TS391SN2T1G

TS391, NCV391 Low Power Single Voltage Comparator Description The TS391 is an open collector, low−power voltage comparator designed specifically to operate from a single supply over a wide range of voltages. Operation from split power supplies is also possible. This comparator also has a unique characteristic in that the input common−mode voltage range includes ground, even though operated from a single power supply voltage. www.onsemi.com 5 1 TSOP−5 SN SUFFIX CASE 483 Features • Wide Single Supply Voltage Range or Dual Supplies • Low Supply Current (0.5 mA) Independent of Supply Voltage • • • • • • • • • (1 mW/Comparator at +5 V) Low Input Bias Current: 25 nA TYP Low Input Offset Current: ±5 nA TYP Low Input Offset Voltage: ±1 mV TYP Input Common Mode Voltage Range includes Ground Low Output Saturation Voltage: 250 mV TYP at IO = 4 mA Differential Input Voltage Range Equal to the Supply Voltage TTL, DTL, ECL, CMOS Compatible Devices These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable MARKING DIAGRAM 5 391AYWG G 1 Analog 391 A Y W G = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) PIN CONNECTIONS VCC IN+ Vout VEE VEE OUT 1 VEE 2 IN− 3 VEE VCC 4 IN+ ORDERING INFORMATION Package Shipping† TS391SN2T1G TSOP−5 (Pb−Free) 3000 / Tape & Reel NCV391SN2T1G* TSOP−5 (Pb−Free) 3000 / Tape & Reel Device IN− 5 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. * NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable © Semiconductor Components Industries, LLC, 2015 October, 2017 − Rev. 5 1 Publication Order Number: TS391/D TS391, NCV391 Table 1. ABSOLUTE MAXIMUM RATINGS (Over operating free−air temperature, unless otherwise stated) Symbol Limit Unit VS 36 V Input Voltage VIN −0.3 to 36 V Differential Input Voltage VID ±36 V ISC 20 mA Storage Temperature TSTG −65 to +150 °C Junction Temperature TJ +150 °C Human Body Model HBM 1500 V Charged Device Model CDM 2000 V MM 200 V Parameter Supply Voltage (VCC − VEE) INPUT AND OUTPUT PINS Output Short Circuit Current (Note 1) TEMPERATURE ESD RATINGS Machine Model Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Short circuits from the output to VCC can cause excessive heating and potential destruction. The maximum short circuit current is independent of the magnitude of VCC. Table 2. THERMAL INFORMATION (Note 2) Thermal Metric Junction to Ambient – SOIC8 Symbol Limit Unit qJA 238 °C/W 2. Short−circuits can cause excessive heating and destructive dissipation. These values are typical. Table 3. OPERATING CONDITIONS Parameter Symbol Limit Unit Operating Supply Voltage VS 2 to 36 V Specified Operating Range TA −40 to +125 °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 2 TS391, NCV391 Table 4. ELECTRICAL CHARACTERISTICS (Vs=+5.0 V, At TA = +25°C) Boldface limits apply over the specified temperature range, TA = –40°C to +125°C. Parameter Symbol Test Conditions Min Typ Max Unit 1 5 mV 9 mV 250 nA 400 nA INPUT CHARACTERISTICS Offset Voltage Input Bias Current Input Offset Current VOS Vo = 1.4 V, RS = 0 W, VS = 5 V to 30 V VCM = 0 to VCC −1.5 V VCM = 0 to VCC −2 V IIB 25 IOS Input Common Mode Range (Note 3) VICR Differential Input Voltage (Note 4) VID 5 50 nA 150 nA 0 VCC – 1.5 V 0 VCC – 2 V VCC V 400 mV 700 mV OUTPUT CHARACTERISTICS Output Voltage Low VOL Output Sink Current IO Output Leakage Current IOH VID = 1 V, IO = 4 mA VID = −1, VO = 1.5 V 250 6 VID = 1 V, VCC = VO = 5 V 16 mA 0.1 VID = 1 V, VCC = VO = 30 V nA 1 mA DYNAMIC PERFORMANCE Open Loop Voltage Gain AVOL VCC = 15 V, RPU = 15 kW Propagation Delay L−H tPLH Propagation Delay H−L tPHL 94 106 dB 5 mV overdrive, RPU = 5.1 kW 850 ns 20 mV overdrive, RPU = 5.1 kW 490 ns 100 mV overdrive, RPU = 5.1 kW 300 ns TTL Input, Vref = +1.4 V, RPU = 5.1 kW 220 ns 5 mV overdrive, RPU = 5.1 kW 620 ns 20 mV overdrive, RPU = 5.1 kW 400 ns 100 mV overdrive, RPU = 5.1 kW 250 ns TTL Input, Vref = +1.4 V, RPU = 5.1 kW 350 ns VCC = 5 V 0.5 − mA VCC = 30 V 0.5 1.25 mA POWER SUPPLY Quiescent Current ICC Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. The input common mode voltage of either input signal should not be allowed to go negative by more than 0.3 V. The upper end of the common mode voltage range is VCC – 1.5 V, but either or both inputs can go to +30 V without damage. 4. Positive excursions of the input voltage may exceed the power supply level. As long as the other voltage remains within the common mode range, the comparator will provide a proper output stage. The low input voltage state must not be less than 0.3 V below the negative supply rail. www.onsemi.com 3 TS391, NCV391 TYPICAL CHARACTERISTICS 30 1000 INPUT BIAS CURRENT (nA) SUPPLY CURRENT (mA) 900 −55°C 800 0°C 700 600 25°C 500 70°C 400 125°C 300 0°C −55°C 20 70°C 25°C 125°C 10 VIN = 0 V 0 200 0 5 10 15 20 25 30 0 40 35 5 10 15 20 25 30 35 SUPPLY VOLTAGE (V) VCC (V) Figure 1. Supply Current vs. Supply Voltage Figure 2. Input Bias Current vs. VCC 40 1 125°C 0.1 25°C −55°C 0.01 VS = 5 V RPU = 5.1 kW CL = 20 pF TA = 25°C 100 mV 20 mV 5 mV Input OUTPUT VOLTAGE (500 mV/div) INPUT VOLTAGE (100 mV/div) LOW LEVEL OUTPUT VOLTAGE (V) 10 0.001 0.1 1 10 100 LOW LEVEL OUTPUT CURRENT (mA) TIME (200 ns/div) INPUT VOLTAGE (100 mV/div) Figure 3. Low Level Output Voltage vs. Output Current Figure 4. Propagation Delay L−H vs. Overdrive VS = 5 V RPU = 5.1 kW CL = 20 pF TA = 25°C 100 mV 20 mV 5 mV Input TIME (100 ns/div) Figure 5. Propagation Delay H−L vs. Overdrive www.onsemi.com 4 OUTPUT VOLTAGE (500 mV/div) 0.01 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSOP−5 CASE 483 ISSUE N 5 1 SCALE 2:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. D 5X NOTE 5 2X DATE 12 AUG 2020 0.20 C A B 0.10 T M 2X 0.20 T 5 B 1 4 2 B S 3 K DETAIL Z G A A TOP VIEW DIM A B C D G H J K M S DETAIL Z J C 0.05 H C SIDE VIEW SEATING PLANE END VIEW GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT* 0.95 0.037 MILLIMETERS MIN MAX 2.85 3.15 1.35 1.65 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 0_ 10 _ 2.50 3.00 1.9 0.074 5 5 XXXAYWG G 1 1 Analog 2.4 0.094 XXX = Specific Device Code A = Assembly Location Y = Year W = Work Week G = Pb−Free Package 1.0 0.039 XXX MG G Discrete/Logic XXX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98ARB18753C TSOP−5 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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