SI4410DY

Si4410DY* Single N-Channel Logic Level PowerTrench MOSFET General Description Features This N-Channel Logic Level MOSFET is produced using Fairchild Semiconductor's advanced PowerTrench process that has been especially tailored to minimize on-state resistance and yet maintain superior switching performance. • • Low gate charge. This device is well suited for low voltage and battery powered applications where low in-line power loss and fast switching are required. • Fast switching speed. • Applications High performance trench technology for extremely low RDS(ON). • High power and current handling capability. • • • 10 A, 30 V. RDS(ON) = 0.0135 Ω @ VGS = 10 V RDS(ON) = 0.020 Ω @ VGS = 4.5 V Battery switch Load switch Motor controls ' ' ' ' 62 6 6 6 * $EVROXWH0D[LPXP5DWLQJV $ 7  6\PERO         ƒ&XQOHVVRWKHUZLVHQRWHG 3DUDPHWHU 5DWLQJV 8QLWV 9'66 'UDLQ6RXUFH9ROWDJH  9 9*66 *DWH6RXUFH9ROWDJH ± 9 ,' 'UDLQ&XUUHQW  $ &RQWLQXRXV 1RWHD 3XOVHG 3' 3RZHU'LVVLSDWLRQIRU6LQJOH2SHUDWLRQ  1RWHD  1RWHE  1RWHF 7-767* 2SHUDWLQJDQG6WRUDJH-XQFWLRQ7HPSHUDWXUH5DQJH :  WR °& 7KHUPDO&KDUDFWHULVWLFV 5 7KHUPDO5HVLVWDQFH-XQFWLRQWR$PELHQW 1RWHD  °&: 5θ-& 7KHUPDO5HVLVWDQFH-XQFWLRQWR&DVH 1RWH  °&: θ-$ 3DFNDJH2XWOLQHVDQG2UGHULQJ,QIRUPDWLRQ 'HYLFH0DUNLQJ 'HYLFH 5HHO6L]H 7DSH:LGWK 4XDQWLW\  6,'< ¶¶ PP XQLWV  'LHDQGPDQXIDFWXULQJVRXUFHVXEMHFWWRFKDQJHZLWKRXWSULRUQRWLILFDWLRQ 1999 Fairchild Semiconductor Corporation Si4410DY Rev. B Si4410DY May 1999 7  6\PERO 3DUDPHWHU ƒ&XQOHVVRWKHUZLVHQRWHG 7HVW&RQGLWLRQV 0LQ 7\S 0D[ 8QLWV 2II&KDUDFWHULVWLFV %9'66 'UDLQ6RXUFH%UHDNGRZQ 9*6 9,' µ  $  9 9ROWDJH ∆%9 ∆7 '66 %UHDNGRZQ9ROWDJH - 7HPSHUDWXUH&RHIILFLHQW ,'66 ,' µ °  $5HIHUHQFHGWR & P9 &  =HUR*DWH9ROWDJH'UDLQ 9'6 99*6 9 &XUUHQW 9'6 99*6 97- *DWH%RG\/HDNDJH&XUUHQW 9*6 99'6 9 9*6 99'6 *DWH7KUHVKROG9ROWDJH 9'6 9*6,' *6WK *DWH7KUHVKROG9ROWDJH ,' - 7HPSHUDWXUH&RHIILFLHQW ,*66) °  °  & µ$   Q$  Q$ )RUZDUG ,*665 *DWH%RG\/HDNDJH&XUUHQW 9 5HYHUVH 2Q&KDUDFWHULVWLFV 1RWH 9*6WK ∆9 ∆7 5'6RQ µ  $  µ °  $5HIHUHQFHGWR & 6WDWLF'UDLQ6RXUFH 9*6 9,' $ 2Q5HVLVWDQFH 9*6 9,' $7- 9*6 9,' ,'RQ 2Q6WDWH'UDLQ&XUUHQW 9*6 99'6 J)6 )RUZDUG7UDQVFRQGXFWDQFH 9'6 9,' 9'6 99*6 °  & $ 9 9 °  P9 &        $ Ω $  6 '\QDPLF&KDUDFWHULVWLFV &LVV ,QSXW&DSDFLWDQFH &RVV 2XWSXW&DSDFLWDQFH &UVV 5HYHUVH7UDQVIHU I 9 0+]  S)  S)  S) &DSDFLWDQFH 6ZLWFKLQJ&KDUDFWHULVWLFV 1RWH WGRQ 7XUQ2Q'HOD\7LPH 9'' 9,' WU 7XUQ2Q5LVH7LPH 9*6 95*(1 WGRII 7XUQ2II'HOD\7LPH WI 7XUQ2II)DOO7LPH WUU 'UDLQ6RXUFH5HYHUVH ,) $5/ $GLGW Ω  Ω  µ $ V  QV  QV  QV  QV  Q6  Q& 5HFRYHU\7LPH 4J 7RWDO*DWH&KDUJH 4JV *DWH6RXUFH&KDUJH 4JG *DWH'UDLQ&KDUJH 9'6 9,' 9*6 9 $   Q&  Q& 'UDLQ6RXUFH'LRGH&KDUDFWHULVWLFVDQG0D[LPXP5DWLQJV ,6 0D[LPXP&RQWLQXRXV'UDLQ6RXUFH'LRGH)RUZDUG&XUUHQW 96' 'UDLQ6RXUFH'LRGH)RUZDUG 9*6 9,6 $1RWH   $  9 9ROWDJH Notes: 1: RθJA is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a) 50° C/W when mounted on a 1 in2 pad of 2 oz. copper. b) 105° C/W when mounted on a 0.04 in2 pad of 2 oz. copper. c) 125° C/W on a minimum mounting pad. Scale 1 : 1 on letter size paper 2: Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0% Si4410DY Rev. B Si4410DY (OHFWULFDO&KDUDFWHULVWLFV $ SOIC-8 Tape and Reel Data SOIC(8lds) Packaging Configuration: Figure 1.0 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES Packaging Description: SOIC-8 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped with 2,500 units per 13" or 330cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (antistatic coated). Other option comes in 500 units per 7" or 177cm diameter reel. This and some other options are further described in the Packaging Information table. Embossed ESD Marking TION NS ATTEE NPRECAUTIO G RV HANDLIN OBSEFO IC R OSTAT ELECTR ITIVE SENS ES DEVIC Antistatic Cover Tape These full reels are individually barcode labeled and placed inside a standard intermediate box (illustrated in figure 1.0) made of recyclable corrugated brown paper. One box contains two reels maximum. And these boxes are placed inside a barcode labeled shipping box which comes in different sizes depending on the number of parts shipped. Static Dissipative Embossed Carrier Tape F63TNR Label Customized Label F852 NDS 9959 F852 NDS 9959 F852 NDS 9959 F852 NDS 9959 F852 NDS 9959 Pin 1 SOIC (8lds) Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Standard (no flow code) TNR 2,500 L86Z F011 D84Z Rail/Tube TNR TNR 95 4,000 500 13" Dia - 13" Dia 7" Dia 355x333x40 530x130x83 355x333x40 193x183x80 Max qty per Box 5,000 30,000 8,000 2,000 Weight per unit (gm) 0.0774 0.0774 0.0774 0.0774 Weight per Reel (kg) 0.6060 - 0.9696 0.1182 Reel Size Box Dimension (mm) SOIC-8 Unit Orientation Barcode Label Note/Comments Barcode Label Barcode Label 355mm x 333mm x 40mm Intermediate container for 13” reel option F63TNR Label sample 193mm x 183mm x 80mm Pizza Box for Standard Option SOIC(8lds) Tape Leader and Trailer Configuration: Figure 2.0 LOT: CBVK741B019 QTY: 2500 FSID: FDS9953A SPEC: D/C1: Z 9842AB D/C2: QTY1: QTY2: SPEC REV: CPN: N/F: F (F63TNR)3 Carrier Tape Cover Tape Components Trailer Tape 640mm minimum or 80 empty pockets ©2001 Fairchild Semiconductor Corporation Leader Tape 1680mm minimum or 210 empty pockets January 2001, Rev. C SOIC-8 Tape and Reel Data, continued SOIC(8lds) Embossed Carrier Tape Configuration: Figure 3.0 P0 D0 T E1 F K0 Wc W E2 B0 Tc A0 D1 P1 User Direction of Feed Dimensions are in millimeter Pkg type SOIC(8lds) (12mm) A0 5.30 +/-0.10 B0 6.50 +/-0.10 W 12.0 +/-0.3 D0 D1 1.55 +/-0.05 E1 1.60 +/-0.10 E2 1.75 +/-0.10 F 10.25 min P1 5.50 +/-0.05 P0 8.0 +/-0.1 4.0 +/-0.1 K0 2.1 +/-0.10 Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C). T Wc 0.450 +/0.150 9.2 +/-0.3 0.06 +/-0.02 0.5mm maximum 20 deg maximum Typical component cavity center line B0 Tc 0.5mm maximum 20 deg maximum component rotation Typical component center line Sketch A (Side or Front Sectional View) A0 Component Rotation Sketch C (Top View) Component lateral movement Sketch B (Top View) SOIC(8lds) Reel Configuration: Figure 4.0 Component Rotation W1 Measured at Hub Dim A Max Dim A max See detail AA Dim N 7" Diameter Option B Min Dim C See detail AA W3 13" Diameter Option Dim D min W2 max Measured at Hub DETAIL AA Dimensions are in inches and millimeters Tape Size Reel Option Dim A Dim B 0.059 1.5 512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 2.165 55 0.488 +0.078/-0.000 12.4 +2/0 0.724 18.4 0.469 – 0.606 11.9 – 15.4 0.059 1.5 512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 7.00 178 0.488 +0.078/-0.000 12.4 +2/0 0.724 18.4 0.469 – 0.606 11.9 – 15.4 12mm 7" Dia 7.00 177.8 12mm 13" Dia 13.00 330  1998 Fairchild Semiconductor Corporation Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL) January 2001, Rev. C SOIC-8 Package Dimensions SOIC-8 (FS PKG Code S1) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.0774 9 ©2000 Fairchild Semiconductor International September 1998, Rev. A TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ DOME™ E2CMOSTM EnSignaTM FACT™ FACT Quiet Series™ FAST  FASTr™ GlobalOptoisolator™ GTO™ HiSeC™ ISOPLANAR™ MICROWIRE™ OPTOLOGIC™ OPTOPLANAR™ PACMAN™ POP™ PowerTrench  QFET™ QS™ QT Optoelectronics™ Quiet Series™ SILENT SWITCHER  SMART START™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ UHC™ VCX™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. G