MURS205T3G,
SURS8205T3G,
MURS210T3G,
SURS8210T3G
Surface Mount
Ultrafast Power Rectifiers
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
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ULTRAFAST RECTIFIERS
2 AMPERES, 50−100 VOLTS
Features
•
•
•
•
•
•
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
High Temperature Glass Passivated Junction
Low Forward Voltage Drop (0.74 V Max @ 2.0 A, TJ = 150°C)
SURS8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 95 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
•
•
•
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Polarity: Polarity Band Indicates Cathode Lead
ESD Ratings:
♦ Machine Model = C (> 400 V)
♦ Human Body Model = 3A (> 4 kV)
SMB
CASE 403A
MARKING DIAGRAM
AYWW
U2x G
G
A
Y
WW
U2x
G
=
=
=
=
Assembly Location*
Year
Work Week
Device Code
x = A for MURS205T3G
= B for MURS210T3G
= Pb−Free Package
(Note: Microdot may be in either location)
* The Assembly Location Code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package bottom (molding ejecter
pin), the front side assembly code may be blank.
ORDERING INFORMATION
Package
Shipping†
MURS205T3G
SMB
(Pb−Free)
2,500 Tape & Reel
SURS8205T3G
SMB
(Pb−Free)
2,500 Tape & Reel
MURS210T3G
SMB
(Pb−Free)
2,500 Tape & Reel
SURS8210T3G
SMB
(Pb−Free)
2,500 Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
April, 2017 − Rev. 3
1
Publication Order Number:
MURS205T3/D
MURS205T3G, SURS8205T3G, MURS210T3G, SURS8210T3G
MAXIMUM RATINGS
Rating
Symbol
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
MURA205T3G, SURS8205T3G
MURA210T3G, SURS8210T3G
VRRM
VRWM
VR
Average Rectified Forward Current
@ TL = 150°C
@ TL = 125°C
IF(AV)
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
Operating Junction Temperature
TJ
Value
Unit
V
50
100
1.0
2.0
50
−60 to +175
A
A
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead (TL = 25°C)
Symbol
Max
Unit
RqJL
13
°C/W
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Maximum Instantaneous Forward Voltage (Note 1)
(iF = 2.0 A, TJ = 25°C)
(iF = 2.0 A, TJ = 150°C)
vF
Maximum Instantaneous Reverse Current (Note 1)
(Rated dc Voltage, TJ = 25°C)
(Rated dc Voltage, TJ = 150°C)
iR
Maximum Reverse Recovery Time
(iF = 1.0 A, di/dt = 50 A/ms)
(iF = 0.5 A, iR = 1.0 A, IR to 0.25 A)
trr
Maximum Forward Recovery Time
(iF = 1.0 A, di/dt = 100 A/ms, Rec. to 1.0 V)
tfr
Value
0.94
0.74
2.0
50
30
20
20
Unit
V
mA
ns
ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
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2
10
10
7.0
7.0
5.0
5.0
3.0
3.0
175°C
2.0
100°C
1.0
0.7
0.5
25°C
0.3
0.2
0.1
0.07
100°C
1.0
0.7
0.5
TC = 25°C
0.3
0.2
0.1
0.07
0.05
0.05
0.03
0.03
0.02
0.02
0.01
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
175°C
2.0
IF, INSTANTANEOUS FORWARD CURRENT (mA)
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
MURS205T3G, SURS8205T3G, MURS210T3G, SURS8210T3G
0.01
0.3
1.1
vF, INSTANTANEOUS VOLTAGE (VOLTS)
0.6
0.7
0.8
0.9
1
1.1
Figure 2. Maximum Forward Voltage
100
100
IR, REVERSE CURRENT (mA)
IR, REVERSE CURRENT (mA)
0.5
vF, INSTANTANEOUS VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
TJ = 175°C
10
1
TJ = 100°C
TJ = 25°C
0.1
0.01
0.4
0
20
40
60
80
TJ = 175°C
10
TJ = 100°C
1
0.1
0.01
100
TJ = 25°C
VR, REVERSE VOLTAGE (VOLTS)
0
20
40
60
80
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current*
Figure 4. Maximum Reverse Current*
* The curves shown are typical for the highest voltage
device in the voltage grouping. Typical reverse current
for lower voltage selections can be estimated from these
same curves if applied VR is sufficiently below rated VR.
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3
100
MURS205T3G, SURS8205T3G, MURS210T3G, SURS8210T3G
50
40
35
30
25
20
15
10
0
4
8
12
16
20
24
28
32
36
30
25
20
15
10
0
40
8
7
6
dc
4
3
2
SQUARE WAVE
90
12
16
20
24
28
32
VR, REVERSE VOLTAGE (VOLTS)
9
0
80
8
Figure 6. Maximum Capacitance
RATED VOLTAGE APPLIED
RqJC = 13°C/W
TJ = 175°C
1
4
Figure 5. Typical Capacitance
10
5
0
VR, REVERSE VOLTAGE (VOLTS)
PF, AVERAGE POWER DISSIPATION (WATTS)
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
40
35
5
5
0
NOTE: MAXIMUM
CAPACITANCE AT
0 V = 47 V
45
C, CAPACITANCE (pF)
45
C, CAPACITANCE (pF)
50
NOTE: TYPICAL
CAPACITANCE AT
0 V = 44 V
100 110 120 130 140 150
160 170 180
36
4
3.5
TJ = 175°C
3
2.5
2
SQUARE WAVE
1.5
1
dc
0.5
0
0
TC, CASE TEMPERATURE (°C)
0.5
1
1.5
2
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 8. Power Dissipation
Figure 7. Current Derating, Case
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4
40
2.5
MURS205T3G, SURS8205T3G, MURS210T3G, SURS8210T3G
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE J
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
E
b
DIM
A
A1
b
c
D
E
HE
L
L1
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
MIN
1.95
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
NOM
MAX
2.30
2.47
0.10
0.20
2.03
2.20
0.23
0.31
3.56
3.95
4.32
4.60
5.44
5.60
1.02
1.60
0.51 REF
MIN
0.077
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.091
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.097
0.008
0.087
0.012
0.156
0.181
0.220
0.063
A
L
L1
A1
c
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
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MURHD560/D
Mouser Electronics
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