SMF05T1G

SMF05 ESD Protection Diode Array Quad, Low Clamping Voltage This quad monolithic silicon overvoltage suppressor is designed for applications requiring transient voltage protection capability. It is intended for use in ESD sensitive equipment such as computers, printers, cell phones, medical equipment, and other applications. Its quad junction common anode design protects four separate lines using only one package. These devices are ideal for situations where board space is at a premium. www.onsemi.com MARKING DIAGRAM 4 5 Specification Features • • • • • • SC−88A Package Allows Four Separate Unidirectional Configurations Low Leakage < 5 mA @ 5 V Breakdown Voltage: 6.1 V − 7.2 V @ 1 mA Low Capacitance (90 pF TYP) Provides Protection for IEC61000−4−2 Pb−Free Packages are Available* Mechanical Characteristics • • • • Void Free, Transfer−Molded, Thermosetting Plastic Case Corrosion Resistant Finish, Easily Solderable Package Designed for Optimal Automated Board Assembly Small Package Size for High Density Applications Applications • • • • 1 2 3 60 = Specific Device Code d = Date Code G = Pb−Free Package (Note: Microdot may be in either location) Cathode Anode Cathode Computers Printers Cell Phones Medical Equipment 60d G G SC−88A/SOT−353 CASE 419A−02 STYLE 5 SCALE 2:1 5 1 Cathode 2 4 3 Cathode ORDERING INFORMATION Device SMF05T1 Package Shipping† SC−88A 3000 Tape & Reel SMF05T1G SC−88A 3000 Tape & Reel (Pb−Free) SMF05T2G SC−88A (Pb−Free) 3000 Tape & Reel SMF05CT1 SC−88A 3000 Tape & Reel SMF05CT1G SMF05CT2 SMF05CT2G SC−88A 3000 Tape & Reel (Pb−Free) SC−88A 3000 Tape & Reel SC−88A 3000 Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 November, 2017 − Rev. 2 1 Publication Order Number: SMF05/D SMF05 MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Characteristic Symbol Value Unit Ppk 200 W Maximum Junction Temperature TJmax 150 °C Operating Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C VPP 16 9 kV TL 260 °C Peak Power Dissipation @ 8 X 20 ms @TA ≤ 25°C (Note 1) ESD Discharge IEC61000−4−2, Air Discharge IEC61000−4−2, Contact Discharge Lead Solder Temperature (10 seconds duration) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Non−repetitive current per Figure 2. Derate per Figure 3. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Breakdown Voltage VBR @ 1 mA (Volts) Device Min Max Leakage Current IR @ VRWM = 5 V (mA) SMF05 6.0 7.2 5.0 Max Clamping Voltage (VC) @ IPP Max Clamping Voltage (VC) @ IPP Capacitance @ 0 V Bias (pF) Max VF @ IF = 200 mA (V) IPP (A) VC (V) IPP (A) VC (V) 90 1.25 1.0 9.5 12 12.5 TYPICAL PERFORMANCE CURVES (TA = 25°C unless otherwise noted) 100 100 10 NOTE: Non−Repetitive Surge. PEAK VALUE IRSM @ 8 ms tr 90 % OF PEAK PULSE CURRENT Ppk , PEAK SURGE POWER (WATTS) 1000 PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms 80 70 60 HALF VALUE IRSM/2 @ 20 ms 50 40 30 tP 20 10 1 1 10 100 0 1000 0 20 40 60 t, TIME (ms) t, TIME (ms) Figure 1. Peak Power Dissipation versus Pulse Width Figure 2. Pulse Waveform 8 x 20 ms www.onsemi.com 2 80 SMF05 TYPICAL PERFORMANCE CURVES 100 100 90 90 80 TYPICAL CAPACITANCE (pF) PEAK POWER DISSIPATION (%) (TA = 25°C unless otherwise noted) 70 60 50 40 30 20 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 175 f = 1 MHz 80 10 0 200 0 1.0 TA, AMBIENT TEMPERATURE (°C) 5.0 Figure 4. Junction Capacitance versus Reverse Voltage 1.0 100 Ipp, PEAK PULSE CURRENT (AMPS) IF , FORWARD CURRENT (A) 4.0 BIAS VOLTAGE (VOLTS) Figure 3. Power Derating Curve 0.1 0.01 0.001 0.6 0.7 0.8 0.9 1.0 1.1 10 2.5 ms SQUARE WAVE 1.0 1.2 0 VF, FORWARD VOLTAGE (VOLTS) 2.5 ms SQUARE WAVE 10 1.0 2.0 4.0 6.0 8.0 10 15 20 25 Figure 6. Clamping Voltage versus Peak Pulse Current (Reverse Direction) 100 0 5.0 VC, CLAMPING VOLTAGE (VOLTS) Figure 5. Forward Voltage Curve Ipp, PEAK PULSE CURRENT (AMPS) 3.0 2.0 10 12 VC, FORWARD CLAMPING VOLTAGE (VOLTS) Figure 7. Clamping Voltage versus Peak Pulse Current (Forward Direction) www.onsemi.com 3 30 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE M SCALE 2:1 DATE 11 APR 2023 GENERIC MARKING DIAGRAM* XXXMG G *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. XXX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) STYLE 1: PIN 1. BASE 2. EMITTER 3. BASE 4. COLLECTOR 5. COLLECTOR STYLE 2: PIN 1. ANODE 2. EMITTER 3. BASE 4. COLLECTOR 5. CATHODE STYLE 3: PIN 1. ANODE 1 2. N/C 3. ANODE 2 4. CATHODE 2 5. CATHODE 1 STYLE 4: PIN 1. SOURCE 1 2. DRAIN 1/2 3. SOURCE 1 4. GATE 1 5. GATE 2 STYLE 6: PIN 1. EMITTER 2 2. BASE 2 3. EMITTER 1 4. COLLECTOR 5. COLLECTOR 2/BASE 1 STYLE 7: PIN 1. BASE 2. EMITTER 3. BASE 4. COLLECTOR 5. COLLECTOR STYLE 8: PIN 1. CATHODE 2. COLLECTOR 3. N/C 4. BASE 5. EMITTER STYLE 9: PIN 1. ANODE 2. CATHODE 3. ANODE 4. ANODE 5. ANODE DOCUMENT NUMBER: DESCRIPTION: 98ASB42984B STYLE 5: PIN 1. CATHODE 2. COMMON ANODE 3. CATHODE 2 4. CATHODE 3 5. CATHODE 4 Note: Please refer to datasheet for style callout. If style type is not called out in the datasheet refer to the device datasheet pinout or pin assignment. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. SC−88A (SC−70−5/SOT−353) PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative