Hyper Multi TOPLED® Enhanced optical Power LED (HOP2000 / ATON®) LATB T66B
Vorläufige Daten / Preliminary Data
Besondere Merkmale • Gehäusetyp: weißes P-LCC-4 Gehäuse; Kontrasterhöhung durch schwarze Oberfläche (RGB-Displays) und diffuses Harz • Besonderheit des Bauteils: additive Farbmischung durch unabhängige Ansteuerung aller Chips • Wellenlänge: 617 nm (amber), 528 nm (true green), 470 nm (blau) • Abstrahlwinkel: Lambertscher Strahler (120°) • Technologie: InGaAlP (amber), InGaN (true green, blau) • optischer Wirkungsgrad: 24 lm/W (amber), 13 lm/W (true green), 3 lm/W (blau) • Gruppierungsparameter: Lichtstärke • Verarbeitungsmethode: für alle SMT-Bestücktechniken geeignet • Lötmethode: IR Reflow Löten und Wellenlöten (TTW) • Vorbehandlung: nach JEDEC Level 2 • Gurtung: 8 mm Gurt mit 2000/Rolle, ø180 mm oder 8000/Rolle, ø330 mm • ESD-Festigkeit: ESD-sicher bis 2 kV nach EOS/ESD-5.1-1993 Anwendungen • Anzeigen im Innen- und Außenbereich (z.B. im Verkehrsbereich; Laufschriftanzeigen) • Leuchtdiodenchips getrennt ansteuerbar • Vollfarbdisplays bzw. RGB-Displays • Hinterleuchtung (LCD, Schalter, Tasten, Displays, Werbebeleuchtung, Allgemeinbeleuchtung) • Einkopplung in Lichtleiter
2002-05-24 1
Features • package: white P-LCC-4 package; higher contrast by a black surface (RGB-Displays) and diffused resin • feature of the device: additive mixture of color stimuli by independent driving of each chip • wavelength: 617 nm (amber), 528 nm (true green), 470 nm (blue) • viewing angle: Lambertian Emitter (120°) • technology: InGaAlP (amber), InGaN (true green, blue) • optical efficiency: 24 lm/W (amber), 13 lm/W (true green), 3 lm/W (blue) • grouping parameter: luminous intensity • assembly methods: suitable for all SMT assembly methods • soldering methods: IR reflow soldering and TTW soldering • preconditioning: acc. to JEDEC Level 2 • taping: 8 mm tape with 2000/reel, ø180 mm or 8000/reel, ø330 mm • ESD-withstand voltage: up to 2 kV acc. to EOS/ESD-5.1-1993
Applications • indoor and outdoor displays (e.g. displays for traffic; light writing displays) • LED chips can be controlled separately • full color displays, RGB-Displays • backlighting (LCD, switches, keys, displays, illuminated advertising, general lighting) • coupling into light guides
LATB T66B
Typ Emissionsfarbe Color of Emission Farbe der Lichtaustrittsfläche Color of the Light Emitting Area colorless diffused and black painted package surface Lichtstärke
Type
Luminous Intensity IF = 20 mA IV (mcd) amber true green 180 ... 450 blue 45 ... 112 180 ... 450
LATB T66B
amber true green blue
Bestell - Information Ordering Information Typ Type LATB T66B-ST-1+ST-78+PQ-1 LATB T66B-ST-1+ST-7+PQ-1 LATB T66B-ST-1+ST-8+PQ-1 Bestellnummer Ordering Code Q65110-A0152 Q65110-A0181 Q65110-A0182
Anm.: -78 gesamter Farbbereich, Lieferung in Einzelgruppen (siehe Seite 5) Die Standardlieferform von Serientypen beinhaltet eine Familiengruppe. Einzelne Gruppen sind nicht erhältlich. In einer Verpackungseinheit / Gurt ist immer nur eine Gruppe pro Farbe enthalten. Dimmverhältnis im Gleichstrom-Betrieb max. 5:1 für amber Note: -78 Total color tolerance range, delivery in single groups (please see page 5) The standard shipping format for serial types includes a family group. Individual groups are not available. No packing unit / tape ever contains more than one luminous intensity group per color. Dimming range for direct current mode max. 5:1 for amber
2002-05-24
2
LATB T66B
Grenzwerte Maximum Ratings Bezeichnung Parameter Betriebstemperatur Operating temperature range Lagertemperatur Storage temperature range Sperrschichttemperatur Junction temperature Durchlassstrom Forward current Stoßstrom Surge current tp = 10 µs, D = 0.005 Sperrspannung Reverse voltage Leistungsaufnahme Power consumption Wärmewiderstand Thermal resistance Sperrschicht/Umgebung 1 chip on Junction/ambient 3 chips on Sperrschicht/Lötpad 1 chip on Junction/solder point 3 chips on Montage auf PC-Board FR 4 (Padgröße ≥ 16 mm 2) mounted on PC board FR 4 (pad size ≥ 16 mm 2) Symbol Symbol LA Werte Values LT LB °C °C °C mA A – 40 … + 100 – 40 … + 100 + 125 70 0.10 + 125 30 0.25 + 110 30 0.20 Einheit Unit
Top Tstg Tj IF IFM
VR Ptot
5 180
5 140
5 140
V mW
Rth JA Rth JA Rth JS Rth JS
480 770 260 420
530 820 310 470
530 820 310 470
K/W K/W K/W K/W
2002-05-24
3
LATB T66B
Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Wellenlänge des emittierten Lichtes Wavelength at peak emission IF = 20 mA Dominantwellenlänge 1) Dominant wavelength IF = 20 mA Spektrale Bandbreite bei 50 % Irel max Spectral bandwidth at 50 % Irel max IF = 20 mA Abstrahlwinkel bei 50 % IV (Vollwinkel) Viewing angle at 50 % IV Durchlassspannung 2) Forward voltage IF = 20 mA Sperrstrom Reverse current VR = 5 V Temperaturkoeffizient von λpeak Temperature coefficient of λpeak IF =20 mA; –10°C ≤ T ≤ 100°C Temperaturkoeffizient von λdom Temperature coefficient of λdom IF = 20 mA; –10°C ≤ T ≤ 100°C Temperaturkoeffizient von VF Temperature coefficient of VF IF = 20 mA; –10°C ≤ T ≤ 100°C Optischer Wirkungsgrad Optical efficiency IF = 20 mA
1)
Symbol Symbol LA (typ.)
Werte Values LT 523 LB 465 628
Einheit Unit nm
λpeak λdom ∆λ
(typ.)
617 528 –2 / +7 ± 9 16 33
470 ±6 25
nm
(typ.)
nm
(typ.) (min.) (typ.) (max.) (typ.) (max.) (typ.)
2ϕ
120
120
120
Grad deg. V V V
VF VF VF IR IR TCλpeak
2.0 2.4 0.01 10 0.13
3.5 4.3 0.01 10 0.04
3.8 4.3 0.01 10 0.05
µA µA
nm/K
(typ.)
TCλdom
0.06
0.03
0.04
nm/K
(typ.)
TCV
– 1.8
– 3.6
– 3.1
mV/K
(typ.)
ηopt
24
13
3
lm/W
Wellenlängen werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von ±1 nm ermittelt. Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of ±1 nm. Spannungswerte werden mit einer Stromeinprägedauer von 1 ms und einer Genauigkeit von ±0,1 V ermittelt. Voltages are tested at a current pulse duration of 1 ms and a tolerance of ±0.1 V.
2)
2002-05-24
4
LATB T66B
1)
Wellenlängengruppen / Wavelength groups
Gruppe Group 7 8
true green min. 519 528 528 537
Einheit max. Unit nm nm Lichtstrom Luminous Flux Lichtstärke Luminous Intensity Lichtstrom Luminous Flux Lichtstärke Luminous Intensity Lichtstrom Luminous Flux
Lichtgruppe Luminous Intensity Group
Lichtstärke Luminous Intensity
IV (mcd)
S+S+P S+S+Q S+T+P S+T+Q T+S+P T+S+Q T+T+P T+T+Q 180 ... 280 180 ... 280 180 ... 280 180 ... 280 280 ... 450 280 ... 450 280 ... 450 280 ... 450
ΦV (mlm)
amber 680 (typ.) 680 (typ.) 680 (typ.) 680 (typ.) 1075 (typ.) 1075 (typ.) 1075 (typ.) 1075 (typ.)
IV (mcd)
180 ... 280 180 ... 280 280 ... 450 280 ... 450 180 ... 280 180 ... 280 280 ... 450 280 ... 450
ΦV (mlm)
680 (typ.) 680 (typ.) 1075 (typ.) 1075 (typ.) 680 (typ.) 680 (typ.) 1075 (typ.) 1075 (typ.)
IV (mcd)
45 ... 71 ... 45 ... 71 ... 45 ... 71 ... 45 ... 71 ... 71 112 71 112 71 112 71 112
ΦV (mlm)
blue 95 (typ.) 270 (typ.) 95 (typ.) 270 (typ.) 95 (typ.) 270 (typ.) 95 (typ.) 270 (typ.)
true green
Helligkeitswerte werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von ±11 % ermittelt. Luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of ±11 %.
Gruppenbezeichnung auf Etikett Group Name on Label Beispiel: T-1+S-7+P-1 Example: T-1+S-7+P-1 Lichtgruppe Wellenlänge Lichtgruppe (keine Gruppierung) Luminous Wavelength (no grouping) Intensity (amber) Group (true green) 1 S Wellenlänge Lichtgruppe Wellenlänge (keine Gruppierung) Wavelength (no grouping) (blue) 1
Luminous Intensity Group (amber) T
Wavelength (true green) 7
Luminous Intensity Group (blue) P
2002-05-24
5
LATB T66B
Relative spektrale Emission Irel = f (λ), TA = 25 °C, IF = 20 mA Relative Spectral Emission V(λ) = spektrale Augenempfindlichkeit Standard eye response curve
100
OHL01452
I rel
% 80
Vλ
60
40
blue
true green
amber
20
0 350
400
450
500
550
600
650
nm 700
λ
Abstrahlcharakteristik Irel = f (ϕ) Radiation Characteristic
40˚ 30˚ 20˚ 10˚ 0˚
OHL01660
ϕ
1.0
50˚
0.8
0.6 60˚ 0.4 70˚ 0.2 80˚ 90˚ 100˚ 1.0 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚ 0
2002-05-24
6
LATB T66B
Durchlassstrom IF = f (VF) Forward Current TA = 25 °C
10 2
OHL00444
Relative Lichtstärke IV/IV(20 mA) = f (IF) Relative Luminous Intensity TA = 25 °C
10 1
OHL01473
IF mA
10 1 5
IV IV (20 mA)
10 0 5
10 0 5
10 -1 5 blue amber true green
10 -1 5
10 -2 5
10 -2 1.4
1.6
1.8
2.0
2.2 V 2.4
10 -3 -1 10
5 10 0
5 10 1
mA 10 2
VF
Durchlassstrom IF = f (VF) Forward Current TA = 25 °C
10 2 mA 5
OHL01481
IF
Relative Lichtstärke IV/IV(25 °C) = f (TA) Relative Luminous Intensity IF = 20 mA
1.2
OHL01477
IF
IV IV (25 ˚C)
10 1 5
0.8
0.6
blue true green 10 0 5
amber true green blue
0.4
0.2
10 -1
2
2.5
3
3.5
4
4.5 V 5
0
VF
2002-05-24 7
0
20
40
60
80 ˚C 100
TA
LATB T66B
Maximal zulässiger Durchlassstrom IF = f (T) Max. Permissible Forward Current 1 chip on
80 mA IF 70 60 50 40 30 blue 20 10 true green
20 10
OHL01612
Maximal zulässiger Durchlassstrom IF = f (T) Max. Permissible Forward Current 3 chips on
80 mA IF 70 60 50 40 30 true green blue amber
OHL01609
amber
TA temp. ambient
0 0 20 40 60 80 ˚C 100
0 0
TA temp. ambient
20 40 60 80 ˚C 100
T Maximal zulässiger Durchlassstrom IF = f (T) Max. Permissible Forward Current 1 chip on
80 mA IF 70 60 50 40 30 20 10 blue true green
OHL01610
T Maximal zulässiger Durchlassstrom IF = f (T) Max. Permissible Forward Current 3 chips on
80 mA IF 70 60 50 40 30 20 10 amber
OHL01607
amber
true green blue
TS temp. solder point
0 0 20 40 60 80 ˚C 100
0 0
TS temp. solder point
20 40 60 80 ˚C 100
T
2002-05-24 8
T
LATB T66B
Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 25 °C amber (1 Chip on)
0.12 A
OHL01505
Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 85 °C amber (1Chip on)
0.12 A
OHL01604
IF
0.1 0.005 0.05 0.5
IF
0.10
0.08
0.08
0.06
0.06
0.04
0.04
0.005 0.05 0.5
0.02
0.02
0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102
0 -5 10 10-4 10-3 10-2 10-1 10 0 101 s 10 2
tp
Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 25 °C amber (3 Chips on)
0.12
OHL00193
tp
Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 85 °C amber (3 Chips on)
0.12 A
OHL01606
IF
A 0.10
IF
0.10
0.08
0.06
0.005 0.05 0.5
0.08
0.06
0.04
0.04
0.02
0.02
0.005 0.05 0.5
0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102
tp
2002-05-24 9
0 -5 10 10-4 10-3 10-2 10-1 10 0 101 s 10 2
tp
LATB T66B
Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 25 °C true green (1 Chip on)
0.30
OHL01400
Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 85 °C true green (1 Chip on)
0.30
OHL01584
IF
A
IF
A
0.25
0.25
P D=T
t
tP
IF T
0.20
D=
0.005 0.01 0.02 0.05 0.1 0.2 0.5
0.20
0.15
0.15
D=
0.1 0.10 0.2 0.005 0.01 0.02 0.05
0.10
0.05
0.05 0.5
0 -5 10 10-4 10-3 10-2 10-1 10 0 101 s 10 2
0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102
tp
tp
Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 85 °C true green (3 Chips on)
0.10
OHL01575
Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 25 °C true green (3 Chips on)
0.30
OHL01586
IF
A
0.25
D=T
tP
tP
IF T
IF
A
D=T
tP
tP
IF T
0.20
D=
0.15 0.1 0.005 0.01 0.02 0.05
0.05
D=
0.1 0.2 0.5 0.005 0.01 0.02 0.05
0.10 0.2
0.05 0.5
0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102
tp
2002-05-24 10
0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102
tp
LATB T66B
Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 25 °C blue (1 Chip on)
0.30
OHL01405
Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 85 °C blue (1 Chip on)
0.30
OHL01579
IF
A
0.25
D = TP
t
tP
IF T
IF
A
0.25
D=T
tP
tP
IF T
0.20
0.20
D=
0.15 0.005 0.01 0.02 0.05 0.1 0.2 0.5
0.15
D=
0.10 0.2 0.05 0.5 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 0.005 0.01 0.02 0.05 0.1
0.10
0.05
0 -5 10 10 -4 10 -3 10 -2 10 -1 10 0 10 1 s 10 2
tp
tp
Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 85 °C blue (3 Chips on)
0.10
OHL01577
Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TA= 25 °C blue (3 Chips on)
0.30
OHL01576
IF
A
0.25
D=T
tP
tP
IF T
IF
A
D=T
tP
tP
IF T
0.20
0.15 0.1 0.10 0.2 0.05 0.5
D=
0.005 0.01 0.02 0.05
0.05
D=
0.005 0.01 0.02 0.05 0.1 0.2
0.5
0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102
tp
2002-05-24 11
0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102
tp
LATB T66B
0.9 520 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 a) 530 540 550 560 570 580 590 600 610 620 630
OHA02290
+
0.8
0.9
Die Farbkoordinaten des Mischlichtes können innerhalb des mit a) gekennzeichneten Bereichs des Farbdreiecks erwartet werden.Der Unbuntpunkt (x = 0,33, y = 0,33) ist mit „+“ gekennzeichnet. The color coordinates of the mixed light can be expected within the area of the color triangle marked a). The achromatic point (x = 0.33, y = 0.33) is marked „+“.
2002-05-24
12
LATB T66B
Maßzeichnung Package Outlines
3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 2.1 (0.083) 0.8 (0.031) 0.6 (0.024)
2.1 (0.083) 1.7 (0.067) 0.9 (0.035) 0.7 (0.028)
2
3.4 (0.134) 3.0 (0.118)
3
(2.4 (0.094)) 3.7 (0.146) 3.3 (0.130) 4˚±1
0.1 (0.004) typ
1.1 (0.043)
0.5 (0.020)
1 4 Package marking
0.18 (0.007)
0.6 (0.024) 0.4 (0.016)
GPLY6900
1 2 3 4
Cathode Anode Cathode Cathode
Amber (A) A, T, B Blue (B) True Green (T)
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Gewicht / Approx. weight: 34 mg
2002-05-24
13
LATB T66B
Lötbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Conditions Preconditioning acc. to JEDEC Level 2
IR-Reflow Lötprofil (nach IPC 9501) IR Reflow Soldering Profile (acc. to IPC 9501)
300 ˚C
OHLY0597
T
250
240-245 ˚C 10-40 s 183 ˚C 120 to 180 s Ramp-down rate up to 6 K/s Defined for Preconditioning: up to 6 K/s Ramp-up rate up to 6 K/s
200
150
100
50 Defined for Preconditioning: 2-3 K/s 0 0 50 100 150 200 s 250
t
2002-05-24
14
LATB T66B
Wellenlöten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802)
300 C T 250 235 C ... 260 C
OHLY0598
10 s
Normalkurve standard curve 2. Welle 2. wave Grenzkurven limit curves
200 1. Welle 1. wave 150 100 C ... 130 C 100 2 K/s 50 Zwangskühlung forced cooling ca 200 K/s 5 K/s 2 K/s
0 0 50 100 150 t 200 s 250
2002-05-24
15
LATB T66B
Empfohlenes Lötpaddesign Recommended Solder Pad IR Reflow Löten IR Reflow Soldering
3.3 (0.130) 2.6 (0.102) 1.1 (0.043)
3.3 (0.130) 0.4 (0.016)
1.5 (0.059)
0.5 (0.020)
Kathoden Markierung / Cathode marking Lötstoplack Solder resist
16
4.5 (0.177)
Padgeometrie für verbesserte Wärmeableitung Paddesign for improved heat dissipation
_ Cu Fläche / < 12 mm 2 per pad Cu-area
7.5 (0.295)
OHLPY439
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
2002-05-24
LATB T66B
Empfohlenes Lötpaddesign Recommended Solder Pad Wellenlöten (TTW) TTW Soldering
1.5 (0.059)
C C C A
OHAY0095
3.5 (0.138)
3.5 (0.138)
2.8 (0.110)
2 (0.079)
6.1 (0.240)
3 (0.118)
2 (0.079)
1 (0.039)
2.8 (0.110) Padgeometrie für verbesserte Wärmeableitung Paddesign for improved heat dissipation
0.5 (0.020)
7.5 (0.295) Cu Fläche / > 12 mm 2 per pad Cu-area Lötstoplack Solder resist
OHAY0583
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Verpackungseinheit 2000/Rolle, ø180 mm oder 8000/Rolle, ø330 mm Method of Taping / Polarity and Orientation Packing unit 2000/reel, ø180 mm or 8000/reel, ø330 mm
Gurtung / Polarität und Lage
1.5 (0.059)
4 (0.157)
2 (0.079)
1.75 (0.069)
2.9 (0.114)
4 (0.157)
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
2002-05-24
17
3.6 (0.142)
3.5 (0.138)
8 (0.315)
Bewegungsrichtung der Platine PCB-direction
2 (0.079)
6 (0.236)
8 (0.315)
LATB T66B
Revision History: 2002-05-24 Previous Version: Page 1 2 5 2001-11-30 Subjects (major changes since last revision) ESD-withstand voltage ordering informaion grouping information
Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-93049 Regensburg © All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2002-05-24
18