SURD8530T4G

MURD530T4G, SURD8530T4G, SURD8530T4G-VF01 Switch-mode PowerRectifier www.onsemi.com DPAK Surface Mount Package These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. ULTRAFAST RECTIFIER 5.0 AMPERES, 300 VOLTS Features • • • • • Ultrafast 50 Nanosecond Recovery Time Low Forward Voltage Drop Low Leakage SURD8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant DPAK CASE 369C 1 MARKING DIAGRAM Mechanical Characteristics • Case: Epoxy, Molded • Weight: 0.4 Gram (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 300 V Average Rectified Forward Current (Rated VR, TC = 165°C) IF(AV) Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 165°C) IFRM Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, 60 Hz) IFSM Operating Junction and Storage Temperature Range TJ, Tstg A 5.0 A 10 A 75 −65 to +175 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. © Semiconductor Components Industries, LLC, 2015 June, 2017 − Rev. 6 1 4 3 AYWW U 530G U530 A Y WW G = Specific Device Number = Assembly Location* = Year = Work Week = Pb−Free Package * The Assembly Location Code (A) is front side optional. In cases where the Assembly Location is stamped in the package bottom (molding ejecter pin), the front side assembly code may be blank. ORDERING INFORMATION Package Shipping† MURD530T4G DPAK (Pb−Free) 2,500/Tape & Reel 16 mm SURD8530T4G DPAK (Pb−Free) 2,500/Tape & Reel 16 mm SURD8530T4G− VF01 DPAK (Pb−Free) 2,500/Tape & Reel 16 mm Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: MURD530/D MURD530T4G, THERMAL CHARACTERISTICS Characteristic Symbol Value Unit RqJC 3 °C/W RqJA 92 °C/W RqJA 57 °C/W Symbol Value Unit Thermal Resistance − Junction−to−Case (Note 1) Thermal Resistance − Junction−to−Ambient (Note 2) Thermal Resistance − Junction−to−Ambient (Note 3) 1. Rating applies for one diode leg. 2. Rating applies when for both diode legs when mounted on 130 mm2 pad size. 3. Rating applies for both diode legs when mounted on 1 in pad size. ELECTRICAL CHARACTERISTICS Characteristic Maximum Instantaneous Forward Voltage Drop (Note 4) (iF = 3 A, TJ = 25°C) (iF = 3 A, TJ = 125°C) (iF = 5 A, TJ = 25°C) (iF = 5 A, TJ = 125°C) vF Maximum Instantaneous Reverse Current (Note 4) (TJ = 25°C, Rated dc Voltage) (TJ = 125°C, Rated dc Voltage) iR Maximum Reverse Recovery Time (IF = 1 Amp, di/dt = 50 A/ms, VR = 30 V, TJ = 25°C) trr Volts 0.95 0.80 1.05 0.90 mA 5.0 150 ns 50 4. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 100 TJ = 175°C 85°C 125°C 1 25°C −40°C 0.1 0 0.5 1.0 1.5 85°C 25°C 1 −40°C 0.1 2.0 125°C 0 0.5 1.0 1.5 vF, INSTANTANEOUS VOLTAGE (V) Figure 1. Maximum Forward Voltage Figure 2. Typical Forward Voltage 125°C 10 85°C 1.0 25°C 0.1 0.01 −40°C 0.001 50 2.0 1000 175°C 100 0 0 175°C 10 vF, INSTANTANEOUS VOLTAGE (V) 1000 IR, REVERSE CURRENT (mA) IF, FORARD CURRENT (A) 10 IR, REVERSE CURRENT (mA) IF, FORARD CURRENT (A) 100 100 150 200 vR, REVERSEE VOLTAGE (V) 250 125°C 10 85°C 1.0 0.1 25°C 0.01 −40°C 0.001 0 0 300 175°C 100 Figure 3. Maximum Reverse Voltage 50 100 150 200 250 vR, REVERSEE VOLTAGE (V) Figure 4. Typical Reverse Voltage www.onsemi.com 2 300 Rated Voltage Applied RqJA = 3°C/W 10 dc SQUARE WAVE 5 0 80 90 5 IF, AVERAGE FORWARD CURRENT (A) 15 Rated Voltage Applied RqJA = 57°C/W dc SQUARE WAVE 0 100 110 120 130 140 150 160 170 180 80 90 100 110 120 130 140 150 160 170 18 TC, CASE TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 5. Typical Current Derating, Case Figure 6. Typical Current Derating, Ambient 8 1000 TJ = 25°C 7 6 5 C, CAPACITANCE (pF) PFO, AVERAGE POWER DISSIPATION (W) IF, AVERAGE FORWARD CURRENT (A) MURD530T4G, SQUARE WAVE 4 dc 3 2 100 10 1 0 0 1 2 3 4 5 6 7 8 1 9 0 50 100 150 200 IO, AVERAGE FORWARD CURRENT (A) VR, REVERSE VOLTAGE (V) Figure 7. Forward Power Dissipation Figure 8. Typical Capacitance 250 10 R(t), (°C/W) D = 0.5 1 0.2 0.1 0.05 0.1 0.01 Single Pulse 0.01 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 PULSE TIME (s) Figure 9. R(t) on an Infinite Heatsink Power (J1) 0.800 W Power (J2) 0.800 W www.onsemi.com 3 100 1000 MURD530T4G, 100 D = 0.5 0.2 0.1 R(t), (°C/W) 10 0.05 1 0.01 0.1 Single Pulse 0.01 0.001 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 PULSE TIME (s) Figure 10. PCB Cu Area 650 mm2 PCB Cu thk 1 oz Power (J1) 0.800 W Power (J2) 0.800 W www.onsemi.com 4 1000 MURD530T4G, PACKAGE DIMENSIONS DPAK (SINGLE GAUGE) CASE 369C ISSUE F A E b3 c2 4 L3 Z D 1 L4 C A B 2 NOTE 7 c SIDE VIEW b TOP VIEW H DETAIL A 3 b2 e 0.005 (0.13) M GAUGE PLANE C Z C L L1 DETAIL A DIM A A1 b b2 b3 c c2 D E e H L L1 L2 L3 L4 Z BOTTOM VIEW H L2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. 7. OPTIONAL MOLD FEATURE. Z SEATING PLANE BOTTOM VIEW A1 ALTERNATE CONSTRUCTIONS INCHES MIN MAX 0.086 0.094 0.000 0.005 0.025 0.035 0.028 0.045 0.180 0.215 0.018 0.024 0.018 0.024 0.235 0.245 0.250 0.265 0.090 BSC 0.370 0.410 0.055 0.070 0.114 REF 0.020 BSC 0.035 0.050 −−− 0.040 0.155 −−− MILLIMETERS MIN MAX 2.18 2.38 0.00 0.13 0.63 0.89 0.72 1.14 4.57 5.46 0.46 0.61 0.46 0.61 5.97 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.90 REF 0.51 BSC 0.89 1.27 −−− 1.01 3.93 −−− ROTATED 905 CW SOLDERING FOOTPRINT* 6.20 0.244 2.58 0.102 5.80 0.228 3.00 0.118 1.60 0.063 6.17 0.243 SCALE 3:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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