SS16FP

Surface Mount Schottky Barrier Rectifiers 1 A, 20 V - 150 V SS12FP - S115FP Features • • • • • • • • www.onsemi.com Larger Cathode Pad for Improved Power Dissipation Ultra Thin Profile − Package Height < 1.0 mm High Surge Current Capability Low Power Loss, High Efficiency UL Flammability 94V−0 Classification MSL 1 per J−STD−020 AEC−Q101 Qualified These Devices are Pb−Free and are RoHS Compliant 2 2 1 1 Band Indicates Cathode SOD−123EP CASE 425AC ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Value Symbol Parameter SS12 FP SS13 FP SS14 FP SS16 FP S110 FP S115 FP Unit VRRM Repetitive Peak Reverse Voltage 20 30 40 60 100 150 V VRMS RMS Reverse Voltage 14 21 28 42 70 105 V VR DC Blocking Voltage 20 30 40 60 100 150 V IF(AV) Average Forward Rectified Current 1 A IFSM Peak Forward Surge Current: 8.3 ms Single Half Sine−Wave Superimposed on Rated Load 30 A TJ Operating Junction Temperature Range TSTG Storage Temperature Range −55 to +125 −55 to +150 °C −55 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. © Semiconductor Components Industries, LLC, 2016 May, 2021 − Rev. 2 1 1 2 Cathode Anode MARKING DIAGRAM 1 &Y &Z XFP &G &Y &ZXFP&G 2 = Binary Calendar Year Coding = Assembly Plant Code = Specific Device Code X = 0, 2, 3, 4, 6, A = Single Digit Week Code ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. Publication Order Number: S110FP/D SS12FP − S115FP THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Note 1) Parameter Symbol Value Unit YJL Thermal Characteristics, Junction−to−Lead (Note 2) 10 °C/W RqJA Thermal Resistance, Junction−to−Ambient 140 °C/W 1. Per JESD51−3 recommended thermal test board. Device mounted on FR−4 PCB, board size = 76.2 mm x 114.3 mm. 2. Thermocouple soldered at cathode lead. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Value Symbol VF Parameter SS12 FP Conditions Maximum Instantaneous Forward Voltage (Note 3) IF = 0.5 A IR Maximum Reverse Current at Rated VR TJ = 25°C CJ Typical Junction Capacitance VR = 4 V, f = 1 MHz Trr Typical Reverse Recovery Time IF = 0.5 A, IR = 1 A, IRR = 0.25 A IF = 1.0 A 0.45 SS13 FP SS14 FP SS16 FP S110 FP S115 FP Unit 0.51 0.58 0.70 0.75 V 0.55 0.70 0.80 0.90 0.50 0.40 TJ = 125°C 0.05 mA 0.50 54 28 pF 6 14 ns Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulse test with PW = 300 ms, 1% duty cycle. ORDERING INFORMATION Part Number Device Code Marking Package Packing Method† SS12FP 2FP SOD−123EP Tape and Reel SS13FP 3FP SOD−123EP Tape and Reel SS14FP 4FP SOD−123EP Tape and Reel SS16FP 6FP SOD−123EP Tape and Reel S110FP 0FP SOD−123EP Tape and Reel S115FP AFP SOD−123EP Tape and Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 2 SS12FP − S115FP TYPICAL PERFORMANCE CHARACTERISTICS 100 Peak Forward Surge Current (A) Average Forward Current (A) 1.4 1.2 1 0.8 0.6 0.4 Resistive or Inductive Load 0.2 0 0 25 50 75 125 100 10 8.3 ms Single Half Sine Wawe 1 150 10 1 Case Temperature (5C) Figure 1. Forward Current Derating Curve Figure 2. Maximum Non−Repetitive Forward Surge Current 1 1 SS16FP S110FP TA = 150°C TA = 125°C Forward Current, IF (A) Forward Current, IF (A) 100 Number of Cycles at 60 Hz TA = −55°C 0.1 TA = −40°C TA = 150°C TA = 125°C TA = −55°C 0.1 TA = −40°C TA = 25°C TA = 25°C 0.01 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.01 0.8 0.0 0.1 0.2 Forward Voltage, VF (V) 10000 1 TA = 150°C TA = −55°C TA = 125°C 0.1 0.6 0.7 0.8 SS12FP − SS16FP 0.2 100 TA = −40°C 0.3 0.4 0.5 0.6 0.7 0.8 TA = 75°C 1 TA = 25°C 0.1 0.01 TA = −55°C TA = −40°C 1E−4 0.9 1E−5 1.0 TA = 150°C TA = 125°C 10 0.001 TA = 25°C 0.0 0.5 1000 Reverse Current, IR (mA) Forward Current, IF (A) SS15FP 0.01 0.4 Figure 4. Typical Forward Characteristics Figure 3. Typical Forward Characteristics 0.1 0.3 Forward Voltage, VF (V) 10 20 30 40 50 60 70 80 90 Percent of Rated Peak Reverse Voltage (%) Forward Voltage, VF (V) Figure 6. Typical Reverse Characteristics Figure 5. Typical Forward Characteristic www.onsemi.com 3 100 SS12FP − S115FP TYPICAL PERFORMANCE CHARACTERISTICS 10000 1000 S110FP − S115FP Reverse Current, IR (mA) Junction Capacitance, CJ (pF) TA = 150°C 1000 100 10 TA = 125°C TA = 75°C 1 TA = −55°C 0.1 TA = 25°C 0.01 TA = −40°C 0.001 1E−4 1E−5 10 20 30 40 50 60 70 80 90 100 S110FP − S115FP 10 1 0.1 100 SS12FP − SS116FP Percent of Rated Peak Reverse Voltage (%) 1 10 Reverse Voltage, VR (V) Figure 8. Typical Junction Capacitance Figure 7. Typical Reverse Characteristic www.onsemi.com 4 100 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOD−123EP CASE 425AC ISSUE O DATE 31 AUG 2016 3.00 2.60 1.95 1.65 0.55 1.15 0.85 1.40 2.30 LAND PATTERN RECOMMENDATION 0.30 0.10 1.00 0.75 1.25 LONG PAD IS CATHODE 3.90 3.50 2.05 1.65 2.05 1.65 NOTES: 0.40 2.30 1.90 A. NO INDUSTRY STANDARD APPLIES TO THIS PACKAGE. B. ALL DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH AND TIE BAR PROTRUSIONS. 1.25 0.85 0.25 DOCUMENT NUMBER: DESCRIPTION: 1.20 0.55 98AON13723G SOD−123EP Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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