TN4033A

TN4033A

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    TO92-3

  • 描述:

    TRANS PNP 80V 1A TO-226

  • 数据手册
  • 价格&库存
TN4033A 数据手册
TN4033A TN4033A C TO-226 B E PNP General Purpose Amplifier This device is designed for general purpose amplifier and switching applications at currents to 500 mA and collector voltages up to 70V. Sourced from Process 67. Absolute Maximum Ratings* Symbol TA = 25°C unless otherwise noted Parameter Value Units VCEO Collector-Emitter Voltage 80 V VCBO Collector-Base Voltage 80 V VEBO Emitter-Base Voltage 5.0 V IC Collector Current - Continuous TJ, Tstg Operating and Storage Junction Temperature Range 1.0 A -55 to +150 °C *These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. NOTES: 1) These ratings are based on a maximum junction temperature of 150 degrees C. 2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations. 3) All voltages (V) and currents (A) are negative polarity for PNP transistors. Thermal Characteristics Symbol PD TA = 25°C unless otherwise noted Characteristic RθJC Total Device Dissipation Derate above 25°C Thermal Resistance, Junction to Case RθJA Thermal Resistance, Junction to Ambient  1997 Fairchild Semiconductor Corporation Max Units TN4033A 1.0 8.0 125 W mW/°C °C/W 50 °C/W (continued) Electrical Characteristics Symbol TA = 25°C unless otherwise noted Parameter Test Conditions Min Max Units OFF CHARACTERISTICS V(BR)CEO Collector-Emitter Sustaining Voltage* IC = 10 mA, IB = 0 80 V V(BR)CBO Collector-Base Breakdown Voltage IC = 10 µA, IE = 0 80 V V(BR)EBO Emitter-Base Breakdown Voltage IE = 10 µA, IC = 0 5.0 V ICBO Collector-Cutoff Current IEBO Emitter-Cutoff Current VCB = 60 V, IE = 0 VCB = 60 V, IE = 0, TA = 150°C VEB = 5.0 V, IC = 0 50 50 10 nA µA µA ON CHARACTERISTICS VCE(sat) Collector-Emitter Saturation Voltage VBE(sat) Base-Emitter Saturation Voltage IC = 100 µA, VCE = 5.0 V IC=100mA, VCE=5.0V,TA = -55°C IC = 100 mA, VCE = 5.0 V IC = 500 mA, VCE = 5.0 V IC = 1.0 A, VCE = 5.0 V IC = 150 mA, IB = 15 mA IC = 500 mA, IB = 50 mA IC = 150 mA, IB = 15 mA VBE(on) Base-Emitter On Voltage IC = 500 mA, VCE = 0.5 V hFE DC Current Gain 75 40 100 70 25 300 0.15 0.5 0.9 V V V 1.1 V SMALL SIGNAL CHARACTERISTICS Cobo Output Capacitance VCB = 10 V, IE = 0, f = 1.0 MHz 20 pF Cibo Input Capacitance VEB = 0.5 V, IC = 0, f = 1.0 MHz 110 pF hfe Small-Signal Current Gain IC = 50 mA, VCE = 10 V, f = 100 MHz 1.0 4.0 SWITCHING CHARACTERISTICS ts Storage Time IC = 500 mA, IB1 = IB2 = 50 mA 350 ns ton Turn-On Time IC = 500 mA, IB1 = 50 mA 100 ns tf Fall Time IC = 500 mA, IB1 = IB2 = 50 mA 50 ns *Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 1.0% NOTE: All voltages (V) and currents (A) are negative polarity for PNP transistors. TN4033A PNP General Purpose Amplifier (continued) 300 V CE = 5V 250 200 125 °C 150 25 °C 100 50 - 40 °C 0 0.1 0.3 1 3 10 30 100 300 I C - COLLECTOR CURRENT (mA) 1000 Base-Emitter Saturation Voltage vs Collector Current 1.2 β = 10 1 - 40 °C 0.8 25 °C 125 °C 0.6 0.4 10 IC 100 - COLLECTOR CURRENT ( mA) 1000 V CESAT - COLLE CTOR-EMITTER VOLTAGE (V) Typical Pulsed Current Gain vs Collector Current 0.6 β = 10 0.4 25 °C 125 °C 0.2 - 40 °C 10 100 I C - COLLECTOR CURRENT (mA) 1000 Base-Emitter ON Voltage vs Collector Current 1 VCE = 5V 0.8 - 40 °C 0.6 25 °C 0.4 0.2 0.1 125 °C 1 10 I C - COLLECTOR CURRENT (mA) 50 Collector-Base and Emitter-Base Capacitance vs Reverse Bias Voltage Collector-Cutoff Current vs Ambient Temperature 100 500 f = 1.0 MHz V CB = 50V CAPACITANCE (pF) I CBO - COLLECTOR CURRENT (nA) Collector-Emitter Saturation Voltage vs Collector Current V BE(O N)- BASE-E MITTER ON VOLTAGE (V) V BESAT - BASE-EMITTER VOLTAG E (V) h FE- TYPICAL PULSED CURRENT GAIN Typical Characteristics 10 1 0.1 200 100 50 C ibo 20 C obo 10 25 50 75 100 125 T A - AMBIENT TE MPE RATURE (° C) 150 6 0.1 1 10 REVERSE BIAS VOLTAGE (V) 50 TN4033A PNP General Purpose Amplifier (continued) Typical Characteristics (continued) Switching Times vs Collector Current Turn On and Turn Off Times vs Collector Current 240 500 V CE = -10V t off 400 TIME (ns) 160 V CE = -1.0V 120 80 0 I B1 = I B2 = I C V CC = - 30V 10 300 200 100 40 1 2 20 100 I C - COLLECTOR CURRENT (mA) 200 t on 0 10 100 500 I C - COLLECTOR CURRENT (mA) Power Dissipation vs Ambient Temperature 1 PD - POWER DISSIPATION (W) TIME (ns) 200 TO-226 0.75 0.5 0.25 0 0 25 50 75 100 TEMPERATURE ( o C) 125 150 1000 TN4033A PNP General Purpose Amplifier TO-226AE Tape and Reel Data TO -226AE Packaging Conf iguratio n: Fi gur e 1.0 TAPE and REEL OPTION FSCINT Label sampl e See Fig 2.0 for va rious FAIRCHIL D S EMICONDUCTOR CORPORATION L OT: CBVK741B019 PN2222N NSID: D/C1: QTY: Reeling Styles HTB:B 10000 SP EC: FSCINT D9842 SP EC RE V: Labe l B2 QA REV: 5 Reels per Int er med iate B ox (FSCINT) Cus tom ized F63TNR Label s ampl e Labe l LOT: CBVK7 41B019 FSID: PN222N D/C1: D9842 D/C2: F63TNR QTY: 2000 Labe l SPEC: QTY1: QTY2: SPEC REV: CPN: N/F: F Cus tom ized Labe l (F63TNR)3 375m m x 267m m x 375mm Int er med iate B ox AMMO PACK OPTION See Fig 3.0 for 2 Ammo Pack Options TO-226AE TNR/AMMO PACKING INFO RMATION Packing Style Quantity Reel A 2,000 D26Z E 2,000 D27Z Am m o M P EOL code 2,000 Uni t wei gh t FSCINT D74Z 2,000 Labe l D75Z 327m m x 158m m x 135mm = 0.300g m Reel weig ht wi th c om po nents = 0.868 k g Amm o weig ht wi th c omp on en ts = 0.880 k g Im med iate B ox 5 A mm o box es per Int er med iate B ox Cus tom ized Labe l Max q uanti ty p er i nte rm ed iate b ox = 10,000 un its Cus tom ized Labe l F63TNR Bar c ode Label 333m m x 231m m x 183mm Int er med iate B ox BULK OPTION See Bulk Packing Informat ion table Anti -stati c FSCINT Bar c ode Label Bub ble Sheets (TO-226AE ) BULK PACKING INFORMATION EOL CODE J18Z J05Z NO EOL CODE DESCRIPTION LEADCLIP DIMENSION QUANTITY TO-18 OPTION STD NO L EAD CLIP 1.0 K / BOX TO-5 NO L EAD CLIP 1.0 K / BOX NO L EADCLIP 1.5 K / BOX OPTION STD TO-226 STANDARD STRAIGHT 1,500 un its per 114m m x 102m m x 51mm EO70 box for s td o pti on EO70 Im mediate B ox 5 EO70 boxes pe r Int er med iate B ox 530m m x 130m m x 83mm Inter med iate box Cus tomized Label FSCINT Labe l 7,500 un its m axim um per interm edi at e box for st d opt ion ©2000 Fairchild Semiconductor International October 1999, Rev. A1 TO-226AE Tape and Reel Data, continued TO-226AE Reeling Style Configuration: Fi gure 2.0 Machine Option "A" (H) Machine Option "E"(J) Style "A" D26Z, D70Z (s/h) Style "E" D 27Z, D71Z (s/h) TO-226AE Radial Ammo Packaging Configuration: Fi gure 3.0 FIRST WIRE OFF IS EMITTER (ON PKG. 92) FIRST WIRE OFF IS COL LECTOR (ON PKG. 92) ADHESIVE TAPE IS ON THE TOP SIDE ADHESIVE TAPE IS ON THE TOP SIDE FLAT OF TRANSISTOR IS ON BOTTOM FLAT OF TRANSISTOR IS ON TOP ORDER STYLE D74Z (M) ORDER STYLE D75Z (P) FIRST WIRE OFF IS EMITTER FIRST WIRE OFF IS COL LECTOR ADHESIVE TAPE IS ON BOTTOM SIDE ADHESIVE TAPE IS ON BOTTOM SIDE FLAT OF TRANSISTOR IS ON BOTTOM FLAT OF TRANSISTOR IS ON TOP October 1999, Rev. A1 TO-226AE Tape and Reel Data, continued TO-226AE Tape and Reel Taping Dimension Configuration: Fi gur e 4.0 Hd P Pd b Hb W1 d L H1 HO L1 S WO t W2 W t1 P1 F1 DO P2 PO User Direction of Feed TO-226AE Reel Configuration: Fi gur e 5.0 ITEM DESCRI PTION SYM BOL DIMENSION Base of Package to Lead Bend b 0.098 (max) Component Height Hb 1.078 (+/- 0.050) Lead Clinch He ight HO 0.630 (+/- 0.020) Component Base Heig ht H1 0.748 (+/- 0.020) Component Alignment (s ide / side ) Pd 0.040 (max) Component Alignment ( front/back ) Hd 0.031 (max) Component Pitch P 0.500 (+/- 0.020) Feed Hole Pitch PO 0.500 (+/- 0.008) Hole Center to First Lead P1 0.150 (+0.009, -0.010 ) Hole Center to Component Center P2 0.247 (+/- 0.007) Lead Spread F1/F2 0.104 (+/- 0 .010) Lead Thickness d 0.018 (+0.002, -0.003) Cut Lead Length L 0.429 (max) Taped Lead Lengt h L1 0.209 (+0.051, -0.052) Taped Lead Thickness t 0.032 (+/- 0.006) Carrier Tape Thickness t1 0.021 (+/- 0.006) Carrier Tape Width W 0.708 (+0.020, -0.019) Hold - down Tape Width WO 0.236 (+/- 0.012) Hold - down Tape position W1 0.035 (max) Feed Hole Position W2 0.360 (+/- 0.025) Sprocket Hole Diameter DO 0.157 (+0.008, -0.007) Lead Spring O ut S 0.004 (max) Note : All dimensions are in inches. E LE CT ROS TA TIC S EN SI TIV E D EV ICE S D4 D1 D2 F63TNR Label ITEM DESCRIPT ION SYMBOL Reel Diamet er D1 13.975 Arbor Hole Diameter (Standard) D2 1.160 1.200 (Small Hole) D2 0.650 0.700 Customized Label MAXIMUM 14.025 Core Diameter D3 3.100 3.300 Hub Recess Inner Diameter D4 2.700 3.100 Hub Recess Dept h W1 MINIMUM W1 0.370 0.570 Flange to Flange Inner W idth W2 1.630 1.690 Hu b to Hu b Cente r W idth W3 2.09 0 W3 W2 Note: All dimensions are inches D3 October 1999, Rev. A1 TO-226AE Package Dimensions TO-226AE (FS PKG Code 95, 99) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.300 S4.70-4.32; S1.52-1.02; 2" TYP S7.73-7.10; S7.87-7.37; 2" TYP S1.65-1.27; 0.51 S0.760.36; S15.61-14.47; S0.51-0.36; S0.48-0.30; S1.40-1.14; PIN S1.40-1.14; 99 95 1 E E 2 B C 3 C B S4.45-3.81; 5" TYP 1 2 3 TO-226AE (95,99) S2.41-2.13; ©2000 Fairchild Semiconductor International For leadformed option ordering, refer to Tape & Reel data information. October 1999, Rev. A1 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ DOME™ E2CMOSTM EnSignaTM FACT™ FACT Quiet Series™ FAST  FASTr™ GlobalOptoisolator™ GTO™ HiSeC™ ISOPLANAR™ MICROWIRE™ OPTOLOGIC™ OPTOPLANAR™ PACMAN™ POP™ PowerTrench  QFET™ QS™ QT Optoelectronics™ Quiet Series™ SILENT SWITCHER  SMART START™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ UHC™ VCX™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. G
TN4033A 价格&库存

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