CM03X6S105M10AH

Page1/16 To : Mouser Specification number:EQM08-1KC-E205K25 Date of issue: May 21, 2020 Multilayer ceramic Chip capacitor specification Product Part No CM03, CM05, CM105, CM21 (Refer to Part No.) (Recipient stamp column) Please send back with recipient stamp or signature here. This specification would be invalidated unlesse sent back within a year after issue date of this specification. RoHSCompliant Kyocera Corporation Capacitor Division Page2/16 No. 1 Date 2020/05/21 Contents NEW PREPD. CHKD. CHKD. APPD. Page3/16 [Part No] Characteristic K/C Supplier Part No X5R CM03X5R475M06AH055 X6S CM03X6S105M10AH X6S CM03X6S105M06AH039 X6S CM03X6S105M04AH039 X5R CM05X5R226M06AH080 X6S CM05X6S226M04AH080 X7S CM05X7S105M04AH-HE X6T CM105X6T475M16AT X6S CM105X6S106M10AT X6T CM105X6T226M04AT X6S CM21X6S226M10AT Remarks Page4/16 1.Scope This specification sheet shall be applied to multilayer ceramic chip capacitors;Kyocera CM series. 2.Nomenclature CM Series  (1) (1) (2) (3) (4) (5) (6) (7) (8) : : : : : : : :  (2)  (3)  (4) A (6)  (5)  (7)  (8) Size Temperature Characteristics Capacitance Tolerance Rated Voltage External Electrode Packaging Option (Thickness or Kyocera’s Control Code) (1)External Dimensions(Size) External Dimension for Taping or Bulk P T L W (unit:mm) Type L W T P 03 0.60±0.09 0.60±0.09 0.30±0.09 0.30±0.09 0.30±0.09 0.50±0.05 0.13~0.23 0.13~0.23 1.00±0.05 1.00±0.20 1.60±0.20 0.50±0.05 0.50±0.20 0.80±0.20 0.50±0.05 0.80MAX. 0.80±0.20 0.15~0.35 0.15~0.35 0.20~0.60 1.60±0.25 2.00±0.20 0.80±0.25 1.25±0.20 0.80±0.25 1.25±0.20 0.20~0.60 0.20~0.75 05 105 21 (2)Temperature Characteristics Change in capacitance Operating temperature range Reference Characteristics Applied voltage X5R No applied voltage Within +/-15% -55°C~+85°C 25°C X6S X6T X7S No applied voltage No applied voltage No applied voltage Within +/-22% Within +22% / -33% Within +/-22% -55°C~+105°C -55°C~+105°C -55°C~+125°C 25°C 25°C 25°C Page5/16 (3)Capacitance Value Capacitance is indicated by three numbers and a letter (see example as follows). The first and second digits indicate the first two significant figures,and the final digit is a base 10 logarithmic multiplier in picofarads. (Ex.) Code Capacitance 105 106 1,000,000pF 10,000,000pF (4)Tolerance Code Tolerance M ±20% (5)Rated Voltage Code Voltage 04 4Vdc 06 6.3Vdc 10 10Vdc 16 16Vdc (6)Termination (External Electrode) A: Nickel Barrier / Tin (7)Packaging Configuration Code H T Packaging Configuration Taping(2mm Pitch. Φ180 Reel) Taping(4mm Pitch. Φ180 Reel) Applying Size Refer to Taping specification (CM03, CM05 size) Refer to Taping specification (8)Option 039 055 080 -HE : 0.30±0.09mm *Apply to CM03X6S105M06AH039 and CM03X6S105M04AH039. : 0.50±0.05mm *Apply to CM03X5R475M06AH055. : 0.80mm MAX. *Apply to CM05X5R226M06AH080 and CM05X6S226M04AH080. : Kyocera’s Control Code *Apply to CM05X7S105M04AH-HE. 3.Operating temperature range Refer to Item 2-(2) Page6/16 4.Specifications and Test Methods (Table 1-1) Capacitance Specification X5R, X6S, X6T, X7S Within specified tolerance value tanδ Refer to (Table 3) Item Measuring Conditions High Temperature Treatment (Table 2) C≤10μF Measuring frequency 1kHz±10% Measuring voltage Refer to (Table 3) C>10μF Measuring frequency 120Hz±10% Measuring voltage Refer to (Table 3) (*1)Insulation Resistance Refer to (Table 3) Measure after charging with the rated voltage within 1 minutes at room conditions. (*1)Dielectric Strength No problem observed Applying 2.5 times of the rated voltage for 1 to 5 seconds. Appearance End Termination adherence No serious defect No evidence of peeling on the end termination Under Microscope After soldering chip capacitors on glass epoxy boards and applying *5N(0.5Kgf) as shown by the arrow mark in the sketch peeling or any sign of peeling should not be found on end terminations. *2N:CM03 size (Refer to Fig.1) Appearance No serious defect Perform High Temperature Treatment (Table 2) , then measure the initial capacitance and tanδ. Capacitance Variation Within specified tolerance value tanδ Satisfies initial specified value Vibration frequency:10 to 55 (Hz) Swing width :1.5mm Sweep :105510 Hz/1min x,y,z axis 2 hours/each Total 6 hours Resistance to Vibration (Refer to Fig.2) Resistance to Solder Leaching Solderability Appearance No serious defect Capacitance Variation tanδ Within ±7.5% (*1)Insulation Resistance (*1)Dielectric Strength Within specified tolerance value Satisfies initial specified value Resist without problem. Coverage >= 90% Each termination end Perform High Temperature Treatment (Table 2) , then measure the initial capacitance and tanδ. After dipped molten solder, at 260±5°C for 10±0.5 seconds and kept at room conditions for 24±2 hours, measure and check the specifications. *Pre-heat before immersion 1st: 80°C to 100°C for 120sec. 2st:150°C to 200°C for 120sec. Soaking Condition 245±5°C 3±0.5sec. 235±5°C 2±0.5sec. Page7/16 (Table 1-2) Item Temperature Cycling Load Humidity Resistance High Temperature Life Test Appearance Specification X5R, X6S, X6T, X7S No serious defect Measuring Conditions Perform High Temperature Treatment (Table 2) , then measure the initial capacitance and tanδ. Capacitance Variation Refer to (Table 4) tanδ Satisfies initial specified value (*1)Insulation Resistance Refer to (Table 4) (*1)Dielectric Strength Resist without problem Appearance No serious defect Capacitance Variation Refer to (Table 4) tanδ Less than 2 times of the initial value (*1)Insulation Resistance Refer to (Table 4) After test , keep at 150+0/-10°C for 1 hour and then let sit for 24±2 hours at room temperature, then measure. Appearance No serious defect Perform High Temperature Treatment (Table 2) , then measure the initial capacitance and tanδ. Capacitance Variation Refer to (Table 4) tanδ Less than 2 times of the initial value (*1)Insulation Resistance Refer to (Table 4) Bending Strength No mechanical damage Room temperature (3 minutes) Lowest operating temperature (30 minutes) – Room temperature (3 minutes) – Highest operating temperature (30 minutes). After 5 cycles of the above, keep at 150+0/-10°C for 1 hour and then let sit for 24±2 hours at room temperature, then measure. (Refer to Fig.2) Perform High Temperature Treatment (Table 2) , then measure the initial capacitance and tanδ. Apply rated voltage for 500+12/-0 hours in pre-condition at 40±2°C, humidity 90% to 95%RH. Apply voltage (Magnification of Applied voltage × Rated voltage) for 1000+12/-0 hours in pre-condition at the highest temperature. * Magnification of Applied voltage: refer to (Table 4) After test , keep at 150+0/-10°C for 1 hour and then let sit for 24±2 hours at room temperature, then measure. Refer to Fig.3-1, Fig.3-2 The glass epoxy board is bent up 1mm in 10 sec. (*1) Insulation Resistance/Dielectric Strength;Charging or discharging current for these tests Is limited under 50mA. (Table 2) Initial Treatment High Temperature Treatment Keep chip capacitor at 150°C +0/-10°C for 1 hour,Then leave chip capacitor at room temperature and normal humidity for 24±2 hours. Page8/16 [Table3 Parts List] Product Part No CM03X5R475M06AH055 Dimension [mm] L W T 0.60±0.09 0.30±0.09 0.50±0.05 tanδ IR [%]max (initial) min 15.0% Capacitance / tanδ Measuring voltage 50 MΩ•μF 0.5±0.1Vrms CM03X6S105M10AH 0.60±0.09 0.30±0.09 0.30±0.09 20.0% 50 MΩ•μF 1.0±0.2Vrms CM03X6S105M06AH039 0.60±0.09 0.30±0.09 0.30±0.09 20.0% 50 MΩ•μF 1.0±0.2Vrms CM03X6S105M04AH039 0.60±0.09 0.30±0.09 0.30±0.09 20.0% 50 MΩ•μF 1.0±0.2Vrms CM05X5R226M06AH080 1.00±0.20 0.50±0.20 0.80MAX. 12.5% 50 MΩ•μF 0.5±0.1Vrms CM05X6S226M04AH080 1.00±0.20 0.50±0.20 0.80MAX. 12.5% 50 MΩ•μF 0.5±0.1Vrms CM05X7S105M04AH-HE 1.00±0.05 0.50±0.05 0.50±0.05 12.5% 50 MΩ•μF 1.0±0.2Vrms CM105X6T475M16AT CM105X6S106M10AT 1.60±0.20 0.80±0.20 0.80±0.20 12.5% 50 MΩ•μF 1.0±0.2Vrms 1.60±0.20 0.80±0.20 0.80±0.20 15.0% 50 MΩ•μF 1.0±0.2Vrms CM105X6T226M04AT 1.60±0.25 0.80±0.25 0.80±0.25 12.5% 50 MΩ•μF 0.5±0.1Vrms CM21X6S226M10AT 2.00±0.20 1.25±0.20 1.25±0.20 12.5% 50 MΩ•μF 0.5±0.1Vrms [Table4 test specifications] Product Part No Temperature Cycling Capacitance IR Variation (Minimum Load Humidity Resistance Capacitance IR High Temperature Life Test Capacitance Voltage IR Variation Bias [%] value) (Minimum Variation value) (Minimum value) CM03X5R475M06AH055 ±7.5% 50 MΩ•μF ±12.5% 10 MΩ•μF 100% ±12.5% 10 MΩ•μF CM03X6S105M10AH ±7.5% 50 MΩ•μF ±12.5% 10 MΩ•μF 100% ±12.5% 10 MΩ•μF CM03X6S105M06AH039 ±7.5% 50 MΩ•μF ±12.5% 10 MΩ•μF 100% ±12.5% 10 MΩ•μF CM03X6S105M04AH039 ±7.5% 50 MΩ•μF ±12.5% 10 MΩ•μF 100% ±12.5% 10 MΩ•μF CM05X5R226M06AH080 ±7.5% 20 MΩ•μF ±12.5% 5 MΩ•μF 100% ±12.5% 5 MΩ•μF CM05X6S226M04AH080 ±7.5% 20 MΩ•μF ±12.5% 5 MΩ•μF 100% ±12.5% 5 MΩ•μF CM05X7S105M04AH-HE ±7.5% 50 MΩ•μF ±12.5% 10 MΩ•μF 150% ±12.5% 10 MΩ•μF CM105X6T475M16AT CM105X6S106M10AT ±7.5% 50 MΩ•μF ±12.5% 10 MΩ•μF 100% ±12.5% 10 MΩ•μF ±7.5% 50 MΩ•μF ±12.5% 10 MΩ•μF 150% ±12.5% 10 MΩ•μF CM105X6T226M04AT ±7.5% 20 MΩ•μF ±12.5% 10 MΩ•μF 100% ±12.5% 10 MΩ•μF CM21X6S226M10AT ±7.5% 50 MΩ•μF ±12.5% 10 MΩ•μF 100% ±12.5% 10 MΩ•μF Page9/16 type a a b 03 0.26 0.92 05 0.4 1.4 105 1.0 3.0 21 1.2 4.0 glass epoxy board b c 0.32 0.5 1.2 1.65 c Fig.1 Substrate for adhesion strength test c a b Fig.2 Substrate for temperature cycle test a 1±0.1 c Bend depth R=5.0 40 1.0 Pressure 1.6 (*) b Soldering 90 100 (Unit:mm) * 0.8 : CM03,CM05 size Fig.3-1 Substrate for bending test Fig.3-2 Testing status Page10/16 [Structure] Internal Electrodes •High Dielectric Constant Type： Ni •High Dielectric Constant Type： Cu or CuNi Ni Sn [Production facility] Kagoshima Kokubu plant Page11/16 ■For lead-free soldering Recommended temperature profile •Reflow porfile Temp.(°C) Peak temperature 250±10°C 5 to 10 sec max. Preheat 300 250 200 1 to 3°C/sec 150 170 to 180°C Cool at nomal room temperature ΔT 100 220°C max. 90sec. max. 50 0 0 (1) (2) (3) (4) 50 100 sec 90±30 150 200 250 Minimize soldering time Ensure that the temperature difference does not exceed 150 °C. MLCC can withstand the above reflow conditions up to 3 times. Cool naturally after soldering. •Flow profile Temp.(°C) Preheat 300 Peak Temperature 245 to 260 °C 250 ΔT 200 150 Cool at normal room temperature 100 50 0 0 (1) (2) (3) (4) 20 40 60 to 12060sec. 80 100 120 5 sec. max 140 160 Ensure that the chip capacitor is preheated adequately. Ensure that the temperature difference between a capacitor and the solder bath shall not exceed 150 °C. Cool naturally after soldering. Flow is not applicable for chips with size CM03, CM05. Page12/16 Taping Specification 1.Application This specification applies to paper carrier tape of Kyocera multi-layer ceramic chip capacitor. 2.Packing unit material of carrier tape thickness (unit:mm) type 03 paper 0.30±0.09 0.50±0.05 0.50±0.05 0.80 MAX. 0.80±0.20 0.80±0.25 1.25±0.20 05 105 21 width of carrier tape Plastic -       -  8mm 12mm -        Φ180 reel quantity per reel 15000 10000 10000 10000 4000 4000 3000 3.Shape and dimentions (1)Reel W2 [Dimension] Φ180 reel 2.0±0.5 (Code:H,T) C 21±0.8 1.0 B Φ180 reel (Code:H,T) W1 A A B Φ180+0/-2.0 Φ60min W1 W2 10.0±1.5 16.5max Unit:mm C Φ13.0±0.5 Page13/16 (2)-1 Carrier Tape G H E J D A C B 0.8MAX: CM03size F 1.0MAX: CM05size 1.2MAX: CM105size Code Tolerance Type 03 Thickness: 0.30±0.09mm Thickness: 0.50±0.05mm 05 Thickness: 0.50±0.05mm Thickness: 0.80mm MAX. 105 Thickness: 0.80±0.20mm Thickness: 0.80±0.25mm A (*1)±0.03 (*2)±0.1 (*3)±0.2 B (*1)±0.03 (*2)±0.1 (*3)±0.2 0.42 (unit:mm) C D E F G H J ±0.3 ±0.05 ±0.1 ±0.1 ±0.05 ±0.1 +0.1/-0 0.72 8.0 3.5 1.75 2.0 - 4.0 φ1.5 0.44 0.74 8.0 3.5 1.75 2.0 - 4.0 φ1.5 0.65 1.15 8.0 3.5 1.75 2.0 - 4.0 φ1.5 0.90 1.40 8.0 3.5 1.75 2.0 - 4.0 φ1.5 1.1 1.9 8.0 3.5 1.75 4.0 2.0 4.0 φ1.5 1.2 2.0 8.0 3.5 1.75 4.0 2.0 4.0 φ1.5 (*1)Apply to CM03 size (except for CM03X5R475M06AH055). (*2)Apply to CM03X5R475M06AH055 and CM05 size. (*3)Apply to CM105 size. Page14/16 (2)-2 Carrier Tape A G H 0.6max E J D C Φ0.3min B 2.8max F Code Tolerance Type 21 (unit:mm) J A B C D E F G H ±0.2 ±0.2 ±0.3 ±0.05 ±0.1 ±0.1 ±0.05 ±0.1 +0.1/-0 1.5 2.3 8.0 3.5 1.75 4.0 2.0 4.0 φ1.5 Page15/16 4.Packing method (1)Details of leader and trailer The tape will have a empty pocket at the leader and trailer of carrier tape. The tape end will not be stucked by glue in order to make it easier to peel off from reel. The feeding round hole will be on the right side against t leading direction. Components Trailer Leader End 160mm min Direction of unreeling 100mm min 400mm min (2)Heat pressure tape Peeling strength to be *0.1~0.7N when peeling off the top tape by following method. When peeling top tape off, the glue will be stuck to the top tape side. Chip capacitor will not stuck on heat pressure tape and will be free in the cavity. Top tape Peeling direction 165 to 180 degrees The peel-off angle:165~180 degree against the surface of carrier tape. The peel-off speed:300mm/min. Carrier tape Direction of unreeling (3)Carrier tape Chip will not fall off from carrier tape or carrier tape will not be damaged by bending than within aradius of 25mm. The chip are inserted continuously without any empty pocket. Chip will not be mis-mounted because of too big clearance between components and cavity. Also the waste of carrier tape will not fill a nozzle hole of mouting machine. 5.Indication and packing There will be following indication on one side of the reel: “PART NUMBER”,”LOT NUMBER”, “QUANTITY”,”DATE OF MANUFACTURE”,”CUSTOMER’S NAME” There will be following indication on the reel box: “PART NUMBER”,”LOT NUMBER”, ”QUANTITY OF REEL”,”DATE OF MANUFACTURE”,”CUSTOMER’S NAME” We adequately pack the box to prevent chip capacitor from any mechanical damage during transportation. Page16/16 Precautions ■ Handling 1) Cracks may occur unless otherwise avoiding excessive stress to the capacitors by the load of an adsorption nozzle,and bending of a substrate at the time of mounting. 2) Please arrange the capacitor position where they don’t have too much stress of board bending after mounting. 3) Please design that the form and size of the land pattern has suitable solder amount. Otherwise cracks may occur. The recommended fillet height shall be 1/2 to 1/3 of the thickness of capacitors. ■ Circuit Design 1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated voltage. When the capacitor is to be employed in a circuit in which there is continuous application of a high frequency Voltage or a steep pulse voltage, even though it is within the rated voltage, please inquire to the manufacturer. 2) Please use the capacitor below the maximum temperature. When using the capacitor in a self-heating AC circuit, please make sure the surface of the capacitor remains under the maximum temperature for usage. Also, please make certain temperature rises remain below 20 °C. ■ Resin coating Please use the resin of low curing shrinkage type. (Otherwise cracks may occur). ■ Storage 1) When the components is stored in minimal packaging (a heat-sealed or chuck-type plastic bag), the bag should be kept closed. Once the bag has been opened, reseal it or store it in a desiccator. 2) Keep storage place temperature +5 to +40 °C, humidity 20 to 70% RH. 3) The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product is exposed to such atmospheres, the terminals will oxidize and solderability will be effected. 4) Precautions 1) to 3) apply to chip capacitors packaged in carrier tapes and bulk cases. 5) The solderability is assured for 6 months from our shipping date if the above storage precautions are followed. ■ Application Restriction Please consult with us before using a capacitor in the equipment which requires a high degree reliability (medical equipment, aerospace applications, nuclear equipment.) Malfunctions in medical, space, nuclear power or other vital equipment may result in death or great social losses. Capacitors designed specially with high reliability are used for the equipment above. ■ Export regulation When the applying products relate the strategic materials which are provided in Foreign Exchange and Foreign Trade Act and Foreign Trade Management Law, the export license based on these laws are required. ■ Disposal Please dispose the capacitors according to the relating laws about the waste treatment and cleaning. Safety application guideline and detailed information of electrical properties are also provided in Kyocera home page: URL: http://www.kyocera.co.jp/electronic Notice: This specification shall guarantee only monolithic capacitors. Please make sure the performance of capacitors after mounted on the assembled product. Any failures occurred being used out of this specification shall not be quaranteed. This specification shall be applied to the products purchased through the regular sales routes, such as the sale offices, the subsidiaries and the distributors, etc.).