SZMM5Z8V2ST1G

MM5ZxxxST1G Series, SZMM5ZxxxST1G Series Zener Voltage Regulators 500 mW SOD−523 Surface Mount This series of Zener diodes is packaged in a SOD−523 surface mount package. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards. www.onsemi.com SOD−523 CASE 502 STYLE 1 Specification Features • Standard Zener Breakdown Voltage Range −2.4 V to 18 V • Steady State Power Rating of 500 mW • Small Body Outline Dimensions: • • • • • 0.047″ x 0.032″ (1.20 mm x 0.80 mm) Low Body Height: 0.028″ (0.7 mm) ESD Rating of Class 3 (> 16 kV) per Human Body Model Tight Tolerance VZ SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant* 1 Cathode 2 Anode MARKING DIAGRAM 1 XX MG G 2 XX = Specific Device Code M Date Code* G = Pb−Free Package (Note: Microdot may be in either location) Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94, V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any *Date Code orientation may vary depending upon manufacturing location. QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements ORDERING INFORMATION MAXIMUM RATINGS Rating Total Device Dissipation FR−4 Board, (Note 1) @ TA = 25°C Derate above 25°C Thermal Resistance from Junction−to−Ambient (Note 1) Operating Junction and Storage Temperature Range Symbol Max Unit 500 4.0 mW mW/°C RqJA 250 °C/W TJ, Tstg −65 to +150 °C Device Package Shipping† MM5ZxxxST1G SOD−523 (Pb−Free) 3,000 / Tape & Reel SZMM5ZxxxST1G SOD−523 (Pb−Free) 3,000 / Tape & Reel MM5ZxxxST5G SOD−523 (Pb−Free) 8,000 / Tape & Reel SZMM5ZxxxST5G SOD−523 (Pb−Free) 8,000 / Tape & Reel PD Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm2. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2014 August, 2018 − Rev. 13 1 See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. Publication Order Number: MM5Z2V4ST1/D MM5ZxxxST1G Series, SZMM5ZxxxST1G Series ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) Symbol Parameter VZ Reverse Zener Voltage @ IZT IZT Reverse Current ZZT Maximum Zener Impedance @ IZT IZK Reverse Current ZZK Maximum Zener Impedance @ IZK IR Reverse Leakage Current @ VR Reverse Voltage IF Forward Current VF Forward Voltage @ IF C VZ VR V IR VF IZT VR QVZ I IF Figure 1. Zener Voltage Regulator Maximum Temperature Coefficient of VZ Max. Capacitance @VR = 0 and f = 1 MHz ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types) Zener Voltage VZ ZZT IZ = IZT @ 10% Mod W Max mA V Min Max C pF Max @ VR = 0 f = 1 MHz Max IR @ VR dVZ/dt (mV/k) @ IZT1 = 5 mA Min Max ZZK IZ = 1.0 mA W Max 5.0 2.43 2.63 1000 100 120 1.0 −3.5 0 450 T3 5.0 2.67 2.91 1000 100 100 1.0 −3.5 0 450 MM5Z3V3ST1G T5 5.0 3.32 3.53 1000 95 5.0 1.0 −3.5 0 450 MM5Z3V6ST1G T6 5.0 3.60 3.85 1000 90 5.0 1.0 −3.5 0 450 MM5Z3V9ST1G T7 5.0 3.89 4.16 1000 90 3.0 1.0 −3.5 −2.5 450 MM5Z4V3ST1G T8 5.0 4.17 4.43 1000 90 3.0 1.0 −3.5 0 450 MM5Z4V7ST1G/T5G T9 5.0 4.55 4.75 800 80 3.0 2.0 −3.5 0.2 260 MM5Z5V1ST1G/T5G TA 5.0 4.98 5.2 500 60 2.0 2.0 −2.7 1.2 225 MM5Z5V6ST1G/T5G TC 5.0 5.49 5.73 200 40 1.0 2.0 −2.0 2.5 200 MM5Z6V2ST1G/T5G TE 5.0 6.06 6.33 100 10 3.0 4.0 0.4 3.7 185 MM5Z6V8ST1G/T5G TF 5.0 6.65 6.93 160 15 2.0 4.0 1.2 4.5 155 MM5Z7V5ST1G TG 5.0 7.28 7.6 160 15 1.0 5.0 2.5 5.3 140 MM5Z8V2ST1G/T5G TH 5.0 8.02 8.36 160 15 0.7 5.0 3.2 6.2 135 MM5Z9V1ST1G/T5G TK 5.0 8.85 9.23 160 15 0.5 6.0 3.8 7.0 130 MM5Z12VST1G TN 5.0 11.74 12.24 80 25 0.1 8.0 6.0 10 130 MM5Z16VST1G TU 5.0 15.85 16.51 80 40 0.05 11.2 10.4 14 105 MM5Z18VST1G TW 5.0 17.56 18.35 80 45 0.05 12.6 12.4 16 100 Device* Device Marking Test Current Izt mA MM5Z2V4ST1G/T5G T2 MM5Z2V7ST1G Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. *Includes SZ-prefix devices where applicable. www.onsemi.com 2 MM5ZxxxST1G Series, SZMM5ZxxxST1G Series TYPICAL CHARACTERISTICS 100 POWER DISSIPATION (%) 80 60 40 20 0 0 25 50 75 100 125 TEMPERATURE (°C) Figure 2. Steady State Power Derating www.onsemi.com 3 150 MM5ZxxxST1G Series, SZMM5ZxxxST1G Series PACKAGE DIMENSIONS SOD−523 CASE 502 ISSUE E −X− D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. −Y− E 2X b 0.08 1 M 2 X Y DIM A b c D E HE L L2 TOP VIEW A c MILLIMETERS MIN NOM MAX 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 1.10 1.20 1.30 0.70 0.80 0.90 1.50 1.60 1.70 0.30 REF 0.15 0.20 0.25 STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE HE SIDE VIEW 2X RECOMMENDED SOLDERING FOOTPRINT* L 2X 1.80 0.48 2X 0.40 2X L2 BOTTOM VIEW PACKAGE OUTLINE DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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