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ST3215SB32768C0HPWBB

ST3215SB32768C0HPWBB

  • 厂商:

    OPTREX(京瓷)

  • 封装:

    SMD3215_2P

  • 描述:

    无源晶振 70KΩ 7pF ±20ppm -40℃~+85℃ SMD3215_2P 32.768KHz

  • 数据手册
  • 价格&库存
ST3215SB32768C0HPWBB 数据手册
Specifications Drawing No. USY1N-H1-13168-00 Issued Date. 1/7 Jul,5,2013 Messrs: Digi-Key Note: In case of specification change, KYOCERA Part Number also will be changed. Product Name Tuning Fork Crystal Product Model ST3215SB Frequency 32.768 kHz Customer Part Number - Customer Specification Number - KYOCERA Part Number ST3215SB32768C0HPWBB Remarks Pb-Free, RoHS Compliant, MSL 1 Customer Acceptance Accept Signature Approved Date Department Person in charge Seller KYOCERA Corporation Manufacturer KYOCERA Crystal Device Corporation (Crystal Units Division) 6 Takeda Tobadono-cho, Fushimi-ku, Kyoto 612-8501 Japan TEL. No. 075-604-3500 FAX. No. 075-604-3501 Design Department KYOCERA Crystal Device Corporation Crystal Unit Application Engineering Section 5850, Higashine-koh, Higashine-shi, Yamagata 999-3701 Japan TEL. No. 0237-43-5611 FAX. No. 0237-43-5615 Quality Assurance F.Mukae Approved by T.Soda Checked by A.Muraoka Issued by Y.Nozaki Crystal Units Division KYOCERA Crystal Device Corporation KBS-5079D Drawing No. USY1N-H1-13168-00 2/7 Revision History Rev.No. 0 Description of revise First Edition Date Approved by Checked by Issued by Jul,5,2013 T.Soda A.Muraoka Y.Nozaki KYOCERA Crystal Device Corporation KBS-5079D Drawing No. USY1N-H1-13168-00 3/7 1. APPLICATION This specification sheet is applied to tuning fork crystal “ST3215SB”. 2. PART NUMBER ST3215SB32768C0HPWBB 3. RATINGS Items SYMB. Rating Unit Operating Temperature Topr -40~+85 deg. C Storage Temperature range Tstg -55~+125 deg. C 4. CHARACTERISTICS 4-1 ELECTRICAL CHARACTERISTICS Electrical Specification Item Symbol Nominal Frequency fo Ta = 25 deg. C Frequency Tolerance df/fo Ta = 25 deg.C Load Capacitance CL Equivalent series resistance R1 Q-Value Q 13000 Motional capacitance C1 Shunt capacitance Turning point Secondary temperature Coefficient Typ. Max Unit 32.768 -20 kHz 20 ppm 7.0 pF kΩ 3.0 4.4 fF Co 0.6 1.2 pF Tp 20 30 deg. C K -4.0 df/F Drive level DL (between electrodes) Min 70 Aging Insulation resistance Condition Ta = 25 deg. C -8 -3 0.1 IR 500 2 10 /degC 3 ppm/year 0.5 µW MΩ 4-2 MOISTURE SENSITIVITY LEVEL Level 1 KYOCERA Crystal Device Corporation KBS-5079D Drawing No. USY1N-H1-13168-00 4/7 5. APPEARANCES, PHYSICAL DIMENSION OUTLINE DIMENSION CONNECTION (TOP VIEW) 1.5± 0.1 3.2±0.10 4-(0.25) (1) 6-(0.1) (2) (3) (4) 0.8± 0.1 K925CA C0.25 4-(R0.15) UNIT : mm 1.70 MARKING Identification 1 K 2 Date Code(3 Digits) Last 1 digit of year and week Code. 3 Load Capacitance (Example) 7pF  C 4 Management Code Alphabet or Number 1digit. *The font of marking above is for reference purpose. 6. RECOMMENDED LAND PATTERN 1.6 1.0 1.55 1.0 3.6 UNIT : mm KYOCERA Crystal Device Corporation KBS-5079D Drawing No. USY1N-H1-13168-00 5/7 7. TAPING 7.1 TAPING Maximum quantity per 1 reel is Max 3,000pcs(φ180 Reel) and oriented part in 1 direction 1.Material of the carrier tape shall be polystyrene or A-PET (ESD). 2. Material of the seal tape shall be polyester (ESD). 3. The seal tape shall not cover the sprocket holes and not protrude from the carrier tape. 4. The R of the corner without designation is 0.2R MAX. 5. Misalignment between centers of the cavity and a sprocket hole shall be 0.05mm or less. 6. Cumulative pitch tolerance of “G” shall be ±0.2mm at 10 pitches. 7. The directivity of printing in an embossing tape shall be unified as shown in the above-mentioned figure. 8. Peeling force of the seal tape is in the range of 0.1 to 0.7N. Leader and ending tape SMD parts taped area Empty compartment Empty compartment 100mm min. sealed with top cover tape END Top cover tape only START 160mm min. 350mm min. Leader Ending Direction (View from cover tape) K925CA K925CA K925CA K925CA Feeding direction Tape strength Tape strength Cover tape Bending radius (50mm) 165 to 180˚ Feeding direction Enboss tape KYOCERA Crystal Device Corporation KBS-5079D Drawing No. USY1N-H1-13168-00 6/7 7-2 Emboss Taping specifications H L K B D E F J A symbol Dimension Symbol Dimension W T G A B D E F G 1.8±0.1 3.6±0.1 12.0±0.3 5.5±0.1 1.75±0.1 4.0±0.1 H J K L W T 4.0±0.1 2.0±0.1 1.0+0.1/-0 1.0±0.1 0.3±0.05 1.5+0.1/-0 (Unit: mm) 7-3 Reel specifications W C D E B A Symbol Dimension Symbol Dimension A φ180 +0/-1.5 D φ21±0.8 B φ60 +1.0/-0 E 2.0±0.5 C φ13±0.2 W 13.0 +1.0/-0 (Unit: mm) KYOCERA Crystal Device Corporation KBS-5079D Drawing No. USY1N-H1-13168-00 7/7 8. RELIABILITY Frequency Stability and ESR, Stability after stressing. TEST ITEM Frequency Stability (ppm) 8.1 Low temp. use/storage 8.2 High temp. use/storage 8.3 Shock 8.4 Vibration 8.5 Soldering iron resistance 8.6 Manual hot gas resistance 8.7 High temp. With humidity 8.8 Temperature cycle ±5 ±5 ± 20 ±5 ±5 ± 10 ±5 ±5 ESR Stability (%) Remarks ± 30 Ta=25 deg. C 9. REFLOW PROFILE Pb-free reflow requirements for soldering heat resistance KYOCERA Crystal Device Corporation KBS-5079D
ST3215SB32768C0HPWBB 价格&库存

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