SM05T1_11

SM05T1 Series Transient Voltage Suppressor Diode Array SOT−23 Dual Common Anode Diodes for ESD Protection These dual monolithic silicon TVS diodes are designed for applications requiring transient overvoltage protection capability. They are intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. Their dual junction common anode design protects two separate lines using only one package. These devices are ideal for situations where board space is at a premium. Specification Features: http://onsemi.com PIN 1. CATHODE 2. CATHODE 3. ANODE 1 2 3 3 1 • SOT−23 Package Allows Either Two Separate Unidirectional • • • • • Configurations or a Single Bidirectional Configuration Working Peak Reverse Voltage Range − 5.0 V to 24 V Peak Power − 300 Watt (8 X 20 ms) Low Leakage Flammability Rating UL 94 V−0 These are Pb−Free Devices SOT−23 CASE 318 STYLE 12 2 MARKING DIAGRAM xxM MG G 1 xxM = Device Code xx = 05, 12, 15, 24, 36 M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or overbar may vary depending upon manufacturing location. Mechanical Characteristics: CASE: Void-Free, Transfer-Molded, Thermosetting Plastic Case FINISH: Corrosion Resistant Finish, Easily Solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds Package Designed for Optimal Automated Board Assembly Small Package Size for High Density Applications Available in 8 mm Tape and Reel Use the Device Number to Order the 7 Inch/3,000 Unit Reel Replace the “T1” with “T3” in the Device Number to Order the 13 Inch/10,000 Unit Reel ORDERING INFORMATION Device SM05T1G SM12T1G SM15T1G SM24T1G SM36T1G Package SOT−23 (Pb−Free) SOT−23 (Pb−Free) SOT−23 (Pb−Free) SOT−23 (Pb−Free) SOT−23 (Pb−Free) Shipping† 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2011 July, 2011 − Rev. 4 1 Publication Order Number: SM05T1/D SM05T1 Series MAXIMUM RATINGS Rating Peak Power Dissipation @ 20 ms (Note 1) @ TL ≤ 25°C IEC 61000−4−2 (ESD) IEC 61000−4−4 (EFT) IEC 61000−4−5 (Lightening) Total Power Dissipation on FR−5 Board (Note 2) @ TA = 25°C Derate above 25°C Thermal Resistance, Junction−to−Ambient Total Power Dissipation on Alumina Substrate (Note 3) @ TA = 25°C Derate above 25°C Thermal Resistance, Junction−to−Ambient Junction and Storage Temperature Range Lead Solder Temperature − Maximum (10 Second Duration) °PD° RqJA °PD RqJA TJ, Tstg TL Air Contact Symbol Ppk Value 300 ±15 ±8.0 40 12 225 1.8 556 300 2.4 417 − 55 to +150 260 Unit W kV A A °mW° mW/°C °C/W °mW mW/°C °C/W °C °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Non−repetitive current pulse per Figure 3 2. FR−5 = 1.0 x 0.75 x 0.62 in. 3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina NOTE: Other voltages may be available upon request ELECTRICAL CHARACTERISTICS UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3) Symbol IPP VC VRWM IR VBR IT QVBR IF VF ZZT IZK ZZK Parameter Maximum Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current Maximum Temperature Coefficient of VBR Forward Current Forward Voltage @ IF Maximum Zener Impedance @ IZT Reverse Current Maximum Zener Impedance @ IZK IPP VC VBR VRWM IR VF IT V IF I Uni−Directional TVS ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) VBR, Breakdown Voltage VRWM Device SM05T1G SM12T1G SM15T1G SM24T1G SM36T1G Device Marking 05M 12M 15M 24M 36M (Volts) 5 12 15 24 36 IR @ VRWM (mA) 10 1.0 1.0 1.0 1.0 Min 6.2 13.3 16.7 26.7 40.0 (Volts) Max 7.3 15.75 19.6 31.35 46.95 IT mA 1.0 1.0 1.0 1.0 1.0 VC @ IPP = 1 Amp (Volts) 9.8 19 24 43 60 Max IPP (Note 4) (Amps) 17 12 10 5.0 4.0 Typical Capacitance (pF) Pin 1 to 3 @ 0 Volts 225 95 100 60 45 4. 8 × 20 ms pulse waveform per Figure 3 http://onsemi.com 2 SM05T1 Series TYPICAL CHARACTERISTICS 10 PPP, PEAK PULSE POWER (kW) PD, POWER DISSIPATION (mW) 300 250 200 150 100 50 0 ALUMINA SUBSTRATE 1 0.1 FR−5 BOARD 0.01 0.1 1 100 10 tp, PULSE DURATION (ms) 1000 0 25 50 75 100 125 TEMPERATURE (°C) 150 175 Figure 1. Non−Repetitive Peak Pulse Power versus Pulse Time Figure 2. Steady State Power Derating Curve 100 % OF PEAK PULSE CURRENT 90 80 70 60 50 40 30 20 10 0 0 tr PEAK VALUE IRSM @ 8 ms C, CAPACITANCE (pF) PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms HALF VALUE IRSM/2 @ 20 ms 250 210 170 tP 130 20 40 t, TIME (ms) 60 80 90 0 1 2 3 BIAS VOLTAGE (VOLTS) 4 5 Figure 3. 8 × 20 ms Pulse Waveform Figure 4. Typical Diode Capacitance (SM05) 100 90 C, CAPACITANCE (pF) 80 70 60 50 40 30 20 10 0 0 1 5 8 BIAS VOLTAGE (VOLTS) 12 Figure 5. Typical Diode Capacitance (SM12) http://onsemi.com 3 SM05T1 Series TYPICAL COMMON ANODE APPLICATIONS A quad junction common anode design in a SOT−23 package protects four separate lines using only one package. This adds flexibility and creativity to PCB design especially when board space is at a premium. Two simplified examples of TVS applications are illustrated below. Computer Interface Protection A KEYBOARD TERMINAL PRINTER ETC. B I/O C D FUNCTIONAL DECODER GND SM05T1 Series Microprocessor Protection VDD VGG ADDRESS BUS RAM ROM DATA BUS I/O CPU CLOCK CONTROL BUS SM05T1 Series GND SM05T1 Series http://onsemi.com 4 SM05T1 Series PACKAGE DIMENSIONS SOT−23 (TO−236) CASE 318−08 ISSUE AN D SEE VIEW C 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318−01 THRU −07 AND −09 OBSOLETE, NEW STANDARD 318−08. MILLIMETERS NOM MAX 1.00 1.11 0.06 0.10 0.44 0.50 0.13 0.18 2.90 3.04 1.30 1.40 1.90 2.04 0.20 0.30 0.54 0.69 2.40 2.64 INCHES NOM 0.040 0.002 0.018 0.005 0.114 0.051 0.075 0.008 0.021 0.094 E 1 2 HE c e b q 0.25 A A1 L L1 VIEW C DIM A A1 b c D E e L L1 HE MIN 0.89 0.01 0.37 0.09 2.80 1.20 1.78 0.10 0.35 2.10 MIN 0.035 0.001 0.015 0.003 0.110 0.047 0.070 0.004 0.014 0.083 MAX 0.044 0.004 0.020 0.007 0.120 0.055 0.081 0.012 0.029 0.104 STYLE 12: PIN 1. CATHODE 2. CATHODE 3. ANODE SOLDERING FOOTPRINT* 0.95 0.037 0.95 0.037 2.0 0.079 0.9 0.035 0.8 0.031 SCALE 10:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 5 SM05T1/D