NUP1105LT1G,
SZNUP1105LT1G
ESD Protection Diode
Single Line CAN/LIN Bus Protector
The NUP1105L has been designed to protect LIN and single line
CAN transceivers from ESD and other harmful transient voltage
events. This device provides bidirectional protection for the data line
with a single SOT−23 package, giving the system designer a low cost
option for improving system reliability and meeting stringent EMI
requirements.
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SOT−23 BIDIRECTIONAL
VOLTAGE SUPPRESSOR
350 W PEAK POWER
Features
•
•
•
•
•
•
•
•
•
SOT−23 Package Allows One Separate Bidirectional Configuration
350 W Peak Power Dissipation per Line (8 x 20 msec Waveform)
Low Reverse Leakage Current (< 100 nA)
IEC Compatibility: − IEC 61000−4−2 (ESD): Level 4
− IEC 61000−4−4 (EFT): 40 A – 5/50 ns
− IEC 61000−4−5 (Lighting) 8.0 A (8/20 ms)
ISO 7637−1, Nonrepetitive EMI Surge Pulse TBD
ISO 7637−3, Repetitive Electrical Fast Transient (EFT) TBD
EMI Surge Pulses
Flammability Rating UL 94 V−0
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
1
3
2
• Automotive Electronics
PIN 1. ANODE
2. ANODE
3. CATHODE
MARKING DIAGRAM
27HMG
G
1
27H
M
G
Applications
= Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
LIN Bus
♦ Single Line CAN
Industrial Control Networks
♦ Smart Distribution Systems (SDS®)
♦ DeviceNet™
♦
•
SOT−23
CASE 318
STYLE 27
ORDERING INFORMATION
Package
Shipping†
NUP1105LT1G
SOT−23
(Pb−Free)
3,000 /
Tape & Reel
SZNUP1105LT1G
SOT−23
(Pb−Free)
3,000 /
Tape & Reel
NUP1105LT3G
SOT−23
(Pb−Free)
10,000 /
Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2004
October, 2017 − Rev. 7
1
Publication Order Number:
NUP1105L/D
NUP1105LT1G, SZNUP1105LT1G
MAXIMUM RATINGS (TJ = 25°C, unless otherwise specified)
Symbol
PPK
Rating
Value
Peak Power Dissipation
8 x 20 ms Double Exponential Waveform (Note 1)
Unit
W
350
TJ
Operating Junction Temperature Range
−55 to 150
°C
TJ
Storage Temperature Range
−55 to 150
°C
TL
Lead Solder Temperature (10 s)
260
°C
Human Body model (HBM)
Machine Model (MM)
IEC 61000−4−2 Specification (Contact)
16
400
30
kV
V
kV
ESD
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Non-repetitive current pulse per Figure 1.
ELECTRICAL CHARACTERISTICS (TJ = 25°C, unless otherwise specified)
Symbol
VRWM
Parameter
Test Conditions
Reverse Working Voltage
(Note 2)
Breakdown Voltage
IT = 1 mA (Note 3)
IR
Reverse Leakage Current
VRWM = 24 V
VC
Clamping Voltage
VC
VBR
Min
Typ
Max
24
Unit
V
25.7
28.4
V
100
nA
IPP = 5 A (8 x 20 ms Waveform) (Note 4)
40
V
Clamping Voltage
IPP = 8 A (8 x 20 ms Waveform) (Note 4)
44
V
IPP
Maximum Peak Pulse Current
8 x 20 ms Waveform (Note 4)
8.0
A
CJ
Capacitance
VR = 0 V, f = 1 MHz (Anode to GND)
VR = 0 V, f = 1 MHz (Anode to Anode)
60
30
pF
15
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Surge protection devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater
than the DC or continuous peak operating voltage level.
3. VBR is measured at pulse test current IT.
4. Pulse waveform per Figure 1.
5. Include SZ-prefix devices where applicable.
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2
NUP1105LT1G, SZNUP1105LT1G
TYPICAL PERFORMANCE CURVES
(TJ = 25°C unless otherwise noted)
% OF PEAK PULSE CURRENT
WAVEFORM
PARAMETERS
tr = 8 ms
td = 20 ms
90
80
c−t
70
IPP, PEAK PULSE CURRENT (A)
12.0
110
100
60
td = IPP/2
50
40
30
20
10
0
0
10
5
20
15
8.0
6.0
4.0
2.0
0.0
30
25
PULSE WAVEFORM
8 x 20 ms per Figure 1
10.0
25
30
45
50
Figure 2. Clamping Voltage vs Peak Pulse Current
Figure 1. Pulse Waveform, 8 × 20 ms
30
45
40
29
35
28
VZ, (V)
30
25
20
VZ
27
26
15
10
25
5
−10
40
90
140
24
−60
190
−10
40
90
140
190
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 3. Typical Leakage vs. Temperature
Figure 4. Typical VZ @ 1.0 mA vs. Temperature
60
25°C
50
CAPACITANCE (pF)
IR, (nA)
40
VC, CLAMPING VOLTAGE (V)
t, TIME (ms)
0
−60
35
40
30
20
10
0
0
5
10
15
20
VBIAS
Figure 5. Capacitance vs. VBIAS
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3
25
NUP1105LT1G, SZNUP1105LT1G
APPLICATIONS SECTION
The NUP1105L provides a surge protection solution for
the LIN data communication bus. The NUP1105L is a dual
bidirectional surge protection device in a compact
SOT−23 package. This device is based on Zener technology
that optimizes the active area of a PN junction to provide
robust protection against transient EMI surge voltage and
ESD. The NUP1105L has been tested to EMI and ESD
levels that exceed the specifications of popular high speed
LIN networks.
VBattery =
8 to 18 V
Voltage
Regulator
Receiver
The NUP1105L device can be used to provide transcient
voltage suppression for a single data line CAN system.
Figure 7 provides an example of a single data line CAN
protection circuit.
CAN
Transceiver
NUP1105L
Figure 7. High−Speed and Fault Tolerant CAN Surge
Protection Circuit
VOUT = 5 V
LIN Bus
Transmitter
LIN Transceiver
CAN_Data_Line
NUP1105L
Figure 6. LIN Transceiver
SDS is a registered trademark of Honeywell International Inc.
DeviceNet is a trademark of Rockwell Automation.
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4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318
ISSUE AT
DATE 01 MAR 2023
SCALE 4:1
GENERIC
MARKING DIAGRAM*
XXXMG
G
1
XXX = Specific Device Code
M = Date Code
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
STYLES ON PAGE 2
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42226B
SOT−23 (TO−236)
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318
ISSUE AT
DATE 01 MAR 2023
STYLE 1 THRU 5:
CANCELLED
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
STYLE 7:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
STYLE 9:
PIN 1. ANODE
2. ANODE
3. CATHODE
STYLE 10:
PIN 1. DRAIN
2. SOURCE
3. GATE
STYLE 11:
STYLE 12:
PIN 1. ANODE
PIN 1. CATHODE
2. CATHODE
2. CATHODE
3. CATHODE−ANODE
3. ANODE
STYLE 15:
PIN 1. GATE
2. CATHODE
3. ANODE
STYLE 16:
PIN 1. ANODE
2. CATHODE
3. CATHODE
STYLE 17:
PIN 1. NO CONNECTION
2. ANODE
3. CATHODE
STYLE 18:
STYLE 19:
STYLE 20:
PIN 1. CATHODE
PIN 1. NO CONNECTION PIN 1. CATHODE
2. CATHODE
2. ANODE
2. ANODE
3. ANODE
3. CATHODE−ANODE
3. GATE
STYLE 21:
PIN 1. GATE
2. SOURCE
3. DRAIN
STYLE 22:
PIN 1. RETURN
2. OUTPUT
3. INPUT
STYLE 23:
PIN 1. ANODE
2. ANODE
3. CATHODE
STYLE 24:
PIN 1. GATE
2. DRAIN
3. SOURCE
STYLE 27:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
STYLE 28:
PIN 1. ANODE
2. ANODE
3. ANODE
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42226B
SOT−23 (TO−236)
STYLE 8:
PIN 1. ANODE
2. NO CONNECTION
3. CATHODE
STYLE 13:
PIN 1. SOURCE
2. DRAIN
3. GATE
STYLE 25:
PIN 1. ANODE
2. CATHODE
3. GATE
STYLE 14:
PIN 1. CATHODE
2. GATE
3. ANODE
STYLE 26:
PIN 1. CATHODE
2. ANODE
3. NO CONNECTION
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
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Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
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