PRQV8.00CR1510Y00L

Messrs. Digi-Key Product Specification (KYOCERA CORPORATION CERAMIC RESONATOR SPECIFICATION) RoHS compliant CONFIRMED (Please sign here and send one copy back to us.) Specification No. Type Name 00 EQM08-5KC-G5PQ801-00 （QK-SB210-PD0621-A） PRQV8.00CR1510Y00L Apr, 16, 2014 Approved by T.Sugihara Checked by K.Katsuyama Checked by T.Matsuoka Issued by N.Arima EQM08-5KC-G5PQ801-00 （QK-SB210-PE0621-A） (1/8) 1. Scope This document shall cover the specifications of the ceramic resonator applied for clock oscillator of a microcomputer. 2. Kyocera's Type Name PRQV8.00CR1510Y00L 3. Customer's Type Name 4. Electrical Characteristics Table 1 Product Specification Items Specifications Oscillating Frequency 8.00 MHz Initial Frequency Tolerance ± 0.15 % Resonant Impedance Temperature Characteristics on Oscillating Frequency (Temperature Drift) Standard Test IC Withstanding Voltage Max. Input Signal Voltage Insulation Resistance Operating Temperature Range Storage Temperature Range Aging for 10 Years on Oscillating Frequency 500 Ω max. ± 0.10 % （ -40 to +125 °C ） MC74HCU04 (Freescale) 100V D.C. 10 seconds max 15 Vp-p 100 MΩ min (at 10V D.C.) -40 to +125 °C -40 to +125 °C ±0.05% at 25°C from initial value 4-1. Measurement Condition The reference temperature shall be 25 ± 2 °C. The measurement shall be performed in the temperature range from 15 °C to 35 °C unless otherwise the result is doubtful. 4-2. Measurement Circuit Oscillating frequency shall be measured using the Kyocera standard test circuit shown in Fig 1. EQM08-5KC-G5PQ801-00 （QK-SB210-PE0621-A） (2/8) Vdd=5.0V 14 MC74HCU04 (Freescale) 1 2 3 4 7 Out Rf Resonator C1 C2 Rf=1MΩ C1=C2=10 pF (Reference) Fig 1 Standard Measuring Circuit 5. Appearance & Dimensions Oscillating Frequency e.g.: xxx=800 show the oscillating frequency of 8.00 MHz, respectively. Date Code 2013 2014 2015 2016 K800 Note: Jan. Jan. Jan. Jan. ~ ~ ~ ~ Dec. Dec. Dec. Dec. A~M N~Z a~m n~z (except “ I ”) (except “O” ) (except “ i ”) (except “o”) The alphabet should be repeated after Jan.2017. Day Code Day Code Day Code Day Code 1 A 11 L 21 W 2 B 12 M 22 X 3 C 13 N 23 Y 4 D 14 P 24 Z 5 E 15 Q 25 a 6 F 16 R 26 b 7 G 17 S 27 c 8 H 18 T 28 d 9 J 19 U 29 e 10 K 20 V 30 f 31 g Appearance There should be no mechanical damages, which are markedly out of this specification. Terminal: Fig 2 Dimensions Unit: mm Ni/Sn plating EQM08-5KC-G5PQ801-00 （QK-SB210-PE0621-A） (3/8) 6. Part Numbering Guide PRQV 8.00 C R 15 10 Y 00L A B C D E F G H 7. Environmental Characteristics Table 2 Enviromental Characteristics Items 7-1. Humidity 7-2. High Temperature 7-3. Low Temperature 7-4. Temperature Cycle 7-5. Mechanical Shock 7-6. Vibration 7-7. Solderability 7-8. Reflow Soldering 7-9. Cleaning A. Series (MHz Band SMD Ceramic Resonator) B. Oscillating Frequency (eg. 8.00 MHz) C. Type D. Packing (Tape & Reel 3000 pcs/Reel) E. Initial Frequency Tolerance F. Bult-in Capacitor (10pF: Standard) G. Operating Temp. Range H. Unique Code Conditions After leaving in a chamber at 80 to 85 % R.H. and 85 ± 2°C for 1000 +12/-0 hours and then left at room temperature for 1 hour the resonator shall meet the specifications shown in Table 3. After leaving in a chamber at 125 ± 2°C for 1000 +12/-0 hours and then left at room temperature for 1 hour, the resonator shall meet the specifications shown in Table 3. After leaving in a chamber at –40 ±3°C for 1000 +12/-0 hours and then left at room temperature for 1 hour, the resonator shall meet the specifications shown in Table 3. After leaving in a chamber at –40 ± 3 °C for 30 minutes, then the resonator is left at 125 ± 2°C for 30 minutes. This procedure is one cycle. After leaving in 1000 cycles, and then left at room temperature for 1 hour, the resonator shall meet the specifications shown in Table 3. After applying the acceleration at 29430m/sec2 {3000G} in each of X, Y and Z axis (each 3 time), the resonator shall meet the specifications in Table 3. After applying the vibration at amplitude 1.5 mm and 10 to 55 Hz of vibration frequency in each of 3 mutually perpendicular directions for 1 hour, the resonator shall meet the specifications shown in Table 3. At first, being soaked in the Methanol (JIS K1501) solution containing Rosin (JIS K5902) for 5 seconds and next being soaked in a bath of Pb/Sn solder at 235 ± 5°C for 4 ± 0.5 seconds, then more than 95% the surface of the electrode terminal shall be soldered. At first, leaving at 150 to 180°C of pre-heat for 90 to 120 seconds, next left at peak temperature 260+0/-5°C, over 230°C for 30 to 40seconds (2times). Finally leaving at room temperature for 1 hour. The resonator shall meet the specifications shown in Table 3. 1)Ultrasonic cleaning: The resonator is washed with iso-propyl alcohol at room temperature with condition of 20KW/m3 and 28kHz for 60sec. No significant damage on the resonator shall occur and marking shall be safely readable. 2)Soaking cleaning: The resonator is soaked in iso-propyl alcohol at room temperature for 90sec. No significant damage on the resonator shall occur and marking shall be safely readable. After soldered on the board specified as below, then the load which cause 3 mm bent to the board is applied, the resonator shall meet the specifications in Table 3 1.2 1.2 and cause no defect in the appearance. 50 20 R230 3.0 7-10. Bend strength 1.9～ 2.1 F 45 (Units: mm) 45 3 - 0.4 Material: Glass-epoxy Thickness: 0.8mm / Size: L100mm x W40 Recommendable land pattern Solder paste: 0.2mm Thickness Fig.3 Bend Strength EQM08-5KC-G5PQ801-00 （QK-SB210-PE0621-A） (4/8) Table 3 Environmental Characteristics Standard Items Specifications Oscillating Frequency (from initial value) ±0.2 % max Resonant Impedance 550 Ω max. 8. Recommendable land pattern 1.2 1.9 ～ 2.1 1.2 Unit: (mm) 0.4 Fig.4 Recommended Land pattern 9. Recommendable reflow profile 300 Reflow Peak 260 oC max (Over 230 ºC, 30 to 40 seconds) Temperature (oC) 250 200 150 Preheat 150 to 180 oC 100 50 90 to 120 seconds Over 200 oC within 80 seconds 0 Time(Sec) Fig.5 Recommended IR Reflow profile EQM08-5KC-G5PQ801-00 （QK-SB210-PE0621-A） (5/8) 10. Taping Specifications 10-1. Tape 10-1-1. Dimensions K P0 D0 T E P2 F W 0 B A0 T2 P1 D1 Fig.6 Emboss Carrier Tape Dimensions Table 4 Emboss Carrier Tape Dimensions Symbol A0 Dimensions B0 W F E P1 P2 1.55±0.1 3.45±0.1 8.00±0.2 3.50±0.05 1.75±0.1 4.00±0.1 2.00±0.05 P0 D0 T T2 K D1 4.00±0.1 1.50+0.1/-0 0.25±0.05 1.40max. 1.10±0.05 1.0±0.1 Symbol Dimensions Unit: (mm) 10-2. Taping 10-2-1. Taping Quantity One reel of the tape shall pack 3000 pcs resonators maximum. No resonator shall be missing and contained continuously in pocket. 10-2-2. Reel Dimensions W1 E A C N D Fig.7 Reel Table 5 Reel Dimensions Symbol A Dimensions Symbol Dimensions W2 Unit: (mm) N W1 W2 180+0/-9 60±1.0 9.2±0.1 12.0 max. C D E 13.0±0.2 21.0±0.8 2.0±0.5 EQM08-5KC-G5PQ801-00 （QK-SB210-PE0621-A） (6/8) 10-2-3. Taping Package D Kxxx Kxxx Kxxx Kxxx Kxxx Taping package shall be composed of leader, blank pockets and loaded pockets, as described in Fig.8. The peeling force between top and carrier tapes shall be in the range from 0.1N {10gf} to 0.7N {70gf} with the condition described in Fig.9. C B A A: Leader Tape B: Blank Pocket (160 mm min) A+B: 400- 560 mm C: Loaded Pocket D: Blank Pocket (40 – 190 mm ) Fig.8 Packing Method Top Tape Carrier Tape Pulling Direction 165º to 180º Pulling Direction Direction of Feed Fig.9 Peeling Strength 10-2-5. Reel Label Reel label shall contain information described on the basis of EIAJ C-3 format. A) Customer P/N B) Lot No. C) Quantity D) Shipping date E) Vender name 10-2-6. Exterior Package Label The resonators shall be packed properly to avoid defect in transportation and the marking of the exterior package shall contain information described as below. A) Name of customer B) P/O No. C) Customer P/N D) Lot No. E) Quantity F) Shipping date G) Vender name EQM08-5KC-G5PQ801-00 （QK-SB210-PE0621-A） (7/8) 11. Agreement on this Specification Should any part of the content of this specification become questionable, it shall be settled by mutual deliberations. 12. Remarks on Usage 12-1.In case that such stronger shock and vibration, higher temperature that shall be specified were to be applied to the resonator, it would occasionally become out of order. So please pay plenty of attention to its usage. 12-2.This part is available for reflow soldering only. The ceramic resonator may be damaged in case of reflow soldering at temperatures higher than 260 oC. 12-3.Ensure that your circuit design is fully characterized for your IC. For recommendations of component values, please contact IC manufacturer or our local sales office before mass production. Please note there may be some oscillation problems in case of not suitable circuit design. 12-4.Storage condition Please use the ceramic resonator within one year from the shipping date under room storage condition less than 30 oC and 60%RH with the shipped package. 12-5.Fail-safe Be sure to provide an appropriate fail-safe function on your system or subsystem to prevent a second damage that may be caused by an abnormality or failure related to our product. 12-6Limitation of use Make sure to contact us in advance before considering using this product for the following applications which would require particularly high reliability due to possibility of direct harm to lives and/or properties. （1）Use in aerospace or space （2）Use in seabed or underground （3）Use in control of power station – firepower, waterpower, nuclearpower, etc （4）Use in medical treatments including instruments related to lifesaver （5）Use in transportation – trains, ships, etc. （6）Use in traffic controls （7）Use in protection/prevention against disasters or crimes （8）Others – Use in the equivalent applications mentioned above 12-7. This product is designed and manufactured with intention to be used in general electronic equipments for standard applications but with no intention to be used in the following environments which may affect performance of this product. Therefore, make sure to have enough confirmation on performance and reliability of this product in the following environments in advance before use. (1) Use in liquids such as water, oil, medical liquid, organic solvent, etc (2) Use in direct sunshine, rain, wind, or dust/dirt (3) Use in sea wind or place with corrosive gas such as CI2, H2S, NH3, SO2, NO2, etc (4) Use in environment with strong static electricity or electromagnetic wave (5) Use in located nearly to heat generating part or flammable materials such as vinyl wires (6) Use in sealed or coated by materials such as resin, etc (7) Use in condensation EQM08-5KC-G5PQ801-00 （QK-SB210-PE0621-A） (8/8) 13. Placement of the Resonator The resonator should be placed on PCB as described follow to avoid any mechanical stresses applied to the part. Long Edge Long Edge Short Edge Resonator Resonator Short Edge PCB PCB Non-Preferable Location Preferable Location Fig.10 Mounting Direction 14. Environment Hazardous Substance (RoHS Compliant Certificate) The environment hazardous substance in Table 6 is not being used to the raw materials and also manufacturing process of this product and packaging (except impurities). Lead (Pb) used in the resonator products is exempted from RoHS requirements in the ANNEX. Table 6 Enviromental Load Substance Substances Substances Inhibited by the Law in Japan Products Content Reel and Packages None None None None None None None None 4 Cadmium and cadmium compounds PBB (polybrominated biphenyl) s and PBDE (polybrominated biphenyl ether) s Chlorinated paraffins (Chlorines Flame retarder/Plasticizer) PCB (polychlorinated biphenyl) s 5 Poly chloridation naphthalenes None None None None 7 Organo tin compounds (Tributyl tins/ Triphenyl tins) Asbestos None None 8 Azo compounds None None 9 Lead (Pb) Yes None 1 2 3 6 Others