OSY50402C1C

1.0 x 0.5 x 0.4mm Chip LED OSXX0402C1C Ver.a.6 ■Features ■Outline ● Single chip ● Super high brightness of surface mount LED ● Sorting for Iv and Vf @ 20mA of If ● Compact package outline Dimension Recommended Solder Pad Top (LxWxT) of 1.0mm x 0.5mm x 0.4mm ● Side Compatible to IR reflow soldering. Cathode Anode ■Applications ● Backlighting (switches, keys, etc.) ● Marker lights (e.g. steps, exit ways, etc.) ■Absolute Maximum Rating ■Directivity (Ta=25℃) Value Symbo Item Unit:mm Tolerance: 0.10mm Bottom R /YG/ O/Y B/PG/W DC Forward Current IF 20 20 mA Pulse Forward Current* IFP 100 100 mA Reverse Voltage VR 5 5 V Power Dissipation PD 52 72 mW Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40~ +85 Lead Soldering Temperature Tsol 0 Unit l ℃ ℃ ℃/10sec 260 0 - *Pulse width Max 0.1ms, Duty ratio max 1/10 ■Electrical -Optical Characteristics (Ta=25℃ (Ta=25℃) VF (V) Part Number Min. Color Typ. IR(µA) Max. IF=20mA OSM50402C1C Warm White M5 ■ Max. λD(nm) Iv(mcd) Min. Typ. Max. VR=5V Min. Typ. 2θ1/2(deg) Max. Typ. IF=20mA 2.8 3.2 3.6 100 250 400 600 2300-3500K 120 2.8 3.2 3.6 100 250 400 600 6500-9000K 120 OSWA0402C1C Pure White WA OSB50402C1C Blue B5 ■ 2.8 3.2 3.6 100 60 90 150 460 465 475 120 OSG50402C1C Pure Green G5 ■ 2.8 3.1 3.6 100 250 400 600 517 525 530 120 Yellow green G8 ■ 1.8 2.0 2.6 100 20 30 40 565 570 575 120 OSG80402C1C OSY50402C1C Yellow Y5 ■ 1.8 2.0 2.6 100 50 100 200 585 590 595 120 OSO50402C1C Orange O5 ■ 1.9 2.2 2.6 100 50 100 200 600 605 610 120 OSR50402C1C Red R5 ■ 1.8 2.0 2.6 100 50 100 200 620 625 630 120 *1 Tolerance of measurements of chromaticity coordinate is +10% *2 Tolerance of measurements of dominant wavelength is +1nm *3 Tolerance of measurements of luminous intensity is +15% *4 Tolerance of measurements of forward voltage is±0.1V LED & Application Technologies http://www.optosupply.com VER A.6 1.0 x 0.5 x 0.4mm Chip LED OSXX0402C1C Ver.a.6 ■ Optical and electrical characteristics TYPICAL ELECTRICAL/OPTICAL CHARACTERISTIC CURVES Relative luminous intensity - If IF-V F YG YL 60 ) A m ( 50 fI tn40 er ru C30 dr a 20 w ro F10 BL WT TG O R /H R 0 0.5 1.5 1.0 2.0 2.5 4.0 3.5 3.0 Forw ard V oltage V f (V ) yti sn et nI su on i m uL ev tia le R 7 6 ) A m 5 @ de zil a rm o N ( YG YL BL 5 4 WT 3 2 OR/HR TG 1 0 0 10 20 30 40 50 60 Forward current IF(mA) If_Ta WT 50 ) 40 A m ( fI 30 tn er ru 20 C dr a 10 w ro F 0 -30 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) Wavelength Characteristics Ta=25°C OR HR BL TG YG YL 100 yit 80 sn et nI 60 su on i 40 m uL ev 20 it al eR 0 400 450 500 550 600 Wavelength (nm) 650 700 LED & Application Technologies http://www.optosupply.com VER A.6 1.0 x 0.5 x 0.4mm Chip LED OSXX0402C1C Ver.a.6 RELIABILITY TEST REPORT CLASSIFICATION TEST ITEM TEST CONDTION ROOM TEMPERATURE If: 20mA OPERATION LIFE Ta:25 ±5 ℃ TEST TIME=1000HRS ENDURANCE HIGH R.H:90~95% TEMPERTURE Ta:65+5℃ HIGH HUMIDITY TEST TIME=240HRS(+2HRS) TEST STORAGE HIGH Ta:85℃ TEMPERTURE TEST TIME=500HRS(-24HRS,+48HRS) STORAGE LOW Ta:-40℃ TEMPERTURE TEST TIME=500HRS(-24HRS,+48HRS) STORAGE TEMPERTURE -40℃~25℃~85℃~25℃ CYCLING 30min 5min 30min 5min 100cycles TO Ta:260+5℃ RESISTANCE ENVIRONMENTAL TEST SOLDERING HEAT TEST TIME=10+1sec Ta:245+5℃ SOLDERABILITY TEST TIME=5+1sec JUDGMENT CRITERIA OF FAILURE FOR THE RELIABILITY MEASURING ITME LUMINOUS INTENSITY FORWARD VOLTAGE REVERSE CURRENT SYMBOL IV VF IR CONDITIONS IF=20mA IF=20mA Vr=5V SOLDERABILITY - - U.S.L ：Upper Specification Limit L.S.L FAILURE CRITERIA IV1.2*U.S.L IR>2*U.S.L LESS THAN 95% SOLDER COVERAGE ： Lower Specification Limit LED & Application Technologies http://www.optosupply.com VER A.6 1.0 x 0.5 x 0.4mm Chip LED OSXX0402C1C Ver.a.6 ■ Soldering Conditions Reflow Soldering Hand Soldering Pre-Heat 180 ~ 200°C Pre-Heat Time 120 sec. Max. Peak temperature 260°C Max. Dipping Time 10 sec. Max. Condition Temperature Soldering time 350°C Max. 3 sec. Max. (one time only) Refer to Temperature-profile • Reflow Soldering Condition(Lead-free Solder) 1~5°C / sec. 1~5°C / sec. Pre-heating 180~200 °C 260°C Max. 10sec.Max. 60 sec.Max. Above 220°C 120sec.Max. *Recommended soldering conditions vary according to the type of LED *Although the recommended soldering conditions are specified in the above table, reflow, or hand soldering at the lowest possible temperature is desirable for the LEDs. *A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. •All SMD LED products are pb-free soldering available. • Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. • Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. • Reflow soldering should not be done more than two times. • When soldering, do not put stress on the LEDs during heating. • After soldering, do not warp the circuit board. LED & Application Technologies http://www.optosupply.com VER A.6 1.0 x 0.5 x 0.4mm Chip LED OSXX0402C1C Ver.a.6 ■ Taping and Orientation. 1. Quantity:3000pcs 2. Diameter: 178 mm 3. General Tolerance : ± 0.1 60 φ φ13.0 ■ Cautions: 1. After open the package, the LED should be kept at 30°C, 30%RH or less. The LED should be soldered within 24 hours (1 day) after opening the package. 2. Heat generation must be taken into design consideration when using the LED. 3. Power must be applied resistors for protection, over current would be caused the optic damage to the devices and wavelength shift. 4. Manual tip solder may cause the damage to Chip devices, so advised that heat of iron should be lower than 15W with temperature control under 5 seconds at 230-260 deg. C. ( The device would be got damage in re working process, recommended under 5 seconds at 230-260 deg. C) 5. All equipment and machinery must be properly grounded. It is recommended to use a wristband or anti-electrostatic glove when handing the LED. 6. Use IPA as a solvent for cleaning the LED. The other solvent may dissolve the LED package and the epoxy, Ultrasonic cleaning should not be done. 7. Damaged LED will show unusual characteristics such as leak current remarkably increase, turn-on voltage becomes lower and the LED get unlight at low current. LED & Application Technologies http://www.optosupply.com VER A.6