ST3215SB32768H5HPWAA

No. EQM08-5GC-T030881-00 1(8) Date:2008/12/08 Messrs: Preliminary Specification Customer part number Customer specification Number Product Model Frequency Product code Tuning Fork Crystal ST3215SB 32.768 kHz ST3215SB32768H5HPWAA Pb Free, RoHS Compliant [STAMP] Sales office Production KYOCERA Corporation (Electronic Components Sales Division) Head Office 6 Takeda Tobadono-cho, Fushimi-ku, Kyoto 612-8501 Japan TEL 075-604-3500 FAX 075-604-3501 KYOCERA KINSEKI Corporation (Quartz Crystal Department) 1-8-1, Izumi-honcho, Komae-Shi, Tokyo 201-8648 Japan TEL 03-5497-3111 FAX 03-5497-3209 Design Drawn by Checked by Approved by F.Fujisaki M.Ishibashi S.Itoh KYOCERA KINSEKI Co. Yohkaichi Plant Quartz Crystal division KYOCERA KINSEKI CORPORATION No. EQM08-5GC-T030881-00 2(8) Date:2008/12/08 Change History REV 00 DESCRIPTION First issue DATE DRAWN CHECKED APPROVED F.Fujisaki M. Ishibashi S. Itoh KYOCERA KINSEKI CORPORATION No. EQM08-5GC-T030881-00 3(8) Date:2008/12/08 1. APPLICATION This specification sheet is applied to tuning fork crystal “ST3215SB”. 2. PART NUMBER ST3215SB32768H5HPWAA 3. RATINGS Items SYMB. Rating Unit Operating Temperature Topr -40~+85 deg. C Storage Temperature range Tstg -45~+85 deg. C 4. CHARACTERISTICS 4-1 ELECTRICAL CHARACTERISTICS Item Symbol Nominal Frequency fo Condition Ta = 25 deg. C Frequency Tolerance df/fo Ta = 25 deg.C Load Capacitance CL Equivalent series resistance R1 Q-Value Motional capacitance Shunt capacitance Turning point Secondary temperature Coefficient Aging Drive level Insulation resistance (between electrodes) Q C1 Co Tp Electrical Specification Min Typ. 32.768 -20 Max Unit kHz 20 ppm 12.5 Ta= -30…85 deg.C 13000 3.0 0.6 20 3.7 0.9 25 -4.0 -3.6 -3 0 0.1 K df/F DL Ta = 25 deg. C IR Ta = -30 … 85 deg. C 4-2 MOISTURE SENSITIVITY LEVEL Level 2 KYOCERA KINSEKI CORPORATION 500 pF 70 kΩ 4.4 1.2 30 fF pF deg. C -8 2 10 /degC 3 0.5 ppm/year μW MΩ No. EQM08-5GC-T030881-00 4(8) Date:2008/12/08 5. APPEARANCES, PHYSICAL DIMENSION OUTLINE DIMENSION CONNECTION (TOP VIEW) K825AA (1) 4-0.1 (2) 0.8± 0.1 4-(0.25) 1.5± 0.1 3.2±0.10 (3) (4) C0.25 4-0.1 4-R0.15 4-0.16 UNIT : mm 0.75 MARKING 1. Identification K 2. Date Code Last 1 digit of year and week. (Example) June 15 2008 Æ 825 *For details to LOT CALENDAR 3. Load Capacitance (Example) 12.5 pF Æ A 4. Management number A *The font of marking above is for reference purpose. 6. RECOMMENDED LAND PATTERN 1.6 1.0 1.55 1.0 3.6 UNIT : mm KYOCERA KINSEKI CORPORATION No. EQM08-5GC-T030881-00 5(8) Date:2008/12/08 7. TAPING 7.1 TAPING Maximum quantity per 1 reel is Max 10,000pcs(ø330 Reel) and oriented part in 1 direction 1.Material of the carrier tape shall be polystyrene or A-PET (ESD). 2. Material of the seal tape shall be polyester (ESD). 3. The seal tape shall not cover the sprocket holes and not protrude from the carrier tape. 4. The R of the corner without designation is 0.2R MAX. 5. Misalignment between centers of the cavity and a sprocket hole shall be 0.05mm or less. 6. Cumulative pitch tolerance of “G” shall be ±0.2mm at 10 pitches. 7. The directivity of printing in an embossing tape shall be unified as shown in the above-mentioned figure. 8. Peeling force of the seal tape is in the range of 0.1 to 0.7N. Leader and ending tape SMD parts taped area Empty compartment Empty compartment 100mm min. sealed with top cover tape Top cover tape only END START 300mm min. 350mm min. Leader Ending Direction (View from cover tape) K825AA K825AA K825AA K825AA Feeding direction Tape strength Tape strength Cover tape 165 to 180˚ Feeding direction Enboss tape KYOCERA KINSEKI CORPORATION Bending radius (50mm) No. EQM08-5GC-T030881-00 6(8) Date:2008/12/08 7-2 Emboss Taping specifications H L K B D E F J A symbol Dimension Symbol Dimension W T G A B D E F G 1.8±0.1 3.6±0.1 12.0±0.3 5.5±0.1 1.75±0.1 4.0±0.1 H J K L W T 4.0±0.1 2.0±0.1 1.5+0.1/-0 1.0(min) 1.0±0.1 0.3±0.05 (Unit: mm) 7-3 Reel specifications W C t D E B A Symbol A B C D Dimension Symbol Φ330±0.2 E Φ100±1.0 W Φ13±0.2 t Φ21±0.8 Dimension 2.0±0.5 13.5±1 2.0±0.5 (Unit: mm) KYOCERA KINSEKI CORPORATION No. EQM08-5GC-T030881-00 7(8) Date:2008/12/08 8. RELIABILITY Frequency Stability and ESR Stability After stressing. TEST ITEM 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 Low temp. use/storage High temp. use/storage Shock Vibration sinusoidal Vibration random Soldering iron resistance Manual hot gas resistance High temp. With humidity Temperature cycle Frequency Stability (ppm) ESR Stability (%) Remarks ±5 ±5 ± 20 ±5 ±5 ±5 ± 10 ±5 ±5 ± 30 Ta=25 deg. C 9. REFLOW PROFILE Pb-free reflow requirements for soldering heat resistance KYOCERA KINSEKI CORPORATION No. EQM08-5GC-T030881-00 8(8) Date:2008/12/08 10.LOT CALENDAR WEEK MONTH SUN MON TUE WED THU 901 1 902 903 904 905 906 2 907 908 909 910 3 911 912 913 914 915 4 916 917 918 919 5 920 921 922 923 924 925 926 927 6 FRI SAT 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 1 2 3 4 WEEK MONTH SUN MON TUE WED THU 928 930 931 932 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 8 933 934 935 936 937 9 938 939 940 941 10 942 943 944 945 11 946 947 948 949 950 12 951 952 953 SAT 6 7 929 FRI 5 KYOCERA KINSEKI CORPORATION