SGW10N60RUFD
Short Circuit Rated IGBT
General Description
Features
Fairchild's RUFD series of Insulated Gate Bipolar
Transistors (IGBTs) provide low conduction and switching
losses as well as short circuit ruggedness. The RUFD
series is designed for applications such as motor control,
uninterrupted power supplies (UPS) and general inverters
where short circuit ruggedness is a required feature.
•
•
•
•
•
Short circuit rated 10us @ TC = 100°C, VGE = 15V
High speed switching
Low saturation voltage : VCE(sat) = 2.2 V @ IC = 10A
High input impedance
CO-PAK, IGBT with FRD : trr = 42ns (typ.)
Applications
AC & DC motor controls, general purpose inverters, robotics, and servo controls.
C
C
G
G
E
D2-PAK
E
Absolute Maximum Ratings
Symbol
VCES
VGES
IC
ICM (1)
IF
IFM
TSC
PD
TJ
Tstg
TL
TC = 25°C unless otherwise noted
Description
Collector-Emitter Voltage
Gate-Emitter Voltage
Collector Current
Collector Current
Pulsed Collector Current
Diode Continuous Forward Current
Diode Maximum Forward Current
Short Circuit Withstand Time
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction Temperature
Storage Temperature Range
Maximum Lead Temp. for Soldering
Purposes, 1/8” from Case for 5 Seconds
@ TC = 25°C
@ TC = 100°C
@ TC = 100°C
@ TC = 100°C
@ TC = 25°C
@ TC = 100°C
SGW10N60RUFD
600
± 20
16
10
30
12
92
10
75
30
-55 to +150
-55 to +150
Units
V
V
A
A
A
A
A
us
W
W
°C
°C
300
°C
Notes :
(1) Repetitive rating : Pulse width limited by max. junction temperature
Thermal Characteristics
Symbol
RθJC(IGBT)
RθJC(DIODE)
RθJA
Parameter
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient (PCB Mount) (2)
Typ.
----
Max.
1.6
2.5
40
Units
°C/W
°C/W
°C/W
Notes :
(2) Mounted on 1” squre PCB (FR4 or G-10 Material)
©2002 Fairchild Semiconductor Corporation
SGW10N60RUFD Rev. A1
SGW10N60RUFD
IGBT
C
Symbol
Parameter
= 25°C unless otherwise noted
Test Conditions
Min.
Typ.
Max.
Units
600
--
--
V
VGE = 0V, IC = 1mA
--
0.6
--
V/°C
VCE = VCES, VGE = 0V
VGE = VGES, VCE = 0V
---
---
250
± 100
uA
nA
IC = 10mA, VCE = VGE
IC = 10A, VGE = 15V
IC = 16A, VGE = 15V
5.0
---
6.0
2.2
2.5
8.5
2.8
--
V
V
V
----
660
115
25
----
pF
pF
pF
---------------
15
30
36
158
141
215
356
16
33
42
242
161
452
613
--50
200
--500
--60
350
--860
ns
ns
ns
ns
uJ
uJ
uJ
ns
ns
ns
ns
uJ
uJ
uJ
Off Characteristics
BVCES
∆BVCES/
∆TJ
ICES
IGES
Collector-Emitter Breakdown Voltage
Temperature Coefficient of Breakdown
Voltage
Collector Cut-Off Current
G-E Leakage Current
VGE = 0V, IC = 250uA
On Characteristics
VGE(th)
VCE(sat)
G-E Threshold Voltage
Collector to Emitter
Saturation Voltage
Dynamic Characteristics
Cies
Coes
Cres
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
VCE = 30V, VGE = 0V,
f = 1MHz
Switching Characteristics
td(on)
tr
td(off)
tf
Eon
Eoff
Ets
td(on)
tr
td(off)
tf
Eon
Eoff
Ets
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Tsc
Short Circuit Withstand Time
Qg
Qge
Qgc
Le
Total Gate Charge
Gate-Emitter Charge
Gate-Collector Charge
Internal Emitter Inductance
VCC = 300 V, IC = 10A,
RG = 20Ω, VGE = 15V,
Inductive Load, TC = 25°C
VCC = 300 V, IC = 10A,
RG = 20Ω, VGE = 15V,
Inductive Load, TC = 125°C
VCC = 300 V, VGE = 15V
100°C
VFM
Diode Forward Voltage
trr
Diode Reverse Recovery Time
Irr
Diode Peak Reverse Recovery
Current
Qrr
Diode Reverse Recovery Charge
©2002 Fairchild Semiconductor Corporation
--
us
30
5
8
7.5
45
10
16
--
nC
nC
nC
nH
Min.
--
Typ.
1.4
Max.
1.7
Units
--
1.3
--
TC = 25°C
--
42
60
TC = 100°C
--
60
--
TC = 25°C
--
3.5
6.0
TC = 100°C
--
5.6
--
TC = 25°C
--
80
180
TC = 100°C
--
220
--
Measured 5mm from PKG
C
Parameter
--
-----
VCE = 300 V, IC = 10A,
VGE = 15V
Electrical Characteristics of DIODE T
Symbol
10
@ TC =
= 25°C unless otherwise noted
Test Conditions
TC = 25°C
IF = 12A
TC = 100°C
IF = 12A,
di/dt = 200A/us
V
ns
A
nC
SGW10N60RUFD Rev. A1
SGW10N60RUFD
Electrical Characteristics of the IGBT T
Common Emitter
TC = 25℃
35
15V
20V
Common Emitter
VGE = 15V
TC = 25℃ ━━
TC = 125℃ ------
25
Collector Current, IC [A]
Collector Current, I C [A]
SGW10N60RUFD
30
40
30
12V
25
20
V GE = 10V
15
20
15
10
10
5
5
0
0
0
2
4
6
8
1
Collector - Emitter Voltage, V CE [V]
Fig 1. Typical Output Characteristics
Fig 2. Typical Saturation Voltage Characteristics
16
Common Emitter
V GE = 15V
VCC = 300V
Load Current : peak of square wave
14
3.5
20A
12
Load Current [A]
Collector - Emitter Voltage, VCE [V]
4.0
3.0
2.5
10A
2.0
10
8
6
4
IC = 5A
1.5
Duty cycle : 50%
T C = 100℃
Power Dissipation = 18W
2
0
1.0
-50
0
50
100
0.1
150
1
10
Case Temperature, T C [℃]
100
1000
Frequency [KHz]
Fig 3. Saturation Voltage vs. Case
Temperature at Variant Current Level
Fig 4. Load Current vs. Frequency
20
20
Common Emitter
T C = 125℃
Collector - Emitter Voltage, VCE [V]
Common Emitter
T C = 25℃
Collector - Emitter Voltage, VCE [V]
10
Collector - Emitter Voltage, V CE [V]
16
12
8
20A
4
10A
IC = 5A
0
16
12
8
20A
4
10A
IC = 5A
0
0
4
8
12
16
Gate - Emitter Voltage, V GE [V]
Fig 5. Saturation Voltage vs. VGE
©2002 Fairchild Semiconductor Corporation
20
0
4
8
12
16
20
Gate - Emitter Voltage, VGE [V]
Fig 6. Saturation Voltage vs. VGE
SGW10N60RUFD Rev. A1
SGW10N60RUFD
1400
Common Emitter
V GE = 0V, f = 1MHz
T C = 25℃
1200
Switching Time [ns]
Capacitance [pF]
1000
Cies
800
Common Emitter
V CC = 300V, V GE = ± 15V
IC = 10A
T C = 25℃ ━━
T C = 125℃ ------
600
400
Ton
Tr
100
Coes
200
Cres
10
0
1
10
10
Fig 7. Capacitance Characteristics
Switching Time [ns]
1000
100
Gate Resistance, R G [Ω ]
Collector - Emitter Voltage, VCE [V]
Fig 8. Turn-On Characteristics vs.
Gate Resistance
Common Emitter
VCC = 300V, V GE = ± 15V
IC = 10A
TC = 25℃ ━━
TC = 125℃ ------
1000
Switching Loss [uJ]
Toff
Common Emitter
VCC = 300V, VGE = ± 15V
IC = 10A
TC = 25℃ ━━
TC = 125℃ ------
Toff
Tf
Tf
Eoff
Eon
Eoff
100
100
10
100
10
100
Gate Resistance, R G [Ω ]
Gate Resistance, RG [Ω ]
Fig 9. Turn-Off Characteristics vs.
Gate Resistance
Fig 10. Switching Loss vs. Gate Resistance
1000
Common Emitter
VGE = ± 15V, RG = 20 Ω
TC = 25℃ ━━
TC = 125℃ ------
100
Switching Time [ns]
Switching Time [ns]
Common Emitter
V GE = ± 15V, RG = 20Ω
T C = 25℃ ━━
T C = 125℃ -----Ton
Tr
Toff
Tf
Toff
Tf
100
10
6
8
10
12
14
16
Collector Current, IC [A]
Fig 11. Turn-On Characteristics vs.
Collector Current
©2002 Fairchild Semiconductor Corporation
18
20
6
8
10
12
14
16
18
20
Collector Current, IC [A]
Fig 12. Turn-Off Characteristics vs.
Collector Current
SGW10N60RUFD Rev. A1
Gate - Emitter Voltage, VGE [ V ]
Switching Loss [uJ]
1000
Eoff
100
Eon
SGW10N60RUFD
15
Common Emitter
VGE = ± 15V, RG = 20 Ω
TC = 25℃ ━━
TC = 125℃ ------
Common Emitter
RL = 30 Ω
TC = 25℃
12
300 V
VCC = 100 V
200 V
9
6
3
0
5
10
15
20
0
10
Collector Current, IC [A]
20
30
Gate Charge, Qg [ nC ]
Fig 13. Switching Loss vs. Collector Current
Fig 14. Gate Charge Characteristics
100
50
IC MAX. (Pulsed)
10
Collector Current, I C [A]
Collector Current, I C [A]
50us
IC MAX. (Continuous)
100us
1㎳
DC Operation
1
Single Nonrepetitive
Pulse T C = 25℃
Curves must be derated
linearly with increase
in temperature
10
Safe Operating Area
V GE = 20V, T C = 100℃
1
0.1
0.1
1
10
100
1
1000
10
100
1000
Collector-Emitter Voltage, V CE [V]
Collector-Emitter Voltage, V CE [V]
Fig 15. SOA Characteristics
Fig 16. Turn-Off SOA Characteristics
Thermal Response, Zthjc [℃/W]
10
1
0.5
0.2
0.1
0.1
0.05
Pdm
0.02
t1
0.01
t2
0.01
Duty factor D = t1 / t2
Peak Tj = Pdm × Zthjc + TC
single pulse
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
Rectangular Pulse Duration [sec]
Fig 17. Transient Thermal Impedance of IGBT
©2002 Fairchild Semiconductor Corporation
SGW10N60RUFD Rev. A1
SGW10N60RUFD
100
T C = 25℃ ━━
T C = 100℃ ------
Reverse Recovery Current, I rr [A]
Forward Current, I F [A]
100
10
1
2
10
1
100
1
0
V R = 200V
IF = 12A
T C = 25℃ ━━
T C = 100℃ ------
3
Fig 18. Forward Characteristics
Fig 19. Reverse Recovery Current
100
V R = 200V
IF = 12A
T C = 25℃ ━━
T C = 100℃ ------
Reverce Recovery Time, t rr [ns]
Stored Recovery Charge, Qrr [nC]
600
500
1000
di/dt [A/us]
Forward Voltage Drop, VFM [V]
400
300
200
100
0
100
1000
di/dt [A/us]
Fig 20. Stored Charge
©2002 Fairchild Semiconductor Corporation
VR=200V
IF=12A
TC = 25℃ ━━
TC = 100℃ ------
80
60
40
20
0
100
1000
di/dt [A/us]
Fig 21. Reverse Recovery Time
SGW10N60RUFD Rev. A1
SGW10N60RUFD
Package Dimension
4.50 ±0.20
9.90 ±0.20
+0.10
2.00 ±0.10
2.54 TYP
(0.75)
°
~3
0°
0.80 ±0.10
1.27 ±0.10
2.54 ±0.30
15.30 ±0.30
0.10 ±0.15
2.40 ±0.20
4.90 ±0.20
1.40 ±0.20
9.20 ±0.20
1.30 –0.05
1.20 ±0.20
(0.40)
D2-PAK
+0.10
0.50 –0.05
2.54 TYP
9.20 ±0.20
(2XR0.45)
4.90 ±0.20
15.30 ±0.30
10.00 ±0.20
(7.20)
(1.75)
10.00 ±0.20
(8.00)
(4.40)
0.80 ±0.10
Dimensions in Millimeters
©2002 Fairchild Semiconductor Corporation
SGW10N60RUFD Rev. A1
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
ACEx™
Bottomless™
CoolFET™
CROSSVOLT™
DenseTrench™
DOME™
EcoSPARK™
E2CMOS™
EnSigna™
FACT™
FACT Quiet Series™
FAST®
FASTr™
FRFET™
GlobalOptoisolator™
GTO™
HiSeC™
I2C™
ISOPLANAR™
LittleFET™
MicroFET™
MicroPak™
MICROWIRE™
OPTOLOGIC™
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerTrench®
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SLIENT SWITCHER®
SMART START™
SPM™
STAR*POWER™
Stealth™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
TruTranslation™
UHC™
UltraFET®
VCX™
STAR*POWER is used under license
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
2. A critical component is any component of a life support
which, (a) are intended for surgical implant into the body,
device or system whose failure to perform can be
or (b) support or sustain life, or (c) whose failure to perform
reasonably expected to cause the failure of the life support
when properly used in accordance with instructions for use
device or system, or to affect its safety or effectiveness.
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In
Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
©2002 Fairchild Semiconductor Corporation
Rev. H5
This datasheet has been download from:
www.datasheetcatalog.com
Datasheets for electronics components.