SS39

DATA SHEET www.onsemi.com Schottky Rectifier SS32 - S310 1 Cathode 2 Anode Description The SS32−S310 series includes a high−efficiency, low power loss, general−propose Schottky rectifiers. The clipbonded leg structure provides high thermal performance and low electrical resistance. These rectifiers are suited for free wheeling, secondary rectification, and reverse polarity protection applications. SMC CASE 403AG Features • • • • • Metal to Silicon Rectifiers, Majority Carrier Conduction Low−Forward Voltage Drop Easy Pick and Place High−Surge Current Capability This Device is Pb−Free and Halide Free MARKING DIAGRAM $Y&Z&3 Sxyz G $Y &Z &3 Sxyz = Logo = Assembly Plant Code = Date Code = Specific Device Code x = S or 3 y = 1 or 3 z = 0 or 2−9 ORDERING INFORMATION Device SS32 SS33 SS34 SS35 SS36 SS38 SS39 S310 Package Shipping† SMC (Pb−Free, Halide−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 1999 August, 2021 − Rev. 5 1 Publication Order Number: SS39/D SS32 − S310 ABSOLUTE MAXIMUM RATINGS Values are at TA = 25°C unless otherwise noted. Value Parameter Symbol SS32 SS33 SS34 SS35 SS36 SS38 SS39 S310 Units 20 30 40 50 60 80 90 100 V VRRM Maximum Repetitive Reverse Voltage IF(AV) Maximum Average Forward Current at TA = 75°C 3.0 A IFSM Non−Repetitive Peak Forward Surge Current: 8.3 ms Single Half−Sine Wave 100 A dV/dt Maximum Voltage Rate of Change 10000 V/mS TSTG Storage Temperature Range −55 to +150 °C Operating Junction Temperature −55 to +150 °C TJ Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Symbol Parameter PD Power Dissipation Value Unit 2.27 W RθJA Thermal Resistance, Junction to Ambient (Note 1) 55 °C/W RθJL Thermal Resistance, Junction to Lead 17 °C/W 1. Device mounted on FE−4 PCB 0.55 x 0.55 inch (14 x 14 mm). ELECTRICAL CHARACTERISTICS Values are at TA = 25°C unless otherwise noted. Value Parameter Symbol Test Conditions VF Forwarded Voltage IF = 3.0 A IR Reverse Current at Rated VR TA = 25°C SS32 SS33 SS34 SS35 500 SS36 SS38 750 SS39 S310 Units 850 mV mA 0.5 TA = 100°C 20 10 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. TYPICAL CHARACTERISTICS 100 IFSM, Peak Forward Surge Current (A) IF, Average Rectified Forward Current (A) 3 2 1 0 Resistive or Inductive Load P.C.B. Mounted on 0.55 x 0.55’’ (14 x 14) mm Copper Pad Areas 0 25 50 75 100 125 150 175 80 60 40 20 0 1 2 5 10 20 50 Ambient Temperature (5C) Number of Cycles at 60 Hz Figure 1. Forward Current Derating Curve Figure 2. Non−Repetitive Surge Current www.onsemi.com 2 100 SS32 − S310 TYPICAL CHARACTERISTICS 20 10 50 TA = 25°C SS32−SS34 10 IR, Reverse Current (mA) IF, Forward Current (A) TA = 125°C SS35−S310 1 TA = 150°C 0.1 SS32−SS34 1 0.1 TA = 75°C SS32−SS34 0.01 Pulse Width = 300 ms 2% Duty Cycle 0.01 0 0.2 0.4 0.6 0.8 1 1.2 1.4 SS35−S310 1.6 0.001 0 20 CT, Total Capacitance (pF) 1000 SS32−SS34 10 0.1 1 10 60 80 100 120 140 Figure 4. Reverse Current vs. Reverse Voltage Transient Thermal Impedance (5C/W) Figure 3. Forward Voltage Characteristics 100 40 TA = 25°C Percent of Rated Peak Reverse Voltage (%) VF, Forward Voltage (V) SS35−S310 TA = 125°C SS35−S310 100 100 10 1 0.1 0.01 0.1 1 10 Pulse Duration (s) VR, Reverse Voltage (V) Figure 5. Total Capacitance Figure 6. Thermal Impedance Characteristics www.onsemi.com 3 100 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SMC CASE 403AG ISSUE O DATE 31 AUG 2016 8.15 7.75 B 1.96 6.25 5.55 3.27 2.75 3.39 B 6.81 0.13 M 7.15 6.60 A C B TOP VIEW 2.45 1.90 A 0.203 0.050 0.13 M C B B A A. EXCEPT WHERE NOTED, CONFORMS TO JEDEC DO−214, VARIATION AB B C. D. DOES NOT COMPLY TO JEDEC STD. VALUE ALL DIMENSIONS ARE IN MILLIMETERS DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH, AND TIE BAR PROTRUSIONS. DIMENSIONS AND TOLERANCING AS PER ASME Y14.5−2009 LAND PATTERN STANDARD: DIOM7957X241M DOCUMENT NUMBER: DESCRIPTION: 0.45 1.60 0.75 8° 0° DETAIL A SCALE 2:1 NOTES: F. 0.41 0.15 SEATING PLANE SIDE VIEW E. 8° 0° GAGE PLANE C 4.70 4.40 LAND PATTERN RECOMMENDATION R0.15 4X 2.65 MAX 0.30 0.05 A 98AON13442G SMC Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. 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