0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
CX3225CA12000P0HSTC1

CX3225CA12000P0HSTC1

  • 厂商:

    OPTREX(京瓷)

  • 封装:

    SMD3225_4P

  • 描述:

    无源晶振 18pF 12MHz 200Ω ±20ppm -40℃~+125℃ SMD-4

  • 数据手册
  • 价格&库存
CX3225CA12000P0HSTC1 数据手册
Specification Drawing No. UKY1C-H1-15429-00[43] 1/10 Issued Date. Apr.16,2015 TO: Digi-Key Note:In case of specification change, KYOCERA Part Number also will be changed. Product Name Quartz Crystal Product Model CX3225CA Frequency 12000kHz Customer Part Number - Customer Specification Number - KYOCERA Part Number CX3225CA12000P0HSTC1 Remarks RoHS Compliant、MSL 1 AEC-Q200 Compliant Customer Acceptance Accept Signature Approved Date Department Person in charge Seller KYOCERA Crystal Device Corporation Manufacturer (Sales Division) 6 Takeda Tobadono-cho, Fushimi-ku, Kyoto 612-8501 Japan TEL. No. 075-604-3500 FAX. No. 075-604-3501 Crystal Units Division 5850, Higashine-Koh, Higashine-Shi, Yamagata 999-3701 Japan TEL. No. 0237-43-5611 FAX. No. 0237-43-5615 Design Department Quality Assurance Approved by Checked by Issued by KYOCERA Crystal Device Corporation Field Application Engineering Section T. Noritake K. Yamazaki Crystal Units Division T. Nitoube Y. Kikuchi KYOCERA Crystal Device Corporation KBS-5079G Drawing No. UKY1C-H1-15429-00[43] 2/10 Revision History Rev.No. 1 Description of revise First Edition Date Approved by Checked by Issued by Apr.16,2015 K. Yamazaki T. Nitoube Y. Kikuchi KYOCERA Crystal Device Corporation KBS-5079G Drawing No. UKY1C-H1-15429-00[43] 3/10 1. APPLICATION This specification sheet is applied to quartz crystal “CX3225CA12000P0HSTC1” 2. KYOCERA PART NUMBER CX3225CA12000P0HSTC1 3. RATINGS Items SYMB. Rating Unit Operating Temperature Topr -40 to +125 °C Storage Temperature Range Tstg -40 to +150 °C Remarks 4. CHARACTERISTICS ELECTRICAL CHARACTERISTICS Items SYMB. Electrical Specification Min. Typ. Max. Fundamental Unit F0 12 MHz TNOM +25 °C CL 18.0 pF Mode of Vibration Nominal Frequency Nominal Temperature Load Capacitance Frequency Tolerance Frequency Temperature Characteristics Frequency Aging Rate Equivalent Series Resistance df/F -20.0 +20.0 df/F -100.0 +100.0 Test Condition Remarks +253°C -40 to +125°C PPM -5.0 ESR Drive Level Pd 0.01 Insulation Resistance IR 500 1st year +5.0 200 Ω 200 μW MΩ +253°C 100V(DC) KYOCERA Crystal Device Corporation KBS-5079G Drawing No. UKY1C-H1-15429-00[43] 4/10 5. Measurement Condition 5.1 Frequency measurement Measuring instrument : IEC PI-Network Test Fixture Load Capacitance : 18.0pF Drive Level : 10μW 5.2 Equivalent series resistance (ESR) measurement Measuring instrument : IEC PI-Network Test Fixture Load Capacitance : Series Drive Level : 10μW KYOCERA Crystal Device Corporation KBS-5079G Drawing No. UKY1C-H1-15429-00[43] 5/10 6. APPEARANCES, PHYSICAL DIMENSION OUTLINE DIMENSION (not to scale) ① (Top View) (Connection) 4-R0.20 3.20±0.1 Pin4 NC Pin4 HOT Pin3 Pin1 HOT Pin2 NC Pin3 2.50±0.1 12000 K501Y 0.2±0.05 ② ③ ④ (Side View) 0.8±0.1 Pin2 Pin1 4-0.2±0.1 (Bottom View) 4-1.00±0.1 Pin2 Pin1 C 0.30 Pin4 Pin3 4-0.75±0.1 8-0.10±0.1 PIN No. #1 #2 #3 #4 PIN Layout HOT NC HOT NC ※There is not consistency of a direction of indication for NC. UNIT: mm MARKING 1 Nominal Frequency 2 Identification 3 Date Code Move the number of maximum indication beams of the frequency to five digits,and omit less than kHz. Year…LAST 1 DIGIT of YEAR AND WEEK (Ex) Jan. 1, 2015 → 501 4 Manufacturing Location Y…Japan(Yamagata) T…Thailand ※The font of marking is reference. KYOCERA Crystal Device Corporation KBS-5079G Drawing No. UKY1C-H1-15429-00[43] 6/10 7. RECOMMENDED LAND PATTERN (not to scale) 1.0 1.3 1.05 0.8 1.05 1.3 UNIT: mm KYOCERA Crystal Device Corporation KBS-5079G Drawing No. UKY1C-H1-15429-00[43] 7/10 8.TAPING & REEL 8-1.Dimensions 4.0±0.1 φ1.55±0.05 Unreeling direction 1.75±0.1 2.0±0.05 (3.7) 3.5±0.1 3.5±0.05 (3.0) 2.8±0.1 4.0±0.1 1.0±0.1 0.25±0.05 8.0±0.2 φ1.05±0.15 8-2.Leader and trailer tape Components Empty compartment Empty compartment Leader END START 160mm or more 100mm or more 400~560mm 8-3.Direction(The direction shall be seen from the top cover tape side) Unreeling direction 8-4.Specification 1. Material of the carrier tape is either polystyrene or A-PET (ESD). 2. Material of the cover tape is polyester (ESD). 3. The seal tape shall not cover the sprocket holes and not protrude from the carrier tape. 4. Tensile strength of carrier tape: 10N or more. 5. The R of the corner of each cavity is 0.2RMAX. 6. The alignment between centers of the cavity and sprocket hole shall be 0.05mm or less. 7. Peeling force of cover tape: 0.1 to 1.0N. 8. The component will fall out naturally when cover tape is removed and set upside down. 165°~180° Cover tape Career tape KYOCERA Crystal Device Corporation KBS-5079G Drawing No. UKY1C-H1-15429-00[43] 8/10 8-5.Reel specifications W C t D E B A (Nonconductor type Reel) Φ180 Reel (3000pcs max.) Dimension Symbol Dimension A B C D φ180 +0/-1.5 φ60 +1/-0 φ13±0.2 φ21±0.8 E W t 2.0±0.5 9±1 2.0±0.5 (Unit : mm) KYOCERA Crystal Device Corporation KBS-5079G Drawing No. UKY1C-H1-15429-00[43] 9/10 9.Enviromental requirements (Reference: AEC-Q200 Rev. D. The solder used by examination is hereafter set to Sn-3Ag-0.5Cu.) After following test, Frequency applies to each item and CI, ±20% or 5Ω of large value. No 9.1 Stress High Temperature Exposure (Storage) Reference MIL-STD-202 Method 108 9.2 Temperature Cycling JESD22 Method JA-104 9.3 Biased Humidity MIL-STD- 202 Method 103 9.4 Operational Life MIL-STD- 202 Method 108 9.5 Terminal Strength (Leaded) 9.6 Resistance to Solvents 9.7 Mechanical Shock 9.8 Vibration MIL-STD- 202 Method 211 MIL-STD- 202 Method 215 MIL-STD-202 Method 213 MIL-STD-202 Method 204 9.9 Resistance to Soldering Heat MIL-STD-202 Method 210 9.10 Solder ability J-STD-002 9.11 9.12 9.13 Flammability Board Flex Terminal Strength(SMD) UL-94 AEC Q200-005 AEC Q200-006 Additional Requirements 1000 hrs. at rated operating temperature (e.g. 85°C part can be stored for 1000 hrs at 85°C. Same applies for 125°C). Unpowered. Measurement at 24±4 hours after test conclusion. 1000 cycles (-40°C to 125°C) Note: If 85°C part the 1000 cycles will be at that temperature rating. Measurement at 24±4 hours after test conclusion. 30min maximum dwell time at each temperature extreme. 1 min. maximum transition time. 1000 hours 85°C/85%RH. Rated VDD applied with 1 MW and inverter in parallel, 2X crystal CL capacitors between each crystal leg and GND. Measurement at 24±4 hours after test conclusion. Note: 1000 hrs @ 125°C. If 85°C part will be tested at that temperature. Rated VDD applied with 1 MW and inverter in parallel, 2X crystal CL capacitors between each crystal leg and GND. Measurement at 24±4 hours after test conclusion. Test leaded device lead integrity only. Conditions: A (227 g), C (227 g). Note: Also aqueous wash chemical - OKEM clean or equivalent. Do not use banned solvents. Figure 1 of Method 213. Condition C 5g's for 20 minutes 12 cycles each of 3 orientations. Note: Use 8"X5" PCB .031" thick with 7 secure points on one 8" side and 2 secure points on corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10-2000 Hz. Condition B No pre-heat of samples. Note: Single Wave solder - Procedure 1 with solder within 1.5 mm of device body for Leaded. Procedure 1 except 230°C and immerse only to level to cover terminals for SMD. For both Leaded & SMD. Electrical Test not required. Magnification 50 X. Conditions: Leaded: Method A @ 235°C, category 3. SMD: a) Method B, 4 hrs @ 155°C dry heat @ 235°C b) Method B @ 215°C category 3. c) Method D category 3 @ 260°C. V-0 or V-1 Acceptable 60 sec minimum holding time. - KYOCERA Crystal Device Corporation KBS-5079G Drawing No. UKY1C-H1-15429-00[43] 10/10 10. Cautions for use (1)Soldering upon mounting There is a possibility to influence product characteristics when Solder paste or conductive glue comes in contact with product lid or surface. (2)When using mounting machine Please minimize the shock when using mounting machine to avoid any excess stress to the product. (3)Conformity of a circuit We strongly recommend to make sure that Negative resistance (Gain) of IC is designed to be 10 times the ESR (Equivalent Series Resistance) of crystal unit. (4)After making the Quartz Crystal mount on a printed circuit board ,if it is required to divide the printed circuit board into another one, use it with attentive confirmation so that a warp cased by this dividing might not affect any damage. When designing a printed circuit board as well as handling the mounting As much as possible. The quartz crystal shall be passed through the reflow furnace. Then it shall be subjected to standard atmospheric conditions, after which cleaning shall be made. 11. Storage conditions Please store product in below conditions, and use within 6 months. Temperature +18 to +30°C, and Humidity of 20 to 70 % in the packaging condition. 12. Manufacturing location Kyocera Crystal Device Corporation Plant Kyocera Crystal Device (Thailand) Co., Ltd 13. Quality Assurance To be guaranteed by Kyocera Crystal Device Quality Assurance Division 14. Quality guarantee In case when Kyocera Crystal Device Corporation rooted failure occurred within 1year after its delivery, substitute product will be arranged based on discussion. Quality guarantee of product after 1year of its delivery is waivered. 15. Others In case of any questions or opinions regarding the Specification, please have it in written manner within 45 days after issued date. KYOCERA Crystal Device Corporation KBS-5079G
CX3225CA12000P0HSTC1 价格&库存

很抱歉,暂时无法提供与“CX3225CA12000P0HSTC1”相匹配的价格&库存,您可以联系我们找货

免费人工找货