SFH4080

IR-Lumineszenzdiode Infrared Emitter Lead (Pb) Free Product - RoHS Compliant SFH 4080 Nicht für Neuentwicklungen / not for new designs Wesentliche Merkmale • Sehr kleines Gehäuse: (LxBxH) 1,7 mm x 0,8 mm x 0,65 mm • Typische Peakwellenlänge 880 nm • Gegurtet lieferbar Anwendungen • Miniaturlichtschranken für Gleich- und Wechsellichtbetrieb, Lochstreifenleser • Industrieelektronik • „Messen/Steuern/Regeln“ • Sensorik • Alarm- und Sicherungssysteme • IR-Freiraumübertragung Typ Type SFH 4080 1) Features • Very small package: (LxWxH) 1.7 mm x 0.8 mm x 0.65 mm • Typical Peakwavelength 880 nm • Available on tape and reel Applications • • • • • • Miniature photointerrupters Industrial electronics For drive and control circuits Sensor technology Alarm and safety equipment IR free air transmission Bestellnummer Ordering Code Q65110A1217 Strahlstärkegruppierung1) (IF = 100 mA, tp = 20 ms) Radiant Intensity Grouping1) Ie (mW/sr) > 1.0 (typ. 2.5) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr 2007-03-30 1 SFH 4080 Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Durchlassstrom Forward current Stoßstrom, τ = 10 μs, D = 0 Surge current Verlustleistung Power dissipation Symbol Symbol Wert Value – 40 … + 100 5 100 2.5 180 450 Einheit Unit °C V mA A mW K/W Top; Tstg VR IF IFSM Ptot Wärmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgröße je 5 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 5 mm2 each Wärmewiderstand Sperrschicht - Lötstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block ≈ 250 K/W 2007-03-30 2 SFH 4080 Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Wellenlänge der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 m A Abstrahlwinkel Half angle Aktive Chipfläche Active chip area Abmessungen der aktiven Chipfläche Dimensions of the active chip area Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Ω Switching times, Ιe from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Ω Kapazität Capacitance VR = 0 V, f = 1 MHz Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 μs Sperrstrom Reverse current VR = 5 V Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms Symbol Symbol λpeak Wert Value 880 Einheit Unit nm Δλ 80 nm ϕ ± 80 0.09 0.3 × 0.3 0.5 Grad deg. mm2 mm² μs A L×B L×W tr , tf Co 15 pF VF VF IR 1.5 (≤ 1.8) 3.0 (≤ 3.8) 0.01 (≤ 1) V V μA Φe 23 mW Temperaturkoeffizient von Ie bzw. Φe, TCI IF = 100 mA Temperature coefficient of Ie or Φe, IF = 100 mA Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA Temperaturkoeffizient von λ, IF = 100 mA Temperature coefficient of λ, IF = 100 mA 2007-03-30 – 0.5 %/K TCV TCλ –2 + 0.25 mV/K nm/K 3 SFH 4080 Strahlstärke Ie in Achsrichtung gemessen bei einem Raumwinkel Ω = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Strahlstärke Radiant intensity IF = 100 mA, tp = 20 ms Strahlstärke Radiant intensity IF = 1 A, tp = 100 μs Symbol Ie min Ie typ Ie typ Werte Values 1.0 2.5 22 Einheit Unit mW/sr mW/sr mW/sr 2007-03-30 4 SFH 4080 Relative Spectral Emission Irel = f (λ) 100 Ι rel % 80 OHR00877 Radiant Intensity Ιe = f (IF) Ιe 100 mA OHR00878 Single pulse, tp = 20 μs 10 2 Ι e (100mA) 10 1 Ιe Max. Permissible Forward Current IF = f (TA) 120 OHR00883 Ι F mA 100 80 60 10 0 R thjA = 450 K/W 60 40 10 -1 40 20 10 -2 20 0 750 10 -3 0 10 0 10 1 10 2 10 3 mA 10 4 ΙF 800 850 900 950 nm 1000 λ 0 20 40 60 80 100 ˚C 120 TA Forward Current IF = f (VF) single pulse, tp = 20 μs 10 1 OHR00881 Permissible Pulse Handling Capability IF = f (tp), TA = 25 °C duty cycle D = parameter 10 4 mA OHR00886 ΙF A ΙF 0 10 D = 0.005 0.01 0.02 0.05 10 3 0.1 0.2 10 -1 0.5 10 2 DC tp 10 -2 D= tp T ΙF T 10 -3 0 1 2 3 4 5 6 V VF 8 10 1 -5 10 10 -4 10 -3 10 -2 10 -1 10 0 10 1 s 10 2 tp Radiation Characteristics Sel = f (ϕ) 40˚ 30˚ 20˚ ϕ 10˚ 0˚ 1.0 OHF00614 50˚ 0.8 60˚ 0.6 70˚ 0.4 80˚ 90˚ 0.2 0 100˚ 1.0 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚ 2007-03-30 5 SFH 4080 Maßzeichnung Package Outlines 0.8 (0.031) ±0.1 (0.004) (0.002) 0.125 (0.005) +0.05(0.001) -0.03 1.7 (0.067) ±0.1 (0.004) 0.3 (0.012) Package marking Package marking (0.001) 0.65 (0.026) +0.02(0.002) -0.05 GPLY6089 Maße in mm (inch) / Dimensions in mm (inch). Package Colour Epoxy, SmartLED (SCD 80) colourless, light diffused Package marking Anode Empfohlenes Lötpaddesign Recommended Solderpad Design 1.45 (0.057) 0.35 (0.014) 0.35 (0.014) OHPY1301 Maße in mm (inch) / Dimensions in mm (inch). 2007-03-30 6 1.3 (0.051) ±0.1 (0.004) 7˚ max 5˚ SFH 4080 Lötbedingungen Soldering Conditions Reflow Lötprofil für bleifreies Löten Reflow Soldering Profile for lead free soldering 300 ˚C 255 ˚C 240 ˚C 217 ˚C 200 30 s max 150 120 s max 100 Ramp Up 3 K/s (max) 25 ˚C 0 0 50 100 150 200 250 s 300 100 s max Ramp Down 6 K/s (max) 10 s min Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020C) (acc. to J-STD-020C) OHLA0687 T 250 Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile ˚C 260 ˚C +0˚C -5 245 ˚C ±5 ˚C ˚C 235 ˚C +5˚C -0 50 t Wellenlöten (TTW) TTW Soldering 300 C T 250 235 C ... 260 C 2. Welle 2. wave 200 1. Welle 1. wave 150 100 C ... 130 C 100 2 K/s 50 Zwangskühlung forced cooling ca 200 K/s 5 K/s 2 K/s (nach CECC 00802) (acc. to CECC 00802) OHLY0598 10 s Normalkurve standard curve Grenzkurven limit curves 0 0 50 100 150 t 200 s 250 2007-03-30 7 SFH 4080 Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-03-30 8