MURS360BT3G,
NRVUS360VBT3G,
SURS8360BT3G
Surface Mount
Ultrafast Power Rectifiers
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
Features
•
•
•
•
•
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
High Temperature Glass Passivated Junction
NRVUS and SURS8 Prefix for Automotive and Other Applications
Requiring Unique Site and Control Change Requirements;
AEC−Q101 Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
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ULTRAFAST RECTIFIERS
3 AMPERES
600 VOLTS
SMB
CASE 403A
Mechanical Characteristics
•
•
•
•
•
•
•
Case: Epoxy, Molded
Epoxy Meets UL 94 V−O @ 0.125 in
Weight: 95 mg (approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Polarity: Polarity Band Indicates Cathode Lead
ESD Rating:
♦ Human Body Model (HBM) 3B (> 8 kV)
♦ Machine Model (MM) C (> 400 V)
MARKING DIAGRAM
AYWW
B36BG
G
B36B
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
600
V
Average Rectified Forward Current
IF(AV)
3.0 @ TL = 105°C
A
Non−Repetitive Peak Surge Current
(Surge applied at rated load conditions
halfwave, single phase, 60 Hz)
IFSM
100
A
Operating Junction Temperature
TJ
*65 to +175
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
© Semiconductor Components Industries, LLC, 2016
November, 2016 − Rev. 7
1
ORDERING INFORMATION
Package
Shipping†
MURS360BT3G
SMB
(Pb−Free)
2,500 /
Tape & Reel
NRVUS360VBT3G
SMB
(Pb−Free)
2,500 /
Tape & Reel
NRVUS360VDBT3G
SMB
(Pb−Free)
2,500 /
Tape & Reel
SURS8360BT3G
SMB
(Pb−Free)
2,500 /
Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
MURS360BT3/D
MURS360BT3G, NRVUS360VBT3G, SURS8360BT3G
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 1)
Symbol
Value
Unit
RqJL
RqJA
14
125
°C/W
Typ
Max
Unit
−
0.83
1.25
1.05
−
95
3.0
150
−
−
75
50
−
50
1. Mounted with minimum recommended pad size, PC Board FR4.
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Maximum Instantaneous Forward Voltage (Note 2)
(iF = 3.0 A, TJ = 25°C)
(iF = 3.0 A, TJ = 150°C)
vF
Maximum Instantaneous Reverse Current (Note 2)
(Rated DC Voltage, TJ = 25°C)
(Rated DC Voltage, TJ = 150°C)
iR
Maximum Reverse Recovery Time
(iF = 1.0 A, di/dt = 50 A/ms)
(iF = 0.5 A, iR = 1.0 A, IR to 0.25 A)
trr
Maximum Forward Recovery Time
(iF = 1.0 A, di/dt = 100 A/ms, Rec. to 1.0 V)
tfr
V
mA
ns
ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
10
IF, INSTANTANEOUS FORWARD CURRENT (A)
IF, INSTANTANEOUS FORWARD CURRENT (A)
TYPICAL CHARACTERISTICS
125°C
150°C
25°C
1
0.1
0.01
0.3 0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
10
125°C
150°C
0.1
0.01
0.3 0.4 0.5 0.6
0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
0.1
Ir, REVERSE CURRENT (mA)
Ir, REVERSE CURRENT (mA)
25°C
1
150°C
0.01
125°C
0.001
0.0001
25°C
0.00001
1
0.1
150°C
0.01
125°C
0.001
0.0001
0.000001
25°C
0.00001
0
100
200
300
400
500
600
0
Vr, REVERSE VOLTAGE (V)
100
200
300
400
500
Vr, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
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2
600
MURS360BT3G, NRVUS360VBT3G, SURS8360BT3G
TYPICAL CHARACTERISTICS
70
60
C, CAPACITANCE (pF)
IF(AV), AVERAGE FORWARD CURRENT (A)
5
TJ = 25°C
f = 1 MHz
50
40
30
20
10
0
20
40
60
80
Square
3
2
1
65
100
75
85
95
105
115
125
135
Vr, REVERSE VOLTAGE (V)
TC, CASE TEMPERATURE (°C)
Figure 5. Typical Capacitance
Figure 6. Current Derating, Lead
145 155
4
3
PF(AV), AVERAGE POWER DISSIPATION (W)
IF(AV), AVERAGE FORWARD CURRENT (A)
4
0
0
RqJA = 71°C/W
RqJA = 120°C/W
No Heatsink
dc
2
dc
1
Square Wave
Square Wave
TJ = 150°C
3
dc
2
1
0
0
0
25
50
75
100
125
0
150
1
2
3
TA, AMBIENT TEMPERATURE (°C)
IF(AV), AVERAGE FORWARD CURRENT (A)
Figure 7. Current Derating, Ambient
Figure 8. Typical Forward Power Dissipation
4
10000
4
IFSM, NON−REPETITIVE SURGE
CURRENT (A)
Square Wave
PF(AV), AVERAGE POWER
DISSIPATION (W)
dc
TJ = 150°C
dc
3
2
1
0
0
1
2
3
1000
100
10
4
10
IF(AV), AVERAGE FORWARD CURRENT (A)
Figure 9. Maximum Forward Power
Dissipation
100
1,000
10,000
tp, SQUARE WAVE PULSE DURATION (ms)
Figure 10. Typical Non−Repetitive Surge
Current
*Typical performance based on a limited sample size.
ON Semiconductor does not guarantee ratings not listed
in the Maximum Ratings table.
www.onsemi.com
3
MURS360BT3G, NRVUS360VBT3G, SURS8360BT3G
100
50% Duty Cycle
R(t) (°C/W)
10
20%
10%
5%
2%
1
1%
0.1
Single Pulse
0.01
0.000001 0.00001
0.0001
0.001
0.01
0.1
PULSE TIME (s)
1
Figure 11. Thermal Response, Junction−to−Ambient
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4
10
100
1000
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE J
SCALE 1:1
DATE 19 JUL 2012
SCALE 1:1
Polarity Band
Non−Polarity Band
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
E
b
DIM
A
A1
b
c
D
E
HE
L
L1
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
A
L
L1
c
MIN
1.95
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
NOM
MAX
2.30
2.47
0.10
0.20
2.03
2.20
0.23
0.31
3.56
3.95
4.32
4.60
5.44
5.60
1.02
1.60
0.51 REF
MIN
0.077
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.091
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.097
0.008
0.087
0.012
0.156
0.181
0.220
0.063
GENERIC
MARKING DIAGRAM*
A1
SOLDERING FOOTPRINT*
2.261
0.089
AYWW
XXXXXG
G
AYWW
XXXXXG
G
Polarity Band
Non−Polarity Band
XXXXX = Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
2.743
0.108
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
2.159
0.085
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42669B
SMB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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