00 ±0.20 Dimensions in Millimeters ©2002 Fairchild Semiconductor Corporation SGP5N60RUFD Rev. A1 SGP5N60RUFD Package Dimension TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ DenseTrench™ DOME™ EcoSPARK™ E2CMOS™ EnSigna™ FACT™ FACT Quiet Series™ FAST® FASTr™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ I2C™ ISOPLANAR™ LittleFET™ MicroFET™ MicroPak™ MICROWIRE™ OPTOLOGIC™ OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerTrench® QFET™ QS™ QT Optoelectronics™ Quiet Series™ SLIENT SWITCHER® SMART START™ SPM™ STAR*POWER™ Stealth™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ TruTranslation™ UHC™ UltraFET® VCX™ STAR*POWER is used under license DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems 2. A critical component is any component of a life support which, (a) are intended for surgical implant into the body, device or system whose failure to perform can be or (b) support or sustain life, or (c) whose failure to perform reasonably expected to cause the failure of the life support when properly used in accordance with instructions for use device or system, or to affect its safety or effectiveness. provided in the labeling, can be reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. ©2002 Fairchild Semiconductor Corporation Rev. H5
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