OSI50603C1E

1.6x0.8 x0.6mm 940nm Infrared Chip SMD OSI50603C1E ■Features ■Outline ● Single chip ● Compact package outline Recommended Solder Pad Top 1 (L x W x T) of 1.6mm x 0.8mm x0.6mm ● Compatible to IR reflow soldering. ● Water Clear Lens Type Side 2 2 1 1 2 Anode Cathode Notes: 1. All dimensions are in millimeters ; 2. Tolerance is ± 0.10 mm unless otherwise noted. ■Applications ● Automatic Control System ● Photo Detector ● Computer I/O Peripheral ■Absolute Dimension Bottom 1 Maximum Rating Item 2 OR 1 2 ■Directivity (Ta=25℃) Symbol Value Unit DC Forward Current IF 30 mA Pulse Forward Current* IFP 100 mA Reverse Voltage VR 5 V Power Dissipation PD 45 mW Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40~ +85 Lead Soldering Temperature Tsol ℃ ℃ ℃/5sec 260 0 0 - *Pulse width Max 0.1ms, Duty ratio max 1/10 ■Electrical -Optical Characteristics Item Symbol Conditio n (Ta=25℃ (Ta=25℃) Min. Typ. Max. Unit DC Forward Voltage VF IF=20mA - 1.2 1.5 V DC Reverse Current IR VR=5V - - 10 µA Peak Wavelength λp IF=20mA - 940 - nm Transmit Bandwidth λ IF=20mA - 45 - nm Radiant Intensity Ie IF=20mA 0.2 0.8 - mW/Sr 120 - deg 50% Power Angle 2θ1/2 IF=20mA *1 Tolerance of measurements of Peak wavelength is +1nm *2 Tolerance of measurements of radiant intensity is +15% *3 Tolerance of measurements of forward voltage is +0.1V LED & Application Technologies http://www.optosupply.com VER A.1.1 1.6x0.8 x0.6mm 940nm Infrared Chip SMD OSI50603C1E ■Typical Electrical/Optical/Characteristics Curves IF-V F Relative Intensity-IF ) A m ( If tn er ru C dr a w ro F ) r S / W m ( y t i s n e t n I e v i t a l e R F orw ard V oltage V f (V ) Forward DC Current (mA) Relative Intensity-Ta If_Ta ) r S / ) A m ( If tn er ru C dr a w ro F W m ( y ti s n te n I e iv t la e R Ambient Temperature Ta (°C) A m bient T em perature T a (°C ) Wavelength Characteristics Ta=25°C tysi ne tn Is uo ni m uL ev it al eR Wavelength (nm) LED & Application Technologies http://www.optosupply.com VER A.1.1 1.6x0.8 x0.6mm 940nm Infrared Chip SMD OSI50603C1E ■ Soldering Conditions Reflow Soldering Hand Soldering Pre-Heat 180 ~ 200°C Pre-Heat Time 120 sec. Max. Peak temperature 260°C Max. Dipping Time 10 sec. Max. Condition Temperature Soldering time 350°C Max. 3 sec. Max. (one time only) Refer to Temperature-profile • Reflow Soldering Condition(Lead-free Solder) 1~5°C / sec. 1~5°C / sec. Pre-heating 180~200 °C 260°C Max. 10sec.Max. 60 sec.Max. Above 220°C 120sec.Max. *Recommended soldering conditions vary according to the type of LED *Although the recommended soldering conditions are specified in the above table, reflow, or hand soldering at the lowest possible temperature is desirable for the LEDs. *A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. •All SMD LED products are pb-free soldering available. • Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. • Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. • Reflow soldering should not be done more than two times. • When soldering, do not put stress on the LEDs during heating. • After soldering, do not warp the circuit board. LED & Application Technologies http://www.optosupply.com VER A.1.1 1.6x0.8 x0.6mm 940nm Infrared Chip SMD OSI50603C1E TAPING ■ Reel Dimensions ■ Moisture Resistant Packaging Notes: 1. Unit: mm LED & Application Technologies http://www.optosupply.com VER A.1.1