ST3215SB32768Z0HPWBB

Specifications Drawing No. USY1N-H1-14101-00 Issued Date. 1/8 Apr,15,2014 Messrs: Digi-Key Note: In case of specification change, KYOCERA Part Number also will be changed. Product Name Tuning Fork Crystal Product Model ST3215SB Frequency 32.768 kHz Customer Part Number - Customer Specification Number - KYOCERA Part Number ST3215SB32768Z0HPWBB Remarks Pb-Free, RoHS Compliant, MSL 1 Customer Acceptance Accept Signature Approved Date Department Person in charge Manufacturer Seller KYOCERA Crystal Device Corporation (Crystal products Sales Division) 6 Takeda Tobadono-cho, Fushimi-ku, Kyoto 612-8501 Japan TEL. No. 075-604-3500 FAX. No. 075-604-3501 Design Department KYOCERA Crystal Device Corporation Crystal Unit Application Engineering Section Crystal Units Division 5850, Higashine-Koh, Higashine-Shi, Yamagata 999-3701 Japan TEL. No. 0237-43-5611 FAX. No. 0237-43-5615 Quality Assurance F.Mukae Approved by T.Soda Checked by A.Muraoka Issued by Y.Nozaki Crystal Units Division KYOCERA Crystal Device Corporation KBS-5079F Drawing No. USY1N-H1-14101-00 2/8 Revision History Rev.No. 0 Description of revise First Edition Date Approved by Checked by Issued by Apr,15,2014 T.Soda A.Muraoka Y.Nozaki KYOCERA Crystal Device Corporation KBS-5079D Drawing No. USY1N-H1-14101-00 3/8 1. APPLICATION This specification sheet is applied to tuning fork crystal “ST3215SB”. 2. PART NUMBER ST3215SB32768Z0HPWBB 3. RATINGS Items SYMB. Rating Unit Operating Temperature Topr -40~+85 deg. C Storage Temperature range Tstg -55~+125 deg. C 4. CHARACTERISTICS 4-1 ELECTRICAL CHARACTERISTICS Electrical Specification Item Symbol Nominal Frequency fo Ta = 25 deg. C Frequency Tolerance df/fo Ta = 25 deg.C Load Capacitance CL Equivalent series resistance R1 Q-Value Q 13000 Motional capacitance C1 Shunt capacitance Turning point Secondary temperature Coefficient Typ. Max Unit 32.768 -20 kHz 20 ppm 4.0 pF kΩ 3.0 4.4 fF Co 0.6 1.2 pF Tp 20 30 deg. C K -4.0 df/F Drive level DL (between electrodes) Min 70 Aging Insulation resistance Condition Ta = 25 deg. C -8 -3 0.1 IR 500 2 10 /degC 3 ppm/year 0.5 µW MΩ 4-2 MOISTURE SENSITIVITY LEVEL Level 1 KYOCERA Crystal Device Corporation KBS-5079D Drawing No. USY1N-H1-14101-00 4/8 5. APPEARANCES, PHYSICAL DIMENSION OUTLINE DIMENSION CONNECTION (TOP VIEW) 1.5± 0.1 3.2±0.10 4-(0.25) (1) 6-(0.1) (2) (3) (4) 0.8± 0.1 K9254A C0.25 4-(R0.15) UNIT : mm 1.70 MARKING Identification 1 K 2 Date Code(3 Digits) Last 1 digit of year and week Code. 3 Load Capacitance (Example) 4pF  4 4 Management Code Alphabet or Number 1digit. *The font of marking above is for reference purpose. 6. RECOMMENDED LAND PATTERN 1.6 1.0 1.55 1.0 3.6 UNIT : mm KYOCERA Crystal Device Corporation KBS-5079D Drawing No. USY1N-H1-14101-00 5/8 7. TAPING 7.1 TAPING 1.Material of the carrier tape shall be polystyrene or A-PET (ESD). 2. Material of the seal tape shall be polyester (ESD). 3. The seal tape shall not cover the sprocket holes and not protrude from the carrier tape. 4. The R of the corner without designation is 0.2R MAX. 5. Misalignment between centers of the cavity and a sprocket hole shall be 0.05mm or less. 6. Cumulative pitch tolerance of “G” shall be ±0.2mm at 10 pitches. 7. The directivity of printing in an embossing tape shall be unified as shown in the above-mentioned figure. 8. Peeling force of the seal tape is in the range of 0.1 to 0.7N. Leader and ending tape SMD parts taped area Empty compartment Empty compartment 100mm min. sealed with top cover tape END Top cover tape only START 160mm min. 350mm min. Leader Ending Direction (View from cover tape) K9254A K9254A K9254A K9254A Feeding direction Tape strength Tape strength Cover tape Bending radius (50mm) 165 to 180˚ Feeding direction Enboss tape KYOCERA Crystal Device Corporation KBS-5079D Drawing No. USY1N-H1-14101-00 6/8 7-2 Emboss Taping specifications H L K B D E F J A symbol Dimension Symbol Dimension W T G A B D E F G 1.8±0.1 3.6±0.1 12.0±0.3 5.5±0.1 1.75±0.1 4.0±0.1 H J K L W T 4.0±0.1 2.0±0.1 1.0+0.1/-0 1.0±0.1 0.3±0.05 1.5+0.1/-0 (Unit: mm) 7-3 Reel specifications W C D E B A In the case of φ180 Reel Symbol A φ180 +0/-1.5 Dimension Symbol D φ21±0.8 Dimension In the case of φ330 Reel Symbol A φ330 +/-2.0 Dimension Symbol D φ21±0.8 Dimension B φ60 +1.0/-0 E 2.0±0.5 C φ13±0.2 W 13.0 +1.0/-0 B φ100 +/-1.0 E 2.0±0.5 C φ13±0.2 W 13.4 +/-1.0 KYOCERA Crystal Device Corporation KBS-5079D Drawing No. USY1N-H1-14101-00 7/8 8. RELIABILITY Frequency Stability and ESR, Stability after stressing. TEST ITEM Frequency Stability (ppm) 8.1 Low temp. use/storage 8.2 High temp. use/storage 8.3 Shock 8.4 Vibration 8.5 Soldering iron resistance 8.6 Manual hot gas resistance 8.7 High temp. With humidity 8.8 Temperature cycle ±5 ±5 ± 20 ±5 ±5 ± 10 ±5 ±5 ESR Stability (%) Remarks ± 30 Ta=25 deg. C 9. REFLOW PROFILE Pb-free reflow requirements for soldering heat resistance KYOCERA Crystal Device Corporation KBS-5079D Drawing No. USY1N-H1-14101-00 8/8 10. Cautions for use (1) Soldering in mounting In case of Solder paste and conductive glue contact product lid or product side face exception for product terminal it’s possible to influence product characteristics. Please be careful above contents. (2) Automatic mounting machine use Please use after affirmation that select the mounting machine model with a shock small if possible in the case of use of an automatic mounting machine, and it does not have breakage. There is a risk of a crystal oscillating child's breakage occurring and not functioning normally by too much shock etc. (3) Conformity of a circuit In case of use of an oscillation circuit, please insert in a crystal oscillating child in series resistance 3 times as many as the standard value of equivalent in-series resistance, and confirm oscillating. Please remove resistance which inserted after the notes above-mentioned examination in the crystal oscillating child in series, and use it. 11. Storage conditions Storage at prolonged high temperature or low temperature and the storage by high humidity cause degradation of frequency accuracy, and degradation of soldering nature. Storage is performed at the temperature of +18 to +30°C, and the humidity of 20 to 70 % in the state of packing, and a term is 6 months. 12. Manufacturing location Kyocera Crystal Device Corporation Shiga Yohkaichi Plant Kyocera Crystal Device (Thailand) Co., Ltd 13. Quality Assurance Kyocera Crystal Device Quality Assurance Division 14. Quality guarantee When the failure by the responsibility of our company occurs clearly after delivery within 1 year, a substitute article etc. is appropriated gratuitously and this is guaranteed. However, when passing 1 year after delivery, there is a case where I am allowed to consider as onerous repair after both consultation. 15. Others When any questions and opinions are in the written matter of these delivery specifications, I will ask connection of you from the company issue day within 45 days. In a connection no case, a written matter is consented to it and employed within a term. KYOCERA Crystal Device Corporation KBS-5079D