SMDA05-6R2

SMDA05−6R2 Unidirectional TVS Array for High−Speed Data Line Protection The SMDA05−6R2 transient voltage suppressor is designed to protect equipment attached to up to six high speed communication lines from ESD, EFT, and lightning. Features: SO−8 VOLTAGE SUPPRESSOR 300 WATTS PEAK POWER 6 VOLTS • SO−8 Package • Peak Power − 400 Watts 8 x 20 mS • ESD Rating: • http://onsemi.com IEC 61000−4−2 (ESD) 15 kV (air) 8 kV (contact) IEC 61000−4−4 (EFT) 40 A (5/50 ns) IEC 61000−4−5 (lightning) 12 (8/20 ms) UL Flammability Rating of 94 V−0 PIN CONFIGURATION AND SCHEMATIC Typical Applications: • • • • • • • • High Speed Communication Line Protection 5.0 V Data and I/O Lines Microprocessor Based Equipment LAN/WAN Equipment Servers Notebook and Desktop PC Instrumentation Peripherals PINS 1−5: CATHODE PINS 6−7: ANODE PIN 8: CATHODE Value Unit Peak Power Dissipation 8 x 20 ms @ TA = 25°C (Note 1) Ppk 400 W Peak Pulse Current 8 x 20 ms @ TA = 25°C (Note 1) IPP 17 A TJ, Tstg −55 to +150 °C TL 260 °C Lead Solder Temperature − Maximum 10 Seconds Duration 7 3 6 4 5 1 Symbol Junction and Storage Temperature Range 8 2 8 SO−8 CASE 751 PLASTIC MAXIMUM RATINGS Rating 1 MARKING DIAGRAM SMDA5 LYWW SMDA5 = Device Code L = Location Code Y = Year WW = Work Week 1. Non−repetitive current pulse 8 x 20 mS exponential decay waveform ORDERING INFORMATION Device SMDA05−6R2 Package Shipping† SO−8 2500 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2006 July, 2006 − Rev. 3 1 Publication Order Number: SMDA05−6R2/D SMDA05−6R2 ELECTRICAL CHARACTERISTICS Characteristic Symbol Min Typ Max Unit VBR 6.0 − − V Reverse Leakage Current @ VRWM = 5.0 Volts IR N/A − 20 mA Maximum Clamping Voltage @ IPP = 1.0 A, 8 x 20 mS VC N/A − 9.8 V Maximum Clamping Voltage @ IPP = 5.0 A, 8 x 20 mS VC N/A − 11 V Maximum Peak Pulse Current IPP − − 17 A Reverse Breakdown Voltage @ It = 1.0 mA 100 tr 90 % OF PEAK PULSE CURRENT Ppk, PEAK SURGE POWER (WATTS) 1000 100 10 NOTE: Non−Repetitive Surge. 1 1 10 100 PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms 80 70 60 HALF VALUE IRSM/2 @ 20 ms 50 40 30 tP 20 10 0 1000 PEAK VALUE IRSM @ 8 ms 0 t, TIME (ms) 20 40 60 t, TIME (ms) Figure 1. Pulse Width Figure 2. 8 × 20 ms Pulse Waveform http://onsemi.com 2 80 SMDA05−6R2 PACKAGE DIMENSIONS SO−8 CASE 751−07 ISSUE AB −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDAARD IS 751−07 A 8 5 S B 1 0.25 (0.010) M Y M 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− H 0.10 (0.004) D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 3 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244 SMDA05−6R2 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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