SFH4000

Schnelle IR-Lumineszenzdiode High Speed Infrared Emitter SFH 4000 Wesentliche Merkmale • Hohe Ausgangsleistung: 35mW • Sehr kleines Gehäuse: (LxBxH) 1,7 mm x 0,8 mm x 0,65 mm • Sehr kurze Schaltzeiten (10ns) • Hohe Impulsbelastbarkeit • IR Reflow Löten geeignet • Gegurtet lieferbar Anwendungen • Miniaturlichtschranken für Gleich- und Wechsellichtbetrieb, Lochstreifenleser • Industrieelektronik • „Messen/Steuern/Regeln“ • Sensorik • Alarm- und Sicherungssysteme • IR-Freiraumübertragung Typ Type SFH 4000 1) Features • High output power: 35mW • Very small package: (LxWxH) 1.7 mm x 0.8 mm x 0.65 mm • Very short switching times (10ns) • High pulse handling capability • Suitable for IR reflow soldering • Available on tape and reel Applications • • • • • • Miniature photointerrupters Industrial electronics For drive and control circuits Sensor technology Alarm and safety equipment IR free air transmission Bestellnummer Ordering Code Q62702P5524 Strahlstärkegruppierung 1) (IF = 100 mA, tp = 20 ms) Radiant intensity grouping 1) Ie (mW/sr) > 1.6 (typ. 4.4) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr 2004-01-28 1 SFH 4000 Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Durchlaßstrom Forward current Stoßstrom, τ = 10 µs, D = 0 Surge current Verlustleistung Power dissipation Symbol Symbol Wert Value – 40 … + 100 3 100 2.2 180 450 Einheit Unit °C V mA A mW K/W Top; Tstg VR IF IFSM Ptot Wärmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgröße je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Wärmewiderstand Sperrschicht - Lötstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block ≈ 250 K/W 2004-01-28 2 SFH 4000 Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Wellenlänge der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 m A Abstrahlwinkel Half angle Aktive Chipfläche Active chip area Abmessungen der aktiven Chipfläche Dimensions of the active chip area Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Ω Switching times, Ιe from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Ω Kapazität, Capacitance VR = 0 V, f = 1 MHz Durchlaßspannung, Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 µs Sperrstrom, Reverse current VR = 3 V Gesamtstrahlungsfluß, Total radiant flux IF = 100 mA, tp = 20 ms Temperaturkoeffizient von Ie bzw. Φe, Symbol Symbol λpeak Wert Value 950 Einheit Unit nm ∆λ 40 nm ϕ ± 80 0.09 0.3 × 0.3 10 Grad deg. mm2 mm ns A L×B L×W tr, tf Co 15 pF VF VF IR 1.5 (≤ 1.8) 3.2 (≤ 4.3) 0.01 (≤ 1) V V µA Φe 35 mW TCI – 0.44 %/K IF = 100 mA Temperature coefficient of Ie or Φe, IF = 100 mA Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA Temperaturkoeffizient von λ, IF = 100 mA Temperature coefficient of λ, IF = 100 mA 2004-01-28 TCV TCλ – 1.5 + 0.2 mV/K nm/K 3 SFH 4000 Strahlstärke Ie in Achsrichtung gemessen bei einem Raumwinkel Ω = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Strahlstärke Radiant intensity IF = 100 mA, tp = 20 ms Strahlstärke Radiant intensity IF = 1 A, tp = 100 µs Symbol Ie min Ie typ Ie typ Werte Values 1.6 4.4 20 Einheit Unit mW/sr mW/sr mW/sr 2004-01-28 4 SFH 4000 Relative Spectral Emission Irel = f (λ) 100 OHF00777 Radiant Intensity Ιe = f (IF ) Ιe 100 mA OHF00809 Single pulse, tp = 20 µs 10 2 Ιe Ι e (100 mA) Max. Permissible Forward Current IF = f (T A ) 2004-01-28 120 OHR00883 Ι erel 80 Ι F mA 100 80 60 10 0 60 R thjA = 450 K/W 40 10 -1 40 20 10 -2 20 0 800 850 900 950 1000 nm 1100 λ 10 -3 10 0 10 1 10 2 10 3 mA 10 4 ΙF 0 0 20 40 60 80 100 ˚C 120 TA IF = f (VF) single pulse, tp = 20 µs 10 4 mA 10 3 10 2 10 1 OHF00784 Forward Current Permissible Pulse Handling Capability IF = f (τ), TA = 25 °C, duty cycle D = parameter IF 10 1 A 5 OHF00040 ΙF P D= T t tP IF T D= 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 10 0 10 0 5 10 -1 10 -2 10 -3 0 0.5 1 1.5 2 2.5 3 3.5 V 4.5 10 -1 -5 10 10 -4 10 -3 10 -2 10 -1 10 0 10 1 s 10 2 VF tp Radiation Characteristics Irel = f (ϕ) 40˚ 30˚ 20˚ ϕ 10˚ 0˚ 1.0 OHF00614 50˚ 0.8 60˚ 0.6 70˚ 0.4 80˚ 90˚ 0.2 0 100˚ 1.0 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚ 2004-01-28 5 SFH 4000 Maßzeichnung Package Outlines 0.8 (0.031) ±0.1 (0.004) (0.002) 0.125 (0.005) +0.05(0.001) -0.03 1.7 (0.067) ±0.1 (0.004) 0.3 (0.012) Package marking Package marking (0.001) 0.65 (0.026) +0.02(0.002) -0.05 GPLY6089 Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). Package Colour Epoxy, SmartLED (SCD 80) colourless, light diffused Package marking Anode 2004-01-28 6 1.3 (0.051) ±0.1 (0.004) 7˚ max 5˚ SFH 4000 IR-Reflow Lötprofil (nach IPC 9501) IR Reflow Soldering profile (acc. to IPC 9501) 250 ˚C OHLA0685 Tmax = 245 ˚C T 200 T = 183 ˚C t = 70 s 150 2-3 K/s 100 2-3 K/s 50 0 0:00 0:30 1:00 1:30 2:00 2:30 3:00 3:30 4:00 4:30 5:00 min 5:30 t Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-93049 Regensburg © All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2004-01-28 7