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KNH21C104DA3TS

KNH21C104DA3TS

  • 厂商:

    OPTREX(京瓷)

  • 封装:

    0805

  • 描述:

    LC EMI 滤波器 订单 低通 通道 C = 0.1µF 2 A 0805(2012 公制)

  • 数据手册
  • 价格&库存
KNH21C104DA3TS 数据手册
PUBLICATION No. Reference Messrs. Digi-key EMI FILTER Specification Part No. :KNH21 Series RoHS Compliant 19.Aug., 2011 KYOCERA CORPORATION 1/9 Approved by Masanori Somazu Checked by Kazuaki Higashi Checked by Kazuki Shimizu Issued by Takafumi Nogi No.EE21-KHDC000-02 EMI FILTER SPECIFICATION 1. Apply This specification applies to Kyocera chip EMI filter KNH21 Series. 2. Nomenclature KNH 21 C104 DA 3T S Termination ( S : STD) Packaging (3T: 3,000pcs Tape & Reel ) Application (DA : Digital Circuit in General) Capacitance (C104 : 100nF) Size code (21 : 2.0*1.2 mm ) Series ( KNH : High current type ) 3. Performance / Requirement 3–1 Standard requirement A: Insulation resistance B: Operating temperature 3–2 Min. 500 (M ohm) -40 to 85 (deg.) Electrical characteristics Capacitance ( +50 / -20 % ) ( pF ) 220 470 47,000 100,000 1,000,000 4,700,000 10,000,000 Parts Number KNH21C221DA3TS KNH21C471DA3TS KNH21C473DA3TS KNH21C104DA3TS KNH21C105DA3TS KNH21C475DA3TS KNH21C106DA3TS 3–3 Rated current (A) 1.0 1.0 2.0 2.0 4.0 4.0 6.0 Rated voltage (V) 50 50 50 25 10 6.3 6.3 Direct - current resistance (Ohm) Max. 0.08 Max. 0.08 Max. 0.02 Max. 0.02 Max. 0.02 Max. 0.02 Max. 0.01 Frequency Characteristics 10 KNH21C221DA 0 Attenuation (dB) KNH21C471DA K NH21C473DA -10 KNH21C104DA -20 KNH21C105DA -30 KNH21C475DA -40 -50 -60 -70 -80 KNH21C106DA -90 1 10 100 Frequency (MHz) KYOCERA CORPORATION 1,000 10,000 2/9 No.EE21-KHDC000-02 4. Size and dimensions Unit : mm L W Symbol Dimensions L 2.00 + / - 0.20 W 1.25 + / - 0.20 T R 1 3 2 I/O GND I/O 0.85 + / - 0.15 *1 P 0.30 + / - 0.20 Q 0.40 + / - 0.20 R Min. 0.01 *1 KNH21C475DA: 1.0+- 0.15 *1 KNH21C106DA: 1.0+- 0.15 Inner electrode T Plating (Sn) : 1-10um P Q P Plating (Ni) : 1-10um Outer Electrode CERAMIC (Figure – 2) (Figure – 1) 5. Recommended land pattern Resist D Through hole to connect ground plane S W U Unit : mm R Symbol T W R C P Q S U D Q P C T Copper foil pattern Dimensions 3.20 1.00 2.30 1.20 0.80 0.40 0.60 2.00 0.3 to 0.4 ( Figure – 3 ) Copper foil pattern + Resist KYOCERA CORPORATION 3/9 No.EE21-KHDC000-02 6. Requirement and measurement method No Contents Requirement 1 Appearance No serious defect. Measurement method and conditions Microscope (10 magnifications). 2 Dimensions Figure – 1 Digital caliper and measurement microscope. 3 Capacitance 3 – 2 item Measured by HP4278A. Capaci -tance 22pF to 470pF 47nF to 10uF Measured voltage 1V+- 0.2V rms Measured by super meg ohmmeter model SM – 9E (made by TOA). 1-3 or 2-3 (at figure – 1) measured. To measure after charging with the rated voltage for 1 minute at room temperature and normal humidity. 4 Insulation resistance 3 – 1 item 5 Dielectric strength No problem observed. To charge between 1 ( or 3 ) and 2 (at figure – 1) with the 2.5 times high of the rated voltage for 1 to 5 seconds. No problem observed. Print rated current for 1 to 5 seconds between 1-2 (at figure – 1). Coverage Min. 90 % Each termination. Completely coat parts with flux and propanol solution and preheat for 1 minute at 120 to 150deg.. Afterwards, dip parts into solder bath for 2+-0.5 seconds at 230+-5deg.. 6 7 Measured frequency 1MHz +- 10kHz 1kHz +-10Hz Current resistance Solderability Solder level checked by naked eye under microscope. KYOCERA CORPORATION 4/9 No.EE21-KHDC000-02 No 8 Contents Soldering heat resistance Requirement No mechanical defect. I.R. ; Min. 500M ohms Capacitance variation ; +- 20% 9 Bending strength test No mechanical defect. Measurement method and conditions Completely coat parts with flux and propanol solution and preheat for 1 minute at 120 to 150deg.. Afterwards, dip parts into solder bath for 10+-1 seconds at 260+-5deg.. Measure after 24+-2 hours. As shown below glass epoxy board (t=1.6mm) is soldered. Mechanical pressure is applied and bent 1 mm for 3 seconds. R340 1.0 mm 45mm 10 Temperature cycle No mechanical defect. I.R. ; Min. 500M ohms Capacitance variation ; +- 30% 45mm ( Figure – 4 ) As specified bellow, the steps are repeated 10 cycles. 1 2 3 4 Temperature (deg.) -25+-3 Room Temp. 85+-2 Room Temp. Time (Minutes) 30+-3 2 to 5 30+-3 2 to 5 Measure after 24+-2 hours. 11 Humidity test No mechanical defect. I.R. ; Min. 500M ohm Capacitance variation ; +- 30% 12 High temperature with loading No mechanical defect. I.R. ; Min. 500Mohm Capacitance variation ; +- 30% KYOCERA CORPORATION 5/9 Leave at 40+-2deg.,humidity 90 to 95%Rh atmosphere for 500+-12 hours. Measure after 24+-2 hours. Loading rated direct – current voltage continuously under 85+-3 deg. environment for 500+-12 hours. Measure after 24+-2 hours. No.EE21-KHDC000-02 7. Outgoing quality standards Randomly inspected by ANSi – ASQC Z 1.4 Contents Standard AQL(%) Size-dimension S-1 2.5 Appearance I 1 Capacitance S-4 1 S-4 1 S-4 1 Direct-current resistance Insulation resistance 8. Recommended storage conditions Temperature ; -10 to 45 deg. Humidity ; 45 to 75 %RH 9. Product site KYOCERA Corporation Kagoshima Kokubu plant Japan 10. Standard soldering conditions [ Reflow soldering condition ] Over 250degC 8sec Max 260degC Max 250 *Pre-heating : 150 degree, 1minute Min. Temperature (deg.C) 220degC Min 200 150 180 +/- 5degC *Set a temperature difference between Pre-heating and Peak to less than 130 degree 140 +/- 10degC 100 50 40 +/- 10sec 90 +/- 10sec 35 +/- 5sec (Figure – 5) KYOCERA CORPORATION 6/9 No.EE21-KHDC000-02 Taping packaging specification 1) Apply This specification applies to Kyocera chip EMI filter [KNH21 series] taping. 2) Tape 2 – 1 Material 2 – 2 Dimensions Plastic (mm) Symbol A B C D E Dimensions 1.45+-0.2 2.25+-0.2 8.0+-0.3 3.5+-0.05 1.75+-0.1 F G H J t K 4.0+-0.1 2.0+-0.05 4.0+-0.1 1.5 +0.1 -0 0.25+-0.05 1.15 +0.07 -0.05 t J E A D C B F H G ( Figure – 6 ) K 3) Taping configuration 3 – 1 Unit by reel Taping for 1 reel is 3,000 pcs STD. Also, components should be placed in consecutively without any vacancy. 3 – 2 Reel dimensions Symbol A C E B B D W1 A KYOCERA CORPORATION Dimensions +0 -3.0 +1.0 D60 -0 d180 C d13 +/- 0.5 D d21 +/- 0.8 E 2.0 +/- 0.5 +0 -0.15 W1 9.3 W2 11.4±1.0 W2 7/9 No.EE21-KHDC000-02 (Figure - 9) 3 – 3 Leader portion and blank portion As shown in drawing 8, there is space for leader portion and blank portion. Furthermore, the pulling strength of carrier tape and top tape is 45 +- 35 g as shown in drawing 9. Blank portion Components placement 40mm (Min) Blank portion Leader portion 40mm (Min) 400mm (Min.) Running direction ( Figure – 8 ) 80 ْ 165 ~ 1 Pulling direction Running direction ( Figure – 9 ) 3 – 4 Reel marking The following contents are marked on one side of reel. a) Part number b) Lot number c) Quantity d) Customer name 3 – 5 Other case marking Adequate packaging is done to avoid damages during delivery. The other cases have the following marking. a) Part number b) Lot number c) Quantity d) Shipment date e) Customer name KYOCERA CORPORATION 8/9 No.EE21-KHDC000-02 Limitation of use Make sure to contact us in advance before considering using this product for the following applications which would require particularly high reliability due to possibility of direct harm to lives and/or properties. (1)Use in aerospace or space (2)Use in seabed or underground (3)Use in control of power station – firepower, waterpower, nuclearpower, etc (4)Use in medical treatments including instruments related to lifesaver (5)Use in transportation – cars, trains, ships, etc. (6)Use in traffic controls (7)Use in protection/prevention against disasters or crimes (8)Use in information processing (9)Others – Use in the equivalent applications mentioned above This product is designed and manufactured with intention to be used in general electronic equipments for standard applications but with no intention to be used in the following environments which may affect performance of this product. Therefore, make sure to have enough confirmation on performance and reliability of this product in the following environments in advance before use. (1)Use in liquids such as water, oil, medical liquid, organic solvent, etc (2)Use in direct sunshine, rain, wind, or dust/dirt (3)Use in sea wind or place with corrosive gas such as CI2, H2S, NH3, SO2, NO2, etc (4)Use in environment with strong static electricity or electromagnetic wave (5)Use in located nearly to heat generating part or flammable materials such as vinyl wires (6)Use in condensation (7)Use in sealed or coated by materials such as resin, etc KYOCERA CORPORATION 9/9 No.EE21-KHDC000-02
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