MURA260T3G,
SURA8260T3G
Surface Mount
Ultrafast Power Rectifier
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
Features
•
•
•
•
•
•
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
High Temperature Glass Passivated Junction
Low Forward Voltage Drop (1.2 V Max @ 2.0 A, TJ = 150°C)
SURA8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable*
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 70 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
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ULTRAFAST RECTIFIER
2 AMPERES, 600 VOLTS
SMA
CASE 403D
PLASTIC
MARKING DIAGRAM
U5J
AYWW G
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
•
•
260°C Max. for 10 Seconds
Polarity: Polarity Band Indicates Cathode Lead
ESD Protection:
♦ Human Body Model > 4000 V (Class 3)
♦ Machine Model > 400 V (Class C)
U5J
A
Y
WW
G
=
=
=
=
=
Device Code
Assembly Location**
Year
Work Week
Pb−Free Package
** The Assembly Location Code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package bottom (molding ejecter
pin), the front side assembly code may be blank.
ORDERING INFORMATION
Device
Package
Shipping†
MURA260T3G,
SURA8260T3G*,
SURA8260T3G−VF01*
SMA
(Pb−Free)
5,000 / Tape
& Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
January, 2018 − Rev. 6
1
Publication Order Number:
MURA260T3/D
MURA260T3G, SURA8260T3G
MAXIMUM RATINGS
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Rating
VRRM
VRWM
VR
600
V
Average Rectified Forward Current
@ TL = 145°C
@ TL = 110°C
IF(AV)
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
A
1.0
2.0
Operating Junction Temperature Range
A
30
TJ
−65 to +175
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead (TL = 25°C) (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 1)
Symbol
Value
Unit
PsiJL
(Note 2)
RqJA
24
°C/W
216
1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR−4.
2. In compliance with JEDEC 51, these values (historically represented by RqJL) are now referenced as PsiJL.
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Maximum Instantaneous Forward Voltage (Note 3)
(iF = 2.0 A, TJ = 25°C)
(iF = 2.0 A, TJ = 150°C)
vF
Maximum Instantaneous Reverse Current (Note 3)
(Rated DC Voltage, TJ = 25°C)
(Rated DC Voltage, TJ = 150°C)
iR
Maximum Reverse Recovery Time
(iF = 1.0 A, di/dt = 50 A/ms)
trr
Max
Unit
V
1.45
1.20
mA
5.0
150
ns
75
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
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2
MURA260T3G, SURA8260T3G
1000
TJ = 175°C
IR, REVERSE CURRENT (mA)
IR, REVERSE CURRENT (mA)
100
10
TJ = 100°C
1
0.1
TJ = 25°C
TJ = 175°C
100
TJ = 100°C
10
TJ = 25°C
0.01
100
300
200
400
500
1
600
100
200
300
400
500
VR, REVERSE VOLTAGE (VOLTS)
Figure 1. Typical Reverse Current
Figure 2. Maximum Reverse Current
10
100°C
TC = 175°C
25°C
1
0.1
0.01
0.3
0
VR, REVERSE VOLTAGE (VOLTS)
IF, INSTANTANEOUS FORWARD CURRENT (A)
IF, INSTANTANEOUS FORWARD CURRENT (A)
0
0.5
0.7
0.9
1.1
1.3
1.5
1.7
10
TC = 175°C
100°C
25°C
1
0.1
0.01
0.3
VF, INSTANTANEOUS VOLTAGE (VOLTS)
0.5
0.7
0.9
1.1
1.3
1.5
1.7
VF, INSTANTANEOUS VOLTAGE (VOLTS)
Figure 4. Maximum Forward Voltage
Figure 3. Typical Forward Voltage
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3
600
1.9
MURA260T3G, SURA8260T3G
30
NOTE: TYPICAL
CAPACITANCE AT
0 V = 24 pF
20
15
10
5
20
15
10
5
0
12
8
20
16
28
24
32
36
0
40
12
16
20
24
28
32
Figure 5. Typical Capacitance
Figure 6. Maximum Capacitance
4
dc
3
SQUARE WAVE
2
1
0
80
8
VR, REVERSE VOLTAGE (VOLTS)
5
60
4
VR, REVERSE VOLTAGE (VOLTS)
IF(AV), AVERAGE FORWARD CURRENT (A)
4
0
100
120
140
160
180
160
180
0.8
0.7
0.6 SQUARE
WAVE
0.5
0.4
0.3
0.2
0.1
0
0
20
40
60
80
100
120
140
TA, AMBIENT TEMPERATURE (°C)
Figure 8. Current Derating, Ambient
(FR−4 Board with Minimum Pad)
4.5
4
dc
3.5
3
SQUARE WAVE
2.5
2
1.5
1
0.5
0
0.5
40
dc
0.9
Figure 7. Current Derating, Lead
0
36
1
TL, LEAD TEMPERATURE (°C)
PF, AVERAGE POWER DISSIPATION (W)
IF(AV), AVERAGE FORWARD CURRENT (A)
0
NOTE: MAXIMUM
CAPACITANCE AT
0 V = 27 pF
25
C, CAPACITANCE (pF)
C, CAPACITANCE (pF)
25
1
1.5
2
2.5
3
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 9. Power Dissipation
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4
3.5
MURA260T3G, SURA8260T3G
PACKAGE DIMENSIONS
SMA
CASE 403D
ISSUE H
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L.
E
b
DIM
A
A1
b
c
D
E
HE
L
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
MIN
1.97
0.05
1.27
0.15
2.29
4.06
4.83
0.76
MILLIMETERS
NOM
MAX
2.10
2.20
0.10
0.20
1.45
1.63
0.28
0.41
2.60
2.92
4.32
4.57
5.21
5.59
1.14
1.52
MIN
0.078
0.002
0.050
0.006
0.090
0.160
0.190
0.030
INCHES
NOM
0.083
0.004
0.057
0.011
0.103
0.170
0.205
0.045
MAX
0.087
0.008
0.064
0.016
0.115
0.180
0.220
0.060
A
L
c
A1
SOLDERING FOOTPRINT*
4.000
0.157
2.000
0.079
2.000
0.079
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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MURA260T3/D
Mouser Electronics
Authorized Distributor
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MURA260T3G SURA8260T3G