SFH4271

IR-Lumineszenzdiode Infrared Emitter SFH 4271 Wesentliche Merkmale • Schwarz eingefärbtes TOPLED-Gehäuse • Typische Emissionswellenlänge 880nm • Verbesserte Abbildungseigenschaften durch Absorption der Seitenstrahlung • Größe der Leuchtquelle 300µm x 300µm • IR Reflow und TTW Löten geeignet • Feuchte-Empfindlichkeitsstufe 2 nach JEDEDC Standard J-STD-020A Anwendungen • Miniaturlichtschranken und Lichtschranken über große Entfernungen • Industrieelektronik • „Messen/Steuern/Regeln“ • Automobiltechnik • Sensorik • Alarm- und Sicherungssysteme • IR-Freiraumübertragung Typ Type SFH 4271 1) Features • Black coloured TOPLED-package • Typical Peakwavelength 880nm • Improved imaging characteristics due to absorption of side emission • Size of emitting area 300µm x 300µm • Suited for IR Reflow and TTW-soldering • Moisture sensitivity level 2 according to JEDEDC Standard J-STD-020A Applications • • • • • • • Miniature and long distance photointerrupters Industrial electronics For drive and control circuits Automotive technology Sensor technology Alarm and safety equipment IR free air transmission Bestellnummer Ordering Code Q65110A1013 Strahlstärkegruppierung 1) (IF = 100 mA, tp = 20 ms) Radiant intensity grouping 1) Ie (mW/sr) 1 ... 5 gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr 2004-01-23 1 SFH 4271 Grenzwerte (TA = 25 ° C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Durchlaßstrom Forward current Stoßstrom, τ = 10 µs, D = 0 Surge current Verlustleistung Power dissipation Symbol Symbol Wert Value – 40 …+ 100 5 100 2.5 180 450 Einheit Unit °C V mA A mW K/W Top; Tstg VR IF IFSM Ptot Wärmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgröße je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each RthJS Wärmewiderstand Sperrschicht - Lötstelle bei Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block ≈ 200 K/W 2004-01-23 2 SFH 4271 Kennwerte (TA = 25 ° C) Characteristics Bezeichnung Parameter Wellenlänge der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA Abstrahlwinkel Half angle Aktive Chipfläche Active chip area Abmessungen der aktiven Chipfläche Dimensions of the active chip area Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Ω Switching times, Ι e from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Ω Kapazität, Capacitance VR = 0 V, f = 1 MHz Durchlaßspannung, Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 µs Sperrstrom, Reverse current VR = 5 V Gesamtstrahlungsfluß, Total radiant flux IF = 100 mA, tp = 20 ms Temperaturkoeffizient von Ie bzw. Φe, Symbol Symbol λ peak Wert Value 880 Einheit Unit nm ∆λ 80 nm ϕ ± 60 0.09 0.3 × 0.3 0.5 Grad deg. mm2 mm µs A L× B L× W tr , tf Co 15 pF VF VF IR 1.5 (≤1.8) 3.0 (≤3.8) 0.01 (≤1) V V µA Φe 5 mW TCI – 0.5 %/K IF = 100 mA Temperature coefficient of Ie or Φe, IF = 100 mA Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA Temperaturkoeffizient von λ, IF = 100 mA Temperature coefficient of λ , IF = 100 mA 2004-01-23 TCV TCλ –2 + 0.25 mV/K nm/K 3 SFH 4271 Strahlstärke Ie in Achsrichtung gemessen bei einem Raumwinkel Ω = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Strahlstärke Radiant intensity IF = 100 mA, tp = 20 ms Strahlstärke Radiant intensity IF = 1 A, tp = 100 µs Symbol -L Ie min Ie max Ie typ 1 2 16 Werte Values -M 1.6 3.2 20 -N 2.5 5.0 24 mW/sr Einheit Unit mW/sr 2004-01-23 4 SFH 4271 Relative Spectral Emission Irel = f (λ) 100 Ι rel % 80 OHR00877 Radiant Intensity Ιe = f (IF) Ι e 100 mA OHR00878 Single pulse, tp = 20 µs 10 2 Ι e (100mA) 10 1 Ιe Max. Permissible Forward Current IF = f (TA) 120 OHR00883 Ι F mA 100 80 60 10 0 R thjA = 450 K/W 60 40 10 -1 40 20 10 -2 20 0 750 10 -3 0 10 0 10 1 10 2 10 3 mA 10 4 ΙF 800 850 900 950 nm 1000 λ 0 20 40 60 80 100 ˚C 120 TA IF = f (VF) single pulse, tp = 20 µs 10 1 OHR00881 Forward Current Permissible Pulse Handling Capability IF = f (tp), TA = 25 ° C duty cycle D = parameter 10 4 mA OHR00886 ΙF A ΙF 0 10 D = 0.005 0.01 0.02 0.05 10 3 0.1 0.2 10 -1 0.5 10 2 DC tp 10 -2 D= tp T ΙF T 10 -3 0 1 2 3 4 5 6 V VF 8 10 1 -5 10 10 -4 10 -3 10 -2 10 -1 10 0 10 1 s 10 2 tp Radiation Characteristics Sel = f (ϕ) 40˚ 30˚ 20˚ 10˚ 0˚ OHL01660 ϕ 1.0 50˚ 0.8 0.6 60˚ 0.4 70˚ 0.2 80˚ 90˚ 100˚ 1.0 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚ 0 2004-01-23 5 SFH 4271 Maßzeichnung Package Outlines 3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 2.1 (0.083) 2.1 (0.083) 1.7 (0.067) 0.1 (0.004) (typ) 0.9 (0.035) 0.7 (0.028) 4˚±1 (2.4 (0.094)) 3.4 (0.134) 3.0 (0.118) 0.18 (0.007) Anode marking 0.12 (0.005) 1.1 (0.043) 0.5 (0.020) 0.6 (0.024) 0.4 (0.016) GPLY6059 Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). Gehäusefarbe: schwarz, Verguss klar Brechungsindex Verguss: 1.53 Package Colour: black, resin colourless clear Refractive index resin: 1.53 2004-01-23 6 3.7 (0.146) 3.3 (0.130) SFH 4271 Lötbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Conditions Preconditioning acc. to JEDEC Level 2 IR-Reflow Lötprofil (nach IPC 9501) IR Reflow Soldering Profile (acc. to IPC 9501) OHLY0597 300 C T 250 240-245 C 10-40 s 183 C 120 to 180 s 150 200 ramp-down rate up to 6 K/s defined for Preconditioning: up to 6 K/s ramp-up rate up to 6 K/s 100 50 defined for Preconditioning: 2-3 K/s 0 0 50 100 150 t 200 s 2 2004-01-23 7 SFH 4271 Wellenlöten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) 300 C T 250 235 C ... 260 C OHLY0598 10 s Normalkurve standard curve 2. Welle 2. wave Grenzkurven limit curves 200 1. Welle 1. wave 150 100 C ... 130 C 100 2 K/s 50 Zwangskühlung forced cooling ca 200 K/s 5 K/s 2 K/s 0 0 50 100 150 t 200 s 250 2004-01-23 8 SFH 4271 Empfohlenes Lötpaddesign Recommended Solder Pad IR-Reflow Löten IR Reflow Soldering 2.6 (0.102) 1.5 (0.059) 4.5 (0.177) 2.6 (0.102) Padgeometrie für verbesserte Wärmeableitung Paddesign for improved heat dissipation Lötstopplack Solder resist Cu-Fläche > 16 mm 2 Cu-area > 16 mm 2 OHLPY970 Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch) Gehäuse für Wellenlöten (TTW) geeignet / Package suitable for TTW-soldering Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). 2004-01-23 9 1.5 (0.059) 4.5 (0.177) SFH 4271 Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-93049 Regensburg © All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. All typical data and graphs have been determined on a sample base and don't represent the whole production range. For technical improvements, the typical data may be changed without any further notice. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2004-01-23 10