SN74LS86M

SN74LS86 Quad 2-Input Exclusive OR Gate VCC 14 13 12 11 10 9 8 http://onsemi.com LOW POWER SCHOTTKY 1 2 3 4 5 6 7 GND TRUTH TABLE IN A L L H H B L H L H OUT Z L H H L 14 1 PLASTIC N SUFFIX CASE 646 14 1 GUARANTEED OPERATING RANGES Symbol VCC TA IOH IOL Parameter Supply Voltage Operating Ambient Temperature Range Output Current – High Output Current – Low Min 4.75 0 Typ 5.0 25 Max 5.25 70 –0.4 8.0 Unit V °C mA mA SOIC D SUFFIX CASE 751A 14 1 SOEIAJ M SUFFIX CASE 965 ORDERING INFORMATION Device SN74LS86N SN74LS86D SN74LS86DR2 SN74LS86M SN74LS86MEL Package 14 Pin DIP SOIC–14 SOIC–14 SOEIAJ–14 SOEIAJ–14 Shipping 2000 Units/Box 55 Units/Rail 2500/Tape & Reel See Note 1 See Note 1 1. For ordering information on the EIAJ version of the SOIC package, please contact your local ON Semiconductor representative. © Semiconductor Components Industries, LLC, 2001 1 October, 2001 – Rev. 7 Publication Order Number: SN74LS86/D SN74LS86 DC CHARACTERISTICS OVER OPERATING TEMPERATURE RANGE (unless otherwise specified) Limits Symbol VIH VIL VIK VOH Parameter Input HIGH Voltage Input LOW Voltage Input Clamp Diode Voltage Output HIGH Voltage 2.7 –0.65 3.5 0.25 VOL Output Output LOW Voltage 0.35 Input Input HIGH Current 0.2 Input LOW Current Short Circuit Current (Note 2) –20 –0.8 –100 0.5 40 IIH IIL IOS V µA mA mA mA mA 0.4 Min 2.0 0.8 –1.5 Typ Max Unit V V V V V Test Conditions Guaranteed Input HIGH Voltage for All Inputs Guaranteed Input LOW Voltage for All Inputs VCC = MIN, IIN = –18 mA VCC = MIN, IOH = MAX, VIN = VIH or VIL per Truth Table IOL = 4.0 mA IOL = 8.0 mA VCC = VCC MIN, VIN = VIL or VIH per Truth Table VCC = MAX, VIN = 2.7 V VCC = MAX, VIN = 7.0 V VCC = MAX, VIN = 0.4 V VCC = MAX VCC = MAX ICC Power Supply Current 10 2. Not more than one output should be shorted at a time, nor for more than 1 second. AC CHARACTERISTICS (TA = 25°C) Limits Symbol tPLH tPHL tPLH tPHL Parameter Propagation Delay, Other Input LOW Propagation Delay, Other Input HIGH Min Typ 12 10 20 13 Max 23 17 30 22 Unit ns ns VCC = 5.0 V .0 CL = 15 pF Test Conditions http://onsemi.com 2 SN74LS86 PACKAGE DIMENSIONS N SUFFIX PLASTIC PACKAGE CASE 646–06 ISSUE M 14 8 B 1 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 --10_ 0.015 0.039 MILLIMETERS MIN MAX 18.16 18.80 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 --10_ 0.38 1.01 A F N –T– SEATING PLANE L C K H G D 14 PL 0.13 (0.005) M J M DIM A B C D F G H J K L M N D SUFFIX PLASTIC SOIC PACKAGE CASE 751A–03 ISSUE F –A– 14 8 –B– 1 7 P 7 PL 0.25 (0.010) M B M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. G C R X 45 _ F –T– SEATING PLANE D 14 PL 0.25 (0.010) K M M S J TB A S DIM A B C D F G J K M P R MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 http://onsemi.com 3 SN74LS86 PACKAGE DIMENSIONS M SUFFIX SOEIAJ PACKAGE CASE 965–01 ISSUE O 14 8 LE Q1 E HE M_ L DETAIL P 1 7 Z D e A VIEW P NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE 0.50 LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --1.42 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --0.056 c b 0.13 (0.005) M A1 0.10 (0.004) ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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