CT05X5R106M06AH055

page1`12 sDeofca刂 on numberEQMO⒏ 1KCˉ E1BXK96 Date of issue∶ MultiIayer ceran1ic Chip capacitor specification Produd PaR No CTO5X5R106MO6AH055 (Re。 pient stamp cdumnl here. PIease send back This speCiflcation wouId be inva"dated unIesse sent back 岫thin a year after lssue date of this speCifcation ■ 口 ;蛳 碣 孛ilξ 宝 蝥 愚 l琶]爿 ,aFE Kyocera Corporauon Capackor Division 四 lg- 瑟 17 0dober, 2018 Page2/12 No. 1 Date 2018/10/17 Contents NEW PREPD. CHKD. CHKD. APPD. Page3/12 [Part No] Characteristic X5R K/C Supplier Part No CT05X5R106M06AH055 Remarks Page4/12 1.Scope This specification sheet shall be applied to multilayer ceramic chip capacitors;Kyocera CT series. 2.Nomenclature CT Series  (1) (1) (2) (3) (4) (5) (6) (7) (8) : : : : : : : :  (2)  (3)  (4) A (6)  (5)  (7)  (8) Size Temperature Characteristics Capacitance Tolerance Rated Voltage External Electrode Packaging Thickness (1)External Dimensions(Size) P External Dimension for Taping or Bulk (unit:mm) Type L W T P 05 1.00±0.20 0.50±0.20 0.55 max 0.15~0.35 T L W (2)Temperature Characteristics Characteristics Applied voltage X5R No applied voltage Change in capacitance Within +/-15% Operating temperature range -55°C~+85°C Reference 25°C Page5/12 (3)Capacitance Value Capacitance is indicated by three numbers and a letter (see example as follows). The first and second digits indicate the first two significant figures,and the final digit is a base 10 logarithmic multiplier in picofarads. (Ex.) Code Capacitance 106 10,000,000pF (4)Tolerance Code Tolerance M ±20% (5)Rated Voltage Code Voltage 06 6.3Vdc (6)Termination (External Electrode) A: Nickel Barrier/ Tin (7)Packaging Configuration Code H Packaging Configuration Taping(2mm Pitch. Φ180 Reel) (8)Thickness 055 : 0.55mm max. 3.Operating temperature range Refer to Item 2-(2) Applying Size Refer to Taping specification Page6/12 4.Specifications and Test Methods (Table 1-1) Capacitance Specification X5R Within specified tolerance value tanδ Refer to (Table 3) (*1)Insulation Resistance Refer to (Table 3) Measure after charging with the rated voltage within 1 minutes at room conditions. (*1)Dielectric Strength No problem observed Applying 2.5 times of the rated voltage for 1 to 5 seconds. Appearance Resistance to Vibration No serious defect No serious defect Under Microscope Perform High Temperature Treatment (Table 2) , then measure the initial capacitance and tanδ. Capacitance Variation Within specified tolerance value tanδ Satisfies initial specified value Vibration frequency:10 to 55 (Hz) Swing width :1.5mm Sweep :105510 Hz/1min x,y,z axis 2 hours/each Total 6 hours Item Appearance Measuring Conditions High Temperature Treatment (Table 2) C≤10μF Measuring frequency 1kHz±10% Measuring voltage Refer to (Table 3) (Refer to Fig.1) Resistance to Solder Leaching Appearance No serious defect Capacitance Variation tanδ Within ±7.5% (*1)Insulation Resistance (*1)Dielectric Strength Solderability Satisfies initial specified value Within specified tolerance value Resist without problem. Coverage >= 90% Each termination end Perform High Temperature Treatment (Table 2) , then measure the initial capacitance and tanδ. After dipped molten solder, at 260±5°C for 10±0.5 seconds and kept at room conditions for 24±2 hours, measure and check the specifications. *Pre-heat before immersion 1st: 80°C to 100°C for 120sec. 2st:150°C to 200°C for 120sec. Soaking Condition 245±5°C 3±0.5sec. 235±5°C 2±0.5sec. Page7/12 (Table 1-2) Item Temperature Cycling Load Humidity Resistance High Temperature Life Test Appearance Specification X5R No serious defect Capacitance Variation Refer to (Table 4) tanδ Satisfies initial specified value (*1)Insulation Resistance Refer to (Table 4) (*1)Dielectric Strength Resist without problem Appearance No serious defect Capacitance Variation Refer to (Table 4) tanδ Less than 2 times of the initial value (*1)Insulation Resistance Refer to (Table 4) Appearance No serious defect Capacitance Variation Refer to (Table 4) tanδ Less than 2 times of the initial value (*1)Insulation Resistance Refer to (Table 4) Measuring Conditions Perform High Temperature Treatment (Table 2) , then measure the initial capacitance and tanδ. Room temperature (3 minutes) Lowest operating temperature (30 minutes) – Room temperature (3 minutes) – Highest operating temperature (30 minutes). After 5 cycles of the above, keep at 150+0/-10°C for 1 hour and then let sit for 24±2 hours at room temperature, then measure. (Refer to Fig.2) Perform High Temperature Treatment (Table 2) , then measure the initial capacitance and tanδ. Apply rated voltage for 500+12/-0 hours in pre-condition at 40±2°C, humidity 90% to 95%RH. After test , keep at 150+0/-10°C for 1 hour and then let sit for 24±2 hours at room temperature, then measure. Perform High Temperature Treatment (Table 2) , then measure the initial capacitance and tanδ. Apply voltage (Magnification of Applied voltage × Rated voltage) for 1000+12/-0 hours in pre-condition at the highest temperature. * Magnification of Applied voltage: refer to (Table 4) After test , keep at 150+0/-10°C for 1 hour and then let sit for 24±2 hours at room temperature, then measure. (*1) Insulation Resistance/Dielectric Strength;Charging or discharging current for these tests Is limited under 50mA. (Table 2) Initial Treatment High Temperature Treatment Keep chip capacitor at 150°C +0/-10°C for 1 hour,Then leave chip capacitor at room temperature and normal humidity for 24±2 hours. Page8/12 [Table3 Parts List] Product Part No Dimension [mm] CT05X5R106M06AH055 tanδ IR Capacitance/ tanδ [%]max (initial) min Measuring voltage L W T 1.00±0.20 0.50±0.20 0.55 max. 15.0% 50 MΩ•μF 0.5±0.1Vrms [Table4 test specifications] Product Part No Temperature Cycling Capacitance IR Variation (Minimum Load Humidity Resistance Capacitance IR High Temperature Life Test Capacitance Voltage IR Variation Bias [%] (Minimum CT05X5R106M06AH055 ±15.0% Variation (Minimum value) value) value) 50 MΩ•μF ±12.5% 5 MΩ•μF 100% ±12.5% 5 MΩ•μF c type a b 05 0.4 1.4 glass epoxy board c 0.5 a b Fig.1 Substrate for temperature cycle test [Structure] Internal Electrodes •High Dielectric Constant Type： Ni •High Dielectric Constant Type： Cu or CuNi Ni Sn [Production facility] Kagoshima Kokubu plant Page9/12 ■For lead-free soldering Recommended temperature profile •Reflow porfile Temp.(°C) Peak temperature 250±5°C 5 to 10 sec max. Preheat 300 250 200 170 to 190°C 1 to 3°C/sec 150 Cool at nomal room temperature ΔT 100 220°C max. 90sec. max. 50 0 0 (1) (2) (3) (4) 50 100 sec 90±30 150 200 250 Minimize soldering time Ensure that the temperature difference does not exceed 150 °C. MLCC can withstand the above reflow conditions up to 3 times. Cool naturally after soldering. •Flow profile Flow is not applicable for chips with size CT05. •Soldering iron profile Preheat Temp.(°C) 400 Peak Temperature 350 °C max. 350 300 ΔT 250 200 Cool at normal room temperature 150 100 50 0 0 (1) (2) (3) (4) (5) (6) 20 40 60 60 to 120 sec 80 100 120 3 sec. max. 140 160 Ensure that the chip capacitor is preheated adequately. Ensure that the temperature difference between a capacitor and the soldering iron shall not exceed 150 °C. Cool naturally after soldering. Avoid direct touching to capacitors. Tip shape of soldering iron is dia.3.0mm max. Wattage 80W max. Page10/12 Taping Specification 1.Application This specification applies to paper carrier tape of Kyocera multi-layer ceramic chip capacitor. 2.Packing unit material of carrier tape thickness (unit:mm) type 05 paper 0.55 max Plastic -  Φ180 reel quantity per reel width of carrier tape 8mm 12mm -  10000 3.Shape and dimentions (1)Reel [Dimension] W2 Φ180 reel 2.0±0.5 (Code:H) C 21±0.8 Φ180 reel B (Code:H) 1.0 Unit:mm C A B Φ180+0/-2.0 Φ60min W1 W2 10.0±1.5 16.5max Φ13.0±0.5 W1 A (2)Carrier Tape (Unit:mm) H A E J C D B F 0.8MAX (unit:mm) Code Tolerance Type 05 A B C D E F H J ±0.1 ±0.1 ±0.3 ±0.05 ±0.1 ±0.05 ±0.1 +0.1/-0 0.80 1.30 8.0 3.5 1.75 2.0 4.0 φ1.5 Page11/12 4.Packing method (1)Details of leader and trailer The tape will have a empty pocket at the leader and trailer of carrier tape. The tape end will not be stucked by glue in order to make it easier to peel off from reel. The feeding round hole will be on the right side against t leading direction. Trailer Components Leader End 160mm min Direction of unreeling 100mm min 400mm min (2)Heat pressure tape Peeling strength to be 0.1~0.7N when peeling off the top tape by following method. When peeling top tape off, the glue will be stuck to the top tape side. Chip capacitor will not stuck on heat pressure tape and will be free in the cavity. Top tape Peeling direction 165 to 180 degrees Carrier tape The peel-off angle:165~180 degree against the surface of carrier tape. The peel-off speed:300mm/min. Direction of unreeling (3)Carrier tape Chip will not fall off from carrier tape or carrier tape will not be damaged by bending than within aradius of 25mm. The chip are inserted continuously without any empty pocket. Chip will not be mis-mounted because of too big clearance between components and cavity. Also the waste of carrier tape will not fill a nozzle hole of mouting machine. 5.Indication and packing There will be following indication on one side of the reel: “PART NUMBER”,”LOT NUMBER”, “QUANTITY”,”DATE OF MANUFACTURE”,”CUSTOMER’S NAME” There will be following indication on the reel box: “PART NUMBER”,”LOT NUMBER”, ”QUANTITY OF REEL”,”DATE OF MANUFACTURE”,”CUSTOMER’S NAME” We adequately pack the box to prevent chip capacitor from any mechanical damage during transportation. Page12/12 Precautions ■ Handling 1) Cracks may occur unless otherwise avoiding excessive stress to the capacitors by the load of an adsorption nozzle,and bending of a substrate at the time of mounting. 2) Please arrange the capacitor position where they don’t have too much stress of board bending after mounting. 3) Please design that the form and size of the land pattern has suitable solder amount. Otherwise cracks may occur. The recommended fillet height shall be 1/2 to 1/3 of the thickness of capacitors. ■ Circuit Design 1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated voltage. When the capacitor is to be employed in a circuit in which there is continuous application of a high frequency Voltage or a steep pulse voltage, even though it is within the rated voltage, please inquire to the manufacturer. 2) Please use the capacitor below the maximum temperature. When using the capacitor in a self-heating AC circuit, please make sure the surface of the capacitor remains under the maximum temperature for usage. Also, please make certain temperature rises remain below 20 °C. ■ Resin coating Please use the resin of low curing shrinkage type. (Otherwise cracks may occur). ■ Storage 1) When the components is stored in minimal packaging (a heat-sealed or chuck-type plastic bag), the bag should be kept closed. Once the bag has been opened, reseal it or store it in a desiccator. 2) Keep storage place temperature +5 to +40 °C, humidity 20 to 70% RH. 3) The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product is exposed to such atmospheres, the terminals will oxidize and solderability will be effected. 4) Precautions 1) to 3) apply to chip capacitors packaged in carrier tapes and bulk cases. 5) The solderability is assured for 6 months from our shipping date if the above storage precautions are followed. ■ Application Restriction Please consult with us before using a capacitor in the equipment which requires a high degree reliability (medical equipment, aerospace applications, nuclear equipment.) Malfunctions in medical, space, nuclear power or other vital equipment may result in death or great social losses. Capacitors designed specially with high reliability are used for the equipment above. ■ Export regulation When the applying products relate the strategic materials which are provided in Foreign Exchange and Foreign Trade Act and Foreign Trade Management Law, the export license based on these laws are required. ■ Disposal Please dispose the capacitors according to the relating laws about the waste treatment and cleaning. Safety application guideline and detailed information of electrical properties are also provided in Kyocera home page: URL: http://www.kyocera.co.jp/electronic Notice: This specification shall guarantee only monolithic capacitors. Please make sure the performance of capacitors after mounted on the assembled product. Any failures occurred being used out of this specification shall not be quaranteed. This specification shall be applied to the products purchased through the regular sales routes, such as the sale offices, the subsidiaries and the distributors, etc.).