PUBLICATION No.
Reference
Messrs. Digi-key
EMI FILTER Specification
Part No. :KNH21 Series
RoHS Compliant
19.Aug., 2011
KYOCERA CORPORATION
1/9
Approved by
Masanori Somazu
Checked by
Kazuaki Higashi
Checked by
Kazuki Shimizu
Issued by
Takafumi Nogi
No.EE21-KHDC000-02
EMI FILTER SPECIFICATION
1. Apply
This specification applies to Kyocera chip EMI filter KNH21 Series.
2. Nomenclature
KNH 21 C104 DA 3T
S
Termination ( S : STD)
Packaging (3T: 3,000pcs Tape & Reel )
Application (DA : Digital Circuit in General)
Capacitance (C104 : 100nF)
Size code (21 : 2.0*1.2 mm )
Series ( KNH : High current type )
3. Performance / Requirement
3–1
Standard requirement
A: Insulation resistance
B: Operating temperature
3–2
Min. 500 (M ohm)
-40 to 85 (deg.)
Electrical characteristics
Capacitance
( +50 / -20 % )
( pF )
220
470
47,000
100,000
1,000,000
4,700,000
10,000,000
Parts Number
KNH21C221DA3TS
KNH21C471DA3TS
KNH21C473DA3TS
KNH21C104DA3TS
KNH21C105DA3TS
KNH21C475DA3TS
KNH21C106DA3TS
3–3
Rated
current
(A)
1.0
1.0
2.0
2.0
4.0
4.0
6.0
Rated
voltage
(V)
50
50
50
25
10
6.3
6.3
Direct - current
resistance
(Ohm)
Max. 0.08
Max. 0.08
Max. 0.02
Max. 0.02
Max. 0.02
Max. 0.02
Max. 0.01
Frequency Characteristics
10
KNH21C221DA
0
Attenuation (dB)
KNH21C471DA
K NH21C473DA
-10
KNH21C104DA
-20
KNH21C105DA
-30
KNH21C475DA
-40
-50
-60
-70
-80
KNH21C106DA
-90
1
10
100
Frequency (MHz)
KYOCERA CORPORATION
1,000
10,000
2/9
No.EE21-KHDC000-02
4. Size and dimensions
Unit : mm
L
W
Symbol
Dimensions
L
2.00 + / - 0.20
W
1.25 + / - 0.20
T
R
1
3
2
I/O
GND
I/O
0.85 + / - 0.15 *1
P
0.30 + / - 0.20
Q
0.40 + / - 0.20
R
Min. 0.01
*1 KNH21C475DA: 1.0+- 0.15
*1 KNH21C106DA: 1.0+- 0.15
Inner electrode
T
Plating (Sn) : 1-10um
P
Q
P
Plating (Ni) : 1-10um
Outer Electrode
CERAMIC
(Figure – 2)
(Figure – 1)
5. Recommended land pattern
Resist
D
Through hole to connect ground plane
S
W
U
Unit : mm
R
Symbol
T
W
R
C
P
Q
S
U
D
Q
P
C
T
Copper foil pattern
Dimensions
3.20
1.00
2.30
1.20
0.80
0.40
0.60
2.00
0.3 to 0.4
( Figure – 3 )
Copper foil pattern + Resist
KYOCERA CORPORATION
3/9
No.EE21-KHDC000-02
6. Requirement and measurement method
No
Contents
Requirement
1
Appearance
No serious defect.
Measurement method and conditions
Microscope (10 magnifications).
2
Dimensions
Figure – 1
Digital caliper and measurement
microscope.
3
Capacitance
3 – 2 item
Measured by HP4278A.
Capaci
-tance
22pF to
470pF
47nF to
10uF
Measured
voltage
1V+- 0.2V
rms
Measured by super meg ohmmeter
model SM – 9E (made by TOA).
1-3 or 2-3 (at figure – 1) measured.
To measure after charging with the rated
voltage for 1 minute at room temperature
and normal humidity.
4
Insulation
resistance
3 – 1 item
5
Dielectric
strength
No problem observed.
To charge between 1 ( or 3 ) and 2
(at
figure – 1) with the 2.5 times high of the
rated voltage for 1 to 5 seconds.
No problem observed.
Print rated current for 1 to 5 seconds
between 1-2 (at figure – 1).
Coverage Min. 90 %
Each termination.
Completely coat parts with flux and
propanol solution and preheat for 1
minute at 120 to 150deg.. Afterwards, dip
parts into solder bath for 2+-0.5 seconds
at 230+-5deg..
6
7
Measured
frequency
1MHz
+- 10kHz
1kHz
+-10Hz
Current
resistance
Solderability
Solder level checked by naked eye under
microscope.
KYOCERA CORPORATION
4/9
No.EE21-KHDC000-02
No
8
Contents
Soldering heat
resistance
Requirement
No mechanical defect.
I.R. ; Min. 500M ohms
Capacitance variation
; +- 20%
9
Bending
strength test
No mechanical defect.
Measurement method and conditions
Completely coat parts with flux and
propanol solution and preheat for 1
minute at 120 to 150deg.. Afterwards, dip
parts into solder bath for 10+-1 seconds
at 260+-5deg..
Measure after 24+-2 hours.
As shown below glass epoxy board
(t=1.6mm) is soldered. Mechanical
pressure is applied and bent 1 mm for 3
seconds.
R340
1.0 mm
45mm
10
Temperature
cycle
No mechanical defect.
I.R. ; Min. 500M ohms
Capacitance variation
; +- 30%
45mm
( Figure – 4 )
As specified bellow, the steps are
repeated
10 cycles.
1
2
3
4
Temperature
(deg.)
-25+-3
Room Temp.
85+-2
Room Temp.
Time
(Minutes)
30+-3
2 to 5
30+-3
2 to 5
Measure after 24+-2 hours.
11
Humidity test
No mechanical defect.
I.R. ; Min. 500M ohm
Capacitance variation
; +- 30%
12
High
temperature
with loading
No mechanical defect.
I.R. ; Min. 500Mohm
Capacitance variation
; +- 30%
KYOCERA CORPORATION
5/9
Leave at 40+-2deg.,humidity 90 to
95%Rh atmosphere for 500+-12 hours.
Measure after 24+-2 hours.
Loading rated direct – current voltage
continuously under 85+-3 deg.
environment for 500+-12 hours.
Measure after 24+-2 hours.
No.EE21-KHDC000-02
7. Outgoing quality standards
Randomly inspected by ANSi – ASQC Z 1.4
Contents
Standard
AQL(%)
Size-dimension
S-1
2.5
Appearance
I
1
Capacitance
S-4
1
S-4
1
S-4
1
Direct-current
resistance
Insulation
resistance
8. Recommended storage conditions
Temperature ; -10 to 45 deg.
Humidity
; 45 to 75 %RH
9. Product site
KYOCERA Corporation Kagoshima Kokubu plant Japan
10. Standard soldering conditions
[ Reflow soldering condition ]
Over 250degC
8sec Max
260degC Max
250
*Pre-heating : 150 degree,
1minute Min.
Temperature (deg.C)
220degC Min
200
150
180 +/- 5degC
*Set a temperature
difference between
Pre-heating and Peak to
less than 130 degree
140 +/- 10degC
100
50
40 +/- 10sec
90 +/- 10sec
35 +/- 5sec
(Figure – 5)
KYOCERA CORPORATION
6/9
No.EE21-KHDC000-02
Taping packaging specification
1) Apply
This specification applies to Kyocera chip EMI filter [KNH21 series] taping.
2) Tape
2 – 1 Material
2 – 2 Dimensions
Plastic
(mm)
Symbol
A
B
C
D
E
Dimensions
1.45+-0.2
2.25+-0.2
8.0+-0.3
3.5+-0.05
1.75+-0.1
F
G
H
J
t
K
4.0+-0.1
2.0+-0.05
4.0+-0.1
1.5
+0.1
-0
0.25+-0.05
1.15
+0.07
-0.05
t
J
E
A
D
C
B
F
H
G
( Figure – 6 )
K
3) Taping configuration
3 – 1 Unit by reel
Taping for 1 reel is 3,000 pcs STD. Also, components should be placed in consecutively
without any vacancy.
3 – 2 Reel dimensions
Symbol
A
C
E
B
B
D
W1
A
KYOCERA CORPORATION
Dimensions
+0
-3.0
+1.0
D60
-0
d180
C
d13 +/- 0.5
D
d21 +/- 0.8
E
2.0 +/- 0.5
+0
-0.15
W1
9.3
W2
11.4±1.0
W2
7/9
No.EE21-KHDC000-02
(Figure - 9)
3 – 3 Leader portion and blank portion
As shown in drawing 8, there is space for leader portion and blank portion.
Furthermore, the pulling strength of carrier tape and top tape is 45 +- 35 g
as shown in drawing 9.
Blank
portion
Components
placement
40mm (Min)
Blank portion
Leader portion
40mm (Min)
400mm (Min.)
Running direction
( Figure – 8 )
80 ْ
165 ~ 1
Pulling direction
Running direction
( Figure – 9 )
3 – 4 Reel marking
The following contents are marked on one side of reel.
a) Part number b) Lot number c) Quantity
d) Customer name
3 – 5 Other case marking
Adequate packaging is done to avoid damages during delivery.
The other cases have the following marking.
a) Part number
b) Lot number
c) Quantity
d) Shipment date
e) Customer name
KYOCERA CORPORATION
8/9
No.EE21-KHDC000-02
Limitation of use
Make sure to contact us in advance before considering using this product for the
following applications which would require particularly high reliability due to possibility
of direct harm to lives and/or properties.
(1)Use in aerospace or space
(2)Use in seabed or underground
(3)Use in control of power station – firepower, waterpower, nuclearpower, etc
(4)Use in medical treatments including instruments related to lifesaver
(5)Use in transportation – cars, trains, ships, etc.
(6)Use in traffic controls
(7)Use in protection/prevention against disasters or crimes
(8)Use in information processing
(9)Others – Use in the equivalent applications mentioned above
This product is designed and manufactured with intention to be used in general electronic
equipments for standard applications but with no intention to be used in the following environments
which may affect performance of this product. Therefore, make sure to have enough confirmation
on performance and reliability of this product in the following environments in advance before use.
(1)Use in liquids such as water, oil, medical liquid, organic solvent, etc
(2)Use in direct sunshine, rain, wind, or dust/dirt
(3)Use in sea wind or place with corrosive gas such as CI2, H2S, NH3, SO2, NO2, etc
(4)Use in environment with strong static electricity or electromagnetic wave
(5)Use in located nearly to heat generating part or flammable materials such as vinyl wires
(6)Use in condensation
(7)Use in sealed or coated by materials such as resin, etc
KYOCERA CORPORATION
9/9
No.EE21-KHDC000-02
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