ORANGE
1. 2. 2.1 2.2
Item No.: 190622
This specification applies to GaAsP / GaP LED Chips Structure Mesa structure Electrodes p-side (anode) n-side (cathode) Au alloy Au alloy
3.
Outlines (dimensions in microns) p-Electrode p-Epitaxy GaP n-Epitaxy GaP 250 235 n-Electrode n-Epitaxy GaP n-Substrate GaP
235
110
Wire bond contacts can also be square 4. Electrical and optical characteristics (T=25°C)
Parameter
Forward voltage Reverse current Luminous intensity *
Symbol
VF IR IV
Conditions
I F = 2 mA VR = 5 V I F = 2 mA
min
typ
1,80
max
2,00 10
Unit
V µA cd nm
180
230
Peak wavelength λP I F = 2 mA 635 * On request, wafers will be delivered according to luminous intensity classes Brightness measurement at OSA on gold plate 5. Packing Dice on adhesive film with 1) wire bond side on top 2) back contact on top 6. Labeling Type Lot No. IV typ min max Quantity
© 2004
OSA Opto Light GmbH Tel. +49-(0)30-65 76 26 83 Fax +49-(0)30-65 76 26 81 contact@osa-opto.com
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