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TN6714A_D27Z

TN6714A_D27Z

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    TO92-3

  • 描述:

    TRANS NPN 30V 2A TO-226

  • 数据手册
  • 价格&库存
TN6714A_D27Z 数据手册
Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. TN6714A / NZT6714 TN6714A NZT6714 C E C C B TO-226 B SOT-223 E NPN General Purpose Amplifier This device is designed for general purpose medium power amplifiers and switches requiring collector currents to 1.5 A. Sourced from Process 37. Absolute Maximum Ratings* Symbol TA = 25°C unless otherwise noted Parameter Value Units VCEO Collector-Emitter Voltage 30 V VCBO Collector-Base Voltage 40 V VEBO Emitter-Base Voltage 5.0 V IC Collector Current - Continuous 2.0 A TJ, Tstg Operating and Storage Junction Temperature Range -55 to +150 °C *These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. NOTES: 1) These ratings are based on a maximum junction temperature of 150 degrees C. 2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations. Thermal Characteristics Symbol PD TA = 25°C unless otherwise noted Characteristic RθJC Total Device Dissipation Derate above 25°C Thermal Resistance, Junction to Case RθJA Thermal Resistance, Junction to Ambient Max *NZT6714 1.0 8.0 125 125 *Device mounted on FR-4 PCB 36 mm X 18 mm X 1.5 mm; mounting pad for the collector lead min. 6 cm . 2  1997 Fairchild Semiconductor Corporation Units TN6714A 1.0 8.0 50 W mW/°C °C/W °C/W (continued) Electrical Characteristics Symbol TA= 25°C unless otherwise noted Parameter Test Conditions Min Max Units OFF CHARACTERISTICS V(BR)CEO Collector-Emitter Breakdown Voltage* IC = 10 mA, IB = 0 30 V V(BR)CBO Collector-Base Breakdown Voltage V(BR)EBO Emitter-Base Breakdown Voltage IC = 100 µA, IE = 0 40 V IE = 100 µA, IC = 0 5.0 ICBO Collector-Cutoff Current VCB = 40 V, IE = 0 0.1 µA IEBO Emitter-Cutoff Current VEB = 5.0 V, IC = 0 0.1 µA 250 0.5 V 1.2 V TN6714A / NZT6714 NPN General Purpose Amplifier V ON CHARACTERISTICS hFE DC Current Gain VCE(sat) Collector-Emitter Saturation Voltage IC = 10 mA, VCE = 1.0 V IC = 100 mA, VCE = 1.0 V IC = 1.0 A, VCE = 1.0 V IC = 1.0 A, IB = 100 mA VBE(on) Base-Emitter On Voltage IC = 1.0 A, VCE = 1.0 V 55 60 50 SMALL SIGNAL CHARACTERISTICS hfe Small-Signal Current Gain Ccb Collector-Base Capacitance IC = 50 mA, VCE = 10 V, f = 20 MHz VCB = 10 mA, IE = 0, f = 1.0 MHz 2.5 25 30 pF *Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 1.0% 3 Typical Pulsed Current Gain vs Collector Current 500 V CE = 5V 400 125 °C 300 25 °C 200 - 40 °C 100 0 0.001 0.01 0.1 I C - COLLECTOR CURRENT (A) 1 VCESAT - COLLE CTOR-EMITTER VOLTAGE (V) h FE - TYP ICAL PULSED CURRE NT GAIN Typical Characteristics Collector-Emitter Saturation Voltage vs Collector Current 1 β = 10 25 °C 0.1 125 °C 0.01 0.01 - 40 °C 0.1 I C - COLLE CTOR CURRENT (A) 1 (continued) Base-Emitter Saturation Voltage vs Collector Current β = 10 1.4 1.2 1 - 40 °C 0.8 25 °C 0.6 125 °C 0.4 0.2 0.01 IC 0.1 - COLLE CTOR CURRENT ( A) 1 V h FE - GAIN BANDWIDTH PRODUCT (MHz) = 20V CB 10 1 0.1 25 50 75 100 125 T A - AMBIENT TEMPERATURE (°C) 150 Gain Bandwidth Product vs Collector Current V CE = 10V 300 200 100 10 100 I C - COLLECTOR CURRENT (mA) - 40 °C 0.8 0.6 25 °C 0.4 0.2 VCE = 5V 125 °C 1 10 100 I C - COLLECTOR CURRENT (mA) 1000 Collector-Base Capacitance vs Collector-Base Voltage 40 30 20 10 0 0 4 8 12 16 20 24 28 VCB - COLLECTOR-BASE VOLTAGE (V) 10 400 1 1 Safe Operating Area TO-226 / SOT-223 500 0 Base-Emitter ON Voltage vs Collector Current COLLECTOR-BASE CAPACITANCE (pF) 100 I C - COLLECTOR CURRENT (A) I CBO - COLLECTOR CURRENT (nA) Collector-Cutoff Current vs Ambient Temperature V BE(O N)- BASE-E MITTER ON VOLTAGE (V) (continued) OBO - V BESAT - BASE-EMITTER VOLTAG E (V) Typical Characteristics 1000 DC 1 100 T CO L LE DC T *PULSED OPERATION T A = 25 °C 0.1 10 µS * µS * CT OR LE AM AD BIE =2 5° NT =2 5° 1.0 ms * C C LIMIT DETERMINED BY BV CEO 0.01 1 10 V CE - COLLECTOR-EMITTER VOLTAGE (V) 100 TN6714A / NZT6714 NPN General Purpose Amplifier (continued) Typical Characteristics (continued) Power Dissipation vs Ambient Temperature PD - POWER DISSIPATION (W) 1 0.75 TN6714A / NZT6714 NPN General Purpose Amplifier TO-226 SOT-223 0.5 0.25 0 0 25 50 75 100 TEMPERATURE (o C) 125 150 3 TO-226AE Tape and Reel Data TO -226AE Packaging Conf iguratio n: Fi gur e 1.0 TAPE and REEL OPTION FSCINT Label sampl e See Fig 2.0 for va rious FAIRCHIL D S EMICONDUCTOR CORPORATION L OT: CBVK741B019 PN2222N NSID: D/C1: QTY: Reeling Styles HTB:B 10000 SP EC: FSCINT D9842 SP EC RE V: Labe l B2 QA REV: 5 Reels per Int er med iate B ox (FSCINT) Cus tom ized F63TNR Label s ampl e Labe l LOT: CBVK7 41B019 FSID: PN222N D/C1: D9842 D/C2: F63TNR QTY: 2000 Labe l SPEC: QTY1: QTY2: SPEC REV: CPN: N/F: F Cus tom ized Labe l (F63TNR)3 375m m x 267m m x 375mm Int er med iate B ox AMMO PACK OPTION See Fig 3.0 for 2 Ammo Pack Options TO-226AE TNR/AMMO PACKING INFO RMATION Packing Style Quantity Reel A 2,000 D26Z E 2,000 D27Z Am m o M P EOL code 2,000 Uni t wei gh t FSCINT D74Z 2,000 Labe l D75Z 327m m x 158m m x 135mm = 0.300g m Reel weig ht wi th c om po nents = 0.868 k g Amm o weig ht wi th c omp on en ts = 0.880 k g Im med iate B ox 5 A mm o box es per Int er med iate B ox Cus tom ized Labe l Max q uanti ty p er i nte rm ed iate b ox = 10,000 un its Cus tom ized Labe l F63TNR Bar c ode Label 333m m x 231m m x 183mm Int er med iate B ox BULK OPTION See Bulk Packing Informat ion table Anti -stati c FSCINT Bar c ode Label Bub ble Sheets (TO-226AE ) BULK PACKING INFORMATION EOL CODE J18Z J05Z NO EOL CODE DESCRIPTION LEADCLIP DIMENSION QUANTITY TO-18 OPTION STD NO L EAD CLIP 1.0 K / BOX TO-5 NO L EAD CLIP 1.0 K / BOX NO L EADCLIP 1.5 K / BOX OPTION STD TO-226 STANDARD STRAIGHT 1,500 un its per 114m m x 102m m x 51mm EO70 box for s td o pti on EO70 Im mediate B ox 5 EO70 boxes pe r Int er med iate B ox 530m m x 130m m x 83mm Inter med iate box Cus tomized Label FSCINT Labe l 7,500 un its m axim um per interm edi at e box for st d opt ion ©2000 Fairchild Semiconductor International October 1999, Rev. A1 TO-226AE Tape and Reel Data, continued TO-226AE Reeling Style Configuration: Fi gure 2.0 Machine Option "A" (H) Machine Option "E"(J) Style "A" D26Z, D70Z (s/h) Style "E" D 27Z, D71Z (s/h) TO-226AE Radial Ammo Packaging Configuration: Fi gure 3.0 FIRST WIRE OFF IS EMITTER (ON PKG. 92) FIRST WIRE OFF IS COL LECTOR (ON PKG. 92) ADHESIVE TAPE IS ON THE TOP SIDE ADHESIVE TAPE IS ON THE TOP SIDE FLAT OF TRANSISTOR IS ON BOTTOM FLAT OF TRANSISTOR IS ON TOP ORDER STYLE D74Z (M) ORDER STYLE D75Z (P) FIRST WIRE OFF IS EMITTER FIRST WIRE OFF IS COL LECTOR ADHESIVE TAPE IS ON BOTTOM SIDE ADHESIVE TAPE IS ON BOTTOM SIDE FLAT OF TRANSISTOR IS ON BOTTOM FLAT OF TRANSISTOR IS ON TOP October 1999, Rev. A1 TO-226AE Tape and Reel Data, continued TO-226AE Tape and Reel Taping Dimension Configuration: Fi gur e 4.0 Hd P Pd b Hb W1 d L H1 HO L1 S WO t W2 W t1 P1 F1 DO P2 PO User Direction of Feed TO-226AE Reel Configuration: Fi gur e 5.0 ITEM DESCRI PTION SYM BOL DIMENSION Base of Package to Lead Bend b 0.098 (max) Component Height Hb 1.078 (+/- 0.050) Lead Clinch He ight HO 0.630 (+/- 0.020) Component Base Heig ht H1 0.748 (+/- 0.020) Component Alignment (s ide / side ) Pd 0.040 (max) Component Alignment ( front/back ) Hd 0.031 (max) Component Pitch P 0.500 (+/- 0.020) Feed Hole Pitch PO 0.500 (+/- 0.008) Hole Center to First Lead P1 0.150 (+0.009, -0.010 ) Hole Center to Component Center P2 0.247 (+/- 0.007) Lead Spread F1/F2 0.104 (+/- 0 .010) Lead Thickness d 0.018 (+0.002, -0.003) Cut Lead Length L 0.429 (max) Taped Lead Lengt h L1 0.209 (+0.051, -0.052) Taped Lead Thickness t 0.032 (+/- 0.006) Carrier Tape Thickness t1 0.021 (+/- 0.006) Carrier Tape Width W 0.708 (+0.020, -0.019) Hold - down Tape Width WO 0.236 (+/- 0.012) Hold - down Tape position W1 0.035 (max) Feed Hole Position W2 0.360 (+/- 0.025) Sprocket Hole Diameter DO 0.157 (+0.008, -0.007) Lead Spring O ut S 0.004 (max) Note : All dimensions are in inches. E LE CT ROS TA TIC S EN SI TIV E D EV ICE S D4 D1 D2 F63TNR Label ITEM DESCRIPT ION SYMBOL Reel Diamet er D1 13.975 Arbor Hole Diameter (Standard) D2 1.160 1.200 (Small Hole) D2 0.650 0.700 Customized Label MAXIMUM 14.025 Core Diameter D3 3.100 3.300 Hub Recess Inner Diameter D4 2.700 3.100 Hub Recess Dept h W1 MINIMUM W1 0.370 0.570 Flange to Flange Inner W idth W2 1.630 1.690 Hu b to Hu b Cente r W idth W3 2.09 0 W3 W2 Note: All dimensions are inches D3 October 1999, Rev. A1 TO-226AE Package Dimensions TO-226AE (FS PKG Code 95, 99) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.300 S4.70-4.32; S1.52-1.02; 2" TYP S7.73-7.10; S7.87-7.37; 2" TYP S1.65-1.27; 0.51 S0.760.36; S15.61-14.47; S0.51-0.36; S0.48-0.30; S1.40-1.14; PIN S1.40-1.14; 99 95 1 E E 2 B C 3 C B S4.45-3.81; 5" TYP 1 2 3 TO-226AE (95,99) S2.41-2.13; ©2000 Fairchild Semiconductor International For leadformed option ordering, refer to Tape & Reel data information. October 1999, Rev. A1 SOT-223 Tape and Reel Data SOT-223 Packaging Configuration: Figure 1.0 Customized Label Packaging Description: F63TNR Label Antistatic Cover Tape SOT-223 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped with 2,500 units per 13" or 330cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (antistatic coated). Other option comes in 500 units per 7" or 177cm diameter reel. This and some other options are further described in the Packaging Information table. These full reels are individually barcode labeled and placed inside a standard intermediate box (illustrated in figure 1.0) made of recyclable corrugated brown paper. One box contains two reels maximum. And these boxes are placed inside a barcode labeled shipping box which comes in different sizes depending on the number of parts shipped. Static Dissipative Embossed Carrier Tape F852 014 F852 014 F852 014 F852 014 SOT-223 Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Standard (no flow code) TNR 2,500 D84Z SOT-223 Unit Orientation TNR 500 13" Dia 7" Dia 343x64x343 184x187x47 Max qty per Box 5,000 1,000 Weight per unit (gm) 0.1246 0.1246 Weight per Reel (kg) 0.7250 0.1532 343mm x 342mm x 64mm Intermediate box for Standard F63TNR Label Note/Comments F63TNR Label F63TNR Label sample 184mm x 184mm x 47mm Pizza Box for D84Z Option SOT-223 Tape Leader and Trailer Configuration: Figure 2.0 LOT: CBVK741B019 QTY: 3000 FSID: PN2222A SPEC: D/C1: D9842 D/C2: QTY1: QTY2: SPEC REV: CPN: N/F: F (F63TNR)3 Carrier Tape Cover Tape Components Trailer Tape 300mm minimum or 38 empty pockets ©2000 Fairchild Semiconductor International Leader Tape 500mm minimum or 62 empty pockets September 1999, Rev. B SOT-223 Tape and Reel Data, continued SOT-223 Embossed Carrier Tape Configuration: Figure 3.0 P0 D0 T E1 F K0 Wc W E2 B0 Tc A0 D1 P1 User Direction of Feed Dimensions are in millimeter Pkg type SOT-223 (12mm) A0 6.83 +/-0.10 B0 7.42 +/-0.10 W 12.0 +/-0.3 D0 D1 1.55 +/-0.05 1.50 +/-0.10 E1 E2 1.75 +/-0.10 F 10.25 min P1 5.50 +/-0.05 P0 8.0 +/-0.1 4.0 +/-0.1 K0 1.88 +/-0.10 Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C). T Wc 0.292 +/0.0130 9.5 +/-0.025 0.06 +/-0.02 0.5mm maximum 20 deg maximum Typical component cavity center line B0 Tc 0.5mm maximum 20 deg maximum component rotation Typical component center line Sketch A (Side or Front Sectional View) A0 Component Rotation Sketch C (Top View) Component lateral movement Sketch B (Top View) SOT-223 Reel Configuration: Figure 4.0 Component Rotation W1 Measured at Hub Dim A Max Dim A max See detail AA Dim N 7" Diameter Option B Min Dim C See detail AA W3 13" Diameter Option Dim D min W2 max Measured at Hub DETAIL AA Dimensions are in inches and millimeters Tape Size Reel Option Dim A Dim B 0.059 1.5 512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 5.906 150 0.488 +0.078/-0.000 12.4 +2/0 0.724 18.4 0.469 – 0.606 11.9 – 15.4 0.059 1.5 512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 7.00 178 0.488 +0.078/-0.000 12.4 +2/0 0.724 18.4 0.469 – 0.606 11.9 – 15.4 12mm 7" Dia 7.00 177.8 12mm 13" Dia 13.00 330 Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL) July 1999, Rev. B SOT-223 Package Dimensions SOT-223 (FS PKG Code 47) 1:1 Scale 1:1 on letter size paper Part Weight per unit (gram): 0.1246 ©2000 Fairchild Semiconductor International September 1999, Rev. C TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ DOME™ E2CMOSTM EnSignaTM FACT™ FACT Quiet Series™ FAST  FASTr™ GlobalOptoisolator™ GTO™ HiSeC™ ISOPLANAR™ MICROWIRE™ OPTOLOGIC™ OPTOPLANAR™ PACMAN™ POP™ PowerTrench  QFET™ QS™ QT Optoelectronics™ Quiet Series™ SILENT SWITCHER  SMART START™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ UHC™ VCX™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. G ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com © Semiconductor Components Industries, LLC N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 1 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative www.onsemi.com
TN6714A_D27Z 价格&库存

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