SFH4730

Ostar Observation Lead (Pb) Free Product - RoHS Compliant SFH 4730, SFH 4740 SFH 4730 SFH 4740 SFH 4740 SFH 4730 • Schwarzer Rahmen zur Streulichtminimierung • 3 W optische Leistung SFH 4740 • Weißer Rahmen für hohe Lichtleistung • 3.6 W optische Leistung Wesentliche Merkmale • • • • • • Aktive Chipfläche 2.1 x 5.4 mm2 max. Gleichstrom 1 A niedriger Wärmewiderstand (2.8 K/W) Emissionswellenlänge 850 nm ESD-sicher bis 2 kV nach JESD22-A114-B Augensicherheitsrichtlinien der IEC-Normen 60825-1 und 62471 müssen beachtet werden. SFH 4730 • Black frame to minimize scattered light • 3 W optical power SFH 4740 • White frame to achieve high optical power • 3.6 W optical power Features • • • • • • Active chip area 2.1 x 5.4 mm2 max. DC-current 1 A Low thermal resistance (2.8 K/W) Spectral emission at 850 nm ESD save up to 2 kV acc. to JESD22-A114-B Eye safety precautions given in IEC 60825-1 and IEC 62471 have to be followed. Anwendungen • • • • Infrarotbeleuchtung für CMOS Kameras Überwachungssysteme IR-Datenübertragung Fahrer-Assistenz Systeme Applications • • • • Infrared Illumination for CMOS cameras Surveillance systems IR Data Transmission Driver assistance systems Typ Type SFH 4730 SFH 4740 1) Bestellnummer Ordering Code Q65110A5452 Q65110A6190 Strahlstärke1) (IF = 1A, tp = 20 ms) Radiant intensity1) Ιe (mW/sr) typ.1000 typ.1200 gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr. 2007-08-13 1 SFH 4730, SFH 4740 Grenzwerte Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrschichttemperatur Junction temperature Sperrspannung Reverse voltage Vorwärtsgleichstrom, TB1) ≤ 85 °C Forward current Stoßstrom, tp < 1 ms, D = 0.2, TB ≤ 85 °C Surge current Leistungsaufnahme, TB ≤ 85 °C Power consumption Thermische Verlustleistung, TB ≤ 85 °C Thermal power-dissipation Wärmewiderstand Sperrschicht / Bodenplatte Thermal resistance Junction / Base plate 1) Symbol Symbol Wert Value – 40 … + 125 + 145 0.5 1 2 24 21 2.8 Einheit Unit °C °C V A A W W K/W TB, op , TB, stg TJ VR IF IFSM Ptot Pth RthJB TB = Temperatur auf der Rückseite der Metallkernplatine / Temperature at the backside of the base plate. 2007-08-13 2 SFH 4730, SFH 4740 Kennwerte (TB = 25 °C) Characteristics Bezeichnung Parameter Wellenlänge der Strahlung Wavelength at peak emission IF = 1 A, tp = 10 ms Schwerpunkts-Wellenlänge der Strahlung Centroid wavelength IF = 1 A, tp = 10 ms Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 1 A, tp = 10 ms Abstrahlwinkel Half angle Abmessungen der aktiven Chipfläche1) Dimension of the active chip area Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, IF = 1 A, RL = 50 Ω Switching times, Ιe from 10% to 90% and from 90% to 10%, IF = 1 A, RL = 50 Ω Durchlassspannung Forward voltage IF = 1 A, tp = 100 µs Gesamtstrahlungsfluss Total radiant flux IF = 1 A, tp = 100 µs SFH 4730 SFH 4740 Temperaturkoeffizient von Ie bzw. Φe Temperature coefficient of Ie or Φe IF = 1 A, tp = 10 ms Temperaturkoeffizient von VF Temperature coefficient of VF IF = 1 A, tp = 10 ms Temperaturkoeffizient von λ Temperature coefficient of λ IF = 1 A, tp = 10 ms 1) Symbol Symbol λpeak Wert Value 850 Einheit Unit nm λcentroid 845 nm ∆λ 40 nm ϕ ± 60 2.1 × 5.4 10 Grad deg. mm² ns L×B L×W tr , tf VF 18 (≤ 24) V Φe Φe TCI 3 3.6 – 0.5 W W %/K TCV –2 mV/K TCλ,centroid + 0.2 nm/K Die aktive Chipfläche besteht aus 10 einzelnen Chips mit je 1 x 1 mm². The active chip area consists of 10 single chips with 1 x 1 mm² each. 2007-08-13 3 SFH 4730, SFH 4740 Strahlstärke1) Ιe Radiant Intensity1) Ιe Bezeichnung Parameter Symbol SFH 4730-EA Werte Values SFH 4730-EB SFH 4740-EB SFH 4740-FA Einheit Unit Strahlstärke Radiant Intensity IF = 1 A, tp = 20 ms 1) Ιe min Ιe max 630 1000 800 1250 800 1250 1000 1600 mW/sr mW/sr Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 1.6:1) Only one group in one packing unit (variation lower 1.6:1) Abstrahlcharakteristik Radiation Characteristics Irel = f (ϕ) 40˚ 30˚ 20˚ 10˚ 0˚ OHL01660 ϕ 1.0 50˚ 0.8 0.6 60˚ 0.4 70˚ 0.2 80˚ 90˚ 100˚ 1.0 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚ 0 2007-08-13 4 SFH 4730, SFH 4740 Relative spektrale Emission Relative Spectral Emission Irel = f (λ), TB = 25 °C 100 % OHL01714 Durchlassstrom Forward Current IF = f (VF), TB = 25 °C, Single pulse, tp = 100 µs IF 10 1 A OHF02930 Relativer Gesamtstrahlungsfluss Relative Total Radiant Flux Φe/Φe(1000mA) = f (IF), TB = 25 °C, Single pulse, tp = 100 µs Φe 101 OHF02931 Φe (1000 mA) 100 10 0 I rel 80 5 60 10-1 40 10 -1 5 10-2 20 5 0 700 750 800 850 nm 950 10 -2 10 12 14 16 18 20 V 22 10-3 1 10 5 10 2 5 10 3 mA 10 4 λ VF IF Max. zulässiger Durchlassstrom Max. Permissible Forward Current IF = f (TB), RthJB = 2.8 K/W 1200 mA OHF02973 Zulässige Impulsbelastbarkeit Permissible Pulse Handling Capability IF = f (tp), TB ≤ 85 °C, Duty cycle D = parameter 2.3 IF A 2.1 2.0 1.9 OHF02974 IF D = TP t tP IF T 800 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 D= 0.005 0.01 0.02 0.05 0.1 0.2 0.35 0.5 1 600 400 200 0 0 20 40 60 80 100 ˚C 130 TB 0.9 -6 -5 -4 -3 -2 -1 0 10 10 10 10 10 10 10 tp s 102 2007-08-13 5 SFH 4730, SFH 4740 SMD NTC Thermistor mit Nickel Barrier Termination, Typ 0603 SMD NTC Thermistor with Nickel Barrier Termination, Type 0603 No. of R/T characteristics EPCOS 8502 / A01 R25 [ Ω] 10k ± 5% B25/50 [K] 3940 B25/85 [K] 3980 B25/100 [K] 4000 Typische Thermistor Kennlinie Typical Thermistor Graph R 10 6 Ω OHL02893 10 5 5 10 4 5 10 3 5 10 2 -60 -20 20 60 100 ˚C 160 TNTC (www.epcos.com) 2007-08-13 6 SFH 4730, SFH 4740 Maßzeichnung und Ersatzschaltbild Package Outlines and equivalent circuit diagram Frame color: black for SFH4730 white for SFH4740 Maße in mm (inch) / Dimensions in mm (inch). Verwendeter Stecker / Used male connector on board: ERNI male connector SMD 214012, 4-pins (www.erni.com) Empfohlene Gegenstecker / Recommended female connector for power supply: ERNI female connector SMD 214025, 4-pins (www.erni.com) Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-08-13 7