SI8610BD-B-ISR

Si861x/2x Data Sheet Low-Power Single and Dual-Channel Digital Isolators KEY FEATURES Skyworks' family of ultra-low-power digital isolators are CMOS devices offering substantial data rate, propagation delay, power, size, reliability, and external BOM advantages over legacy isolation technologies. The operating parameters of these products remain stable across wide temperature ranges and throughout device service life for ease of design and highly uniform performance. All device versions have Schmitt trigger inputs for high noise immunity and only require VDD bypass capacitors. • High-speed operation • DC to 150 Mbps • No start-up initialization required • Wide Operating Supply Voltage • 2.5–5.5 V Data rates up to 150 Mbps are supported, and all devices achieve propagation delays of less than 10 ns. Ordering options include a choice of isolation ratings (2.5, 3.75 and 5 kV) and a selectable fail-safe operating mode to control the default output state during power loss. All products are safety certified by UL, CSA, VDE, and CQC, and products in wide-body packages support reinforced insulation withstanding up to 5 kVRMS. • Up to 5000 VRMS isolation Automotive Grade is available for certain part numbers. These products are built using automotive-specific flows at all steps in the manufacturing process to ensure the robustness and low defectivity required for automotive applications. • Ultra low power (typical) Industrial Applications • Industrial automation systems • Medical electronics • Isolated switch mode supplies • Isolated ADC, DAC • Motor control • Power inverters • Communications systems Safety Regulatory Approvals • UL 1577 recognized • Up to 5000 VRMS for 1 minute • CSA approval • IEC 60950-1, 62368-1, 60601-1 (reinforced insulation) • VDE certification conformity • Si862xxT options certified to reinforced per VDE 0884-10 and 62368-1 • All other options certified to VDE 0884-10 (basic), 60950-1 (reinforced), and 62368-1 (reinforced) • CQC certification approval • GB4943.1-2011 Automotive Applications • On-board chargers • Battery management systems • Charging stations • Traction inverters • Hybrid Electric Vehicles • Battery Electric Vehicles • Reinforced VDE 0884-10, 10 kV surgecapable (Si862xxT) • 60-year life at rated working voltage • High electromagnetic immunity 5 V Operation • 1.6 mA per channel at 1 Mbps • 5.5 mA per channel at 100 Mbps 2.5 V Operation • 1.5 mA per channel at 1 Mbps • 3.5 mA per channel at 100 Mbps • Schmitt trigger inputs • Selectable fail-safe mode • Default high or low output (ordering option) • Precise timing (typical) • 10 ns propagation delay • 1.5 ns pulse width distortion • 0.5 ns channel-channel skew • 2 ns propagation delay skew • 5 ns minimum pulse width • Transient Immunity 50 kV/µs • AEC-Q100 qualification • Wide temperature range • –40 to 125 °C • RoHS-compliant packages • WB SOIC-16 • SOIC-8 • DFN-8 compact package • Automotive-grade OPNs available • AIAG compliant PPAP documentation support • IMDS and CAMDS listing support 1 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 1 Si861x/2x Data Sheet • Ordering Guide 1. Ordering Guide Industrial and Automotive Grade OPNs Industrial-grade devices (part numbers having an “-I” in their suffix) are built using well-controlled, high-quality manufacturing flows to ensure robustness and reliability. Qualifications are compliant with JEDEC, and defect reduction methodologies are used throughout definition, design, evaluation, qualification, and mass production steps. Automotive-grade devices (part numbers having an “-A” in their suffix) are built using automotive-specific flows at all steps in the manufacturing process to ensure robustness and low defectivity. These devices are supported with AIAG-compliant Production Part Approval Process (PPAP) documentation, and feature International Material Data System (IMDS) and China Automotive Material Data System (CAMDS) listing. Qualifications are compliant with AEC-Q100, and a zero-defect methodology is maintained throughout definition, design, evaluation, qualification, and mass production steps. Table 1.1. Ordering Guide for Valid OPNs1, 2, 4 See the Top Marking section of this data sheet for the part number decoder. 2 Number Number of Inputs of Inputs Max Data Rate VDD1 VDD2 (Mbps) Side Side Default Output State Isolation Rating (kV) Package 150 Low 2.5 SOIC-8 0 150 Low 3.75 SOIC-8 1 0 150 High 3.75 SOIC-8 Si8610BD-AS 1 0 150 Low 5.0 WB SOIC-16 Si8610ED-B-IS Si8610ED-AS 1 0 150 High 5.0 WB SOIC-16 Si8620BB-B-IS Si8620BB-AS 2 0 150 Low 2.5 SOIC-8 Si8620EB-B-IS Si8620EB-AS 2 0 150 High 2.5 SOIC-8 Si8620BC-B-IS Si8620BC-AS 2 0 150 Low 3.75 SOIC-8 Si8620EC-B-IS Si8620EC-AS 2 0 150 High 3.75 SOIC-8 Si8620BD-B-IS Si8620BD-AS 2 0 150 Low 5.0 WB SOIC-16 Si8620ED-B-IS Si8620ED-AS 2 0 150 High 5.0 WB SOIC-16 Si8621BB-B-IS Si8621BB-AS 1 1 150 Low 2.5 SOIC-8 Si8621BC-B-IS Si8621BC-AS 1 1 150 Low 3.75 SOIC-8 Si8621EC-B-IS Si8621EC-AS 1 1 150 High 3.75 SOIC-8 Si8621BD-B-IS Si8621BD-AS 1 1 150 Low 5.0 WB SOIC-16 Si8621ED-B-IS Si8621ED-AS 1 1 150 High 5.0 WB SOIC-16 Si8622BB-B-IS Si8622BB-AS 1 1 150 Low 2.5 SOIC-8 Si8622EB-B-IS Si8622EB-AS 1 1 150 High 2.5 SOIC-8 Si8622BC-B-IS Si8622BC-AS 1 1 150 Low 3.75 SOIC-8 Si8622EC-B-IS Si8622EC-AS 1 1 150 High 3.75 SOIC-8 Si8622BD-B-IS Si8622BD-AS 1 1 150 Low 5.0 WB SOIC-16 Si8622ED-B-IS Si8622ED-AS 1 1 150 High 5.0 WB SOIC-16 SI8610BB-B-IM1 SI8610BB-AM1 1 0 150 Low 2.5 DFN-8 SI8610EB-B-IM1 SI8610EB-AM1 1 0 150 High 2.5 DFN-8 Ordering Part Number (OPN) Automotive OPNs5, 6 Si8610BB-B-IS Si8610BB-AS 1 0 Si8610BC-B-IS Si8610BC-AS 1 Si8610EC-B-IS Si8610EC-AS Si8610BD-B-IS Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 2 Si861x/2x Data Sheet • Ordering Guide Number Number of Inputs of Inputs Max Data Rate VDD1 VDD2 (Mbps) Side Side Default Output State Isolation Rating (kV) Package 150 Low 2.5 DFN-8 0 150 High 2.5 DFN-8 1 1 150 Low 2.5 DFN-8 SI8621EB-AM1 1 1 150 High 2.5 DFN-8 SI8622BB-B-IM1 SI8622BB-AM1 1 1 150 Low 2.5 DFN-8 SI8622EB-B-IM1 SI8622EB-AM1 1 1 150 High 2.5 DFN-8 Ordering Part Number (OPN) Automotive OPNs5, 6 SI8620BB-B-IM1 SI8620BB-AM1 2 0 SI8620EB-B-IM1 SI8620EB-AM1 2 SI8621BB-B-IM1 SI8621BB-AM1 SI8621EB-B-IM1 Product Options with Reinforced VDE 0884-10 Rating with 10 kV Surge Capability Si8620BT-IS Si8620BT-AS 2 0 150 Low 5.0 WB SOIC-16 Si8620ET-IS Si8620ET-AS 2 0 150 High 5.0 WB SOIC-16 Si8621BT-IS Si8621BT-AS 1 1 150 Low 5.0 WB SOIC-16 Si8621ET-IS Si8621ET-AS 1 1 150 High 5.0 WB SOIC-16 Si8622BT-IS Si8622BT-AS 1 1 150 Low 5.0 WB SOIC-16 Si8622ET-IS Si8622ET-AS 1 1 150 High 5.0 WB SOIC-16 Note: 1. All packages are RoHS-compliant with peak reflow temperatures of 260 °C according to the JEDEC industry standard classifications and peak solder temperatures. 2. “Si” and “SI” are used interchangeably. 3. An "R" at the end of the part number denotes tape and reel packaging option. 4. The temperature ranges is –40 to +125 °C. 5. Automotive-Grade devices (with an "–A" suffix) are identical in construction materials, topside marking, and electrical parameters to their Industrial-Grade (with an "–I" suffix) version counterparts. Automotive-Grade products are produced utilizing full automotive process flows and additional statistical process controls throughout the manufacturing flow. The Automotive-Grade part number is included on shipping labels. 6. In the top markings of each device, the Manufacturing Code represented by either “RTTTTT” or “TTTTTT” contains as its first character a letter in the range N through Z to indicate Automotive-Grade. 3 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 3 Table of Contents 1. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Eye Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 . . . 3. Device Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.1 Device Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.2 Undervoltage Lockout . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.3 Layout Recommendations . 3.3.1 Supply Bypass . . . 3.3.2 Output Pin Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 . 8 . 8 3.4 Fail-Safe Operating Mode . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.5 Typical Performance Characteristis . . . . . . . . . . . . . . . . . . . . . . . 9 4. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .11 5. Pin Descriptions (WB SOIC-16) . . . . . . . . . . . . . . . . . . . . . . . 28 . . . . . . . . . . . . . . . . . . . . . . . . . 29 7. Pin Descriptions (DFN-8) . . . . . . . . . . . . . . . . . . . . . . . . . . 30 8. Package Outline: WB SOIC-16 . . . . . . . . . . . . . . . . . . . . . . . . 31 9. Land Pattern: WB SOIC-16 . . . . . . . . . . . . . . . . . . . . . . . . . 33 10. Package Outline: SOIC-8 . . . . . . . . . . . . . . . . . . . . . . . . . 34 11. Land Pattern: SOIC-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 12. Package Outline: DFN-8 . . . . . . . . . . . . . . . . . . . . . . . . . . 36 13. Land Pattern: DFN-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 14. Top Marking: WB SOIC-16 . . . . . . . . . . . . . . . . . . . . . . . . . 38 15. Top Marking: SOIC-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 16. Top Marking: DFN-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 17. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 6. Pin Descriptions (SOIC-8) 4 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 4 Si861x/2x Data Sheet • System Overview 2. System Overview 2.1 Theory of Operation The operation of an Si861x/2x channel is analogous to that of an opto coupler, except an RF carrier is modulated instead of light. This simple architecture provides a robust isolated data path and requires no special considerations or initialization at start-up. A simplified block diagram for a single Si861x/2x channel is shown in the figure below. Figure 2.1. Simplified Channel Diagram A channel consists of an RF Transmitter and RF Receiver separated by a semiconductor-based isolation barrier. Referring to the transmitter, input A modulates the carrier provided by an RF oscillator using on/off keying. The Receiver contains a demodulator that decodes the input state according to its RF energy content and applies the result to output B via the output driver. This RF on/off keying scheme is superior to pulse code schemes as it provides best-in-class noise immunity, low power consumption, and improved immunity to magnetic fields. See the following figure for more details. Figure 2.2. Modulation Scheme 5 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 5 Si861x/2x Data Sheet • System Overview 2.2 Eye Diagram The figure below illustrates an eye diagram taken on an Si8610. For the data source, the test used an Anritsu (MP1763C) Pulse Pattern Generator set to 1000 ns/div. The output of the generator's clock and data from an Si8610 were captured on an oscilloscope. The results illustrate that data integrity was maintained even at the high data rate of 150 Mbps. The results also show that 2 ns pulse width distortion and 350 ps peak jitter were exhibited. Figure 2.3. Eye Diagram 6 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 6 Si861x/2x Data Sheet • Device Operation 3. Device Operation Device behavior during start-up, normal operation, and shutdown is shown in Figure 3.1 Device Behavior during Normal Operation on page 8, where UVLO+ and UVLO– are the respective positive-going and negative-going thresholds. Refer to the following table to determine outputs when power supply (VDD) is not present. Table 3.1. Si86xx Logic Operation VI Input1, 2 VDDI State1, 3, 4 VDDO State1, 3, 4 VO Output1, 2 H P P H L P P L X5 UP P L6 H6 X5 P UP Undetermined Comments Normal operation. Upon transition of VDDI from unpowered to powered, VO returns to the same state as VI in less than 1 µs. Upon transition of VDDO from unpowered to powered, VO returns to the same state as VI within 1 µs. Note: 1. VDDI and VDDO are the input and output power supplies. VI and VO are the respective input and output terminals. 2. X = not applicable; H = Logic High; L = Logic Low; Hi-Z = High Impedance. 3. “Powered” state (P) is defined as 2.5 V < VDD < 5.5 V. 4. “Unpowered” state (UP) is defined as VDD = 0 V. 5. Note that an I/O can power the die for a given side through an internal diode if its source has adequate current. 6. See Ordering Guide for details. This is the selectable fail-safe operating mode (ordering option). Some devices have default output state = H, and some have default output state = L, depending on the ordering part number (OPN). For default high devices, the data channels have pull-ups on inputs/outputs. For default low devices, the data channels have pull-downs on inputs/outputs. 7 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 7 Si861x/2x Data Sheet • Device Operation 3.1 Device Startup Outputs are held low during powerup until VDD is above the UVLO threshold for time period tSTART. Following this, the outputs follow the states of inputs. 3.2 Undervoltage Lockout Undervoltage Lockout (UVLO) is provided to prevent erroneous operation during device startup and shutdown or when VDD is below its specified operating circuits range. Both Side A and Side B each have their own undervoltage lockout monitors. Each side can enter or exit UVLO independently. For example, Side A unconditionally enters UVLO when VDD1 falls below VDD1(UVLO–) and exits UVLO when VDD1 rises above VDD1(UVLO+). Side B operates the same as Side A with respect to its VDD2 supply. Figure 3.1. Device Behavior during Normal Operation 3.3 Layout Recommendations To ensure safety in the end-user application, high-voltage circuits (i.e., circuits with >30 VAC) must be physically separated from the safety extra-low-voltage circuits (SELV is a circuit with 109 >109 Method b1 (VIORM x 1.875 = VPR, 100% Production Test, tm = 1 sec, Partial Discharge < 5 pC) Transient Overvoltage VIOTM t = 60 sec Tested per IEC 60065 with surge voltage of 1.2 µs/50 µs VIOSM Surge Voltage Pollution Degree (DIN VDE 0110, Table 1) Insulation Resistance at TS, VIO = 500 V RS Ω Note: 1. Maintenance of the safety data is ensured by protective circuits. The Si86xxxx provides a climate classification of 40/125/21. 2. The DFN-8 package is not certified to VDE 0884-10 and hence cannot be listed under this table. Refer to Table 4.5, CSA section for working voltage specifications. Table 4.9. IEC Safety Limiting Values1 Parameter Symbol Safety Temperature TS Safety Input Current IS Test Condition θJA = 140 °C/W (SOIC-8) Max Unit WB SOIC-16 SOIC-8 150 150 °C 220 160 mA 150 150 mW 100 °C/W (WB SOIC-16) VI = 5.5 V, TJ = 150 °C, TA = 25 °C Device Power Dissipation2 PD Note: 1. Maximum value allowed in the event of a failure; also see the thermal derating curve in Figure 4.3 (WB SOIC-16) Thermal Derating Curve for Safety Limiting Current on page 26 and Figure 4.4 (SOIC-8) Thermal Derating Curve for Safety Limiting Current on page 26. 2. The Si86xx is tested with VDD1 = VDD2 = 5.5 V; TJ = 150 ºC; CL = 15 pF, input a 150 Mbps 50% duty cycle square wave. 25 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 25 Si861x/2x Data Sheet • Electrical Specifications Table 4.10. Thermal Characteristics Parameter IC Junction-to-Air Thermal Resistance Symbol WB SOIC-16 SOIC-8 DFN-8 Unit θJA 100 140 94 °C/W Figure 4.3. (WB SOIC-16) Thermal Derating Curve for Safety Limiting Current Figure 4.4. (SOIC-8) Thermal Derating Curve for Safety Limiting Current 26 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 26 Si861x/2x Data Sheet • Electrical Specifications Table 4.11. Absolute Maximum Ratings1 Parameter Symbol Min Max Unit Storage Temperature2 TSTG –65 150 °C Operating Temperature TA –40 125 °C Junction Temperature TJ — 150 °C VDD1, VDD2 –0.5 7.0 V Input Voltage VI –0.5 VDD + 0.5 V Output Voltage VO –0.5 VDD + 0.5 V Output Current Drive Channel IO — 10 mA Lead Solder Temperature (10 s) — 260 °C Maximum Isolation (Input to Output) (1 sec) — 4500 VRMS — 6500 VRMS Supply Voltage SOIC-8 & DFN-8 Maximum Isolation (Input to Output) (1 sec) WB SOIC-16 Note: 1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be restricted to conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum ratings for exteneded periods may degrade performance. 2. VDE certifies storage temperature from –40 to 150 °C. 27 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 27 Si861x/2x Data Sheet • Pin Descriptions (WB SOIC-16) 5. Pin Descriptions (WB SOIC-16) GND2 GND1 NC VDD1 A1 RF XMITR NC NC I s o l a t i o n RF RCVR GND1 NC Si8610 WB SOIC-16 Name GND2 GND1 NC NC VDD2 VDD1 B1 A1 RF XMITR NC A2 RF XMITR NC NC NC GND1 GND2 NC I s o l a t i o n GND2 GND1 NC NC VDD2 VDD1 RF RCVR B1 A1 RF XMITR RF RCVR B2 A2 RF RCVR NC NC NC GND1 GND2 Si8620 WB SOIC-16 NC I s o l a t i o n GND2 GND1 NC NC VDD2 VDD1 NC RF RCVR B1 A1 RF RCVR RF XMITR B2 A2 RF XMITR NC NC NC GND1 Si8621 WB SOIC-16 GND2 Type NC I s o l a t i o n VDD2 RF XMITR B1 RF RCVR B2 NC NC Si8622 WB SOIC-16 WB SOIC-16 Pin# WB SOIC-16 Pin# Si8610 Si862x GND1 1 1 Ground NC1 2, 5, 6, 8,10, 2, 6, 8,10, No Connect 11, 12, 15 11, 15 VDD1 3 3 Supply A1 4 4 Digital I/O Side 1 digital input or output. A2 NC 5 Digital I/O Side 1 digital input or output. GND1 7 7 Ground Side 1 ground. GND2 9 9 Ground Side 2 ground. B2 NC 12 Digital I/O Side 2 digital input or output. B1 13 13 Digital I/O Side 2 digital input or output. VDD2 14 14 Supply Side 2 power supply. GND2 16 16 Ground Side 2 ground. GND2 Description Side 1 ground. NC Side 1 power supply. Note: 1. No Connect. These pins are not internally connected. They can be left floating, tied to VDD, or tied to GND. 28 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 28 Si861x/2x Data Sheet • Pin Descriptions (SOIC-8) 6. Pin Descriptions (SOIC-8) VDD1 A1 RF XMITR VDD1/NC GND1 I s o l a t i o n VDD2 GND2/NC RF RCVR Si8610 SOIC-8 Name B1 VDD1 A1 RF XMITR A2 RF XMITR GND2 GND1 I s o l a t i o n VDD2 VDD1 RF RCVR B1 A1 RF XMITR RF RCVR B2 A2 RF RCVR GND2 Si8620 SOIC-8 GND1 I s o l a t i o n VDD2 VDD1 RF RCVR B1 A1 RF RCVR RF XMITR B2 A2 RF XMITR Si8621 SOIC-8 Type GND2 GND1 I s o l a t i o n VDD2 RF XMITR B1 RF RCVR B2 Si8622 SOIC-8 SOIC-8 Pin# SOIC-8 Pin# Si861x Si862x VDD1/NC1 1, 3 1 Supply Side 1 power supply. GND1 4 4 Ground Side 1 ground. A1 2 2 Digital I/O Side 1 digital input or output. A2 NA 3 Digital I/O Side 1 digital input or output. B1 6 7 Digital I/O Side 2 digital input or output. B2 NA 6 Digital I/O Side 2 digital input or output. VDD2 8 8 Supply Side 2 power supply. GND2/NC1 5.7 5 Ground Side 2 ground. GND2 Description Note: 1. No connect. These pins are not internally connected. They can be left floating, tied to VDD, or tied to GND. 29 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 29 Si861x/2x Data Sheet • Pin Descriptions (DFN-8) 7. Pin Descriptions (DFN-8) VDD1 8 1 A1 2 VDD1/NC 3 GND1 4 RF XMTR I s o l a t i o n RF RCVR Si8610 DFN-8 Name VDD1 VDD2 8 1 7 GND2/NC A1 2 RF XMTR 6 B1 A2 3 RF XMTR 5 GND2 GND1 4 I s o l a t i o n VDD2 VDD1 8 1 RF RCVR 7 B1 A1 2 RF XMTR RF RCVR 6 B2 A2 3 RF RCVR 5 GND2 GND1 4 Si8620 DFN-8 I s o l a t i o n VDD2 VDD1 RF RCVR 7 B1 A1 2 RF RCVR RF XMTR 6 B2 A2 3 RF XMTR 5 GND2 GND1 4 Si8621 DFN-8 Type 8 VDD2 RF XMTR 7 B1 RF RCVR 6 B2 5 GND2 1 I s o l a t i o n Si8622 DFN-8 DFN-8 Pin# DFN-8 Pin# Description Si861x Si862x VDD1/NC1 1, 3 1 Supply Side 1 power supply. GND1 4 4 Ground Side 1 ground. A1 2 2 Digital I/O Side 1 digital input or output. A2 NA 3 Digital I/O Side 1 digital input or output. B1 6 7 Digital I/O Side 2 digital input or output. B2 NA 6 Digital I/O Side 2 digital input or output. VDD2 8 8 Supply Side 2 power supply. GND2/NC1 5.7 5 Ground Side 2 ground. Note: 1. No connect. These pins are not internally connected. They can be left floating, tied to VDD, or tied to GND. 30 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 30 Si861x/2x Data Sheet • Package Outline: WB SOIC-16 8. Package Outline: WB SOIC-16 The figure below illustrates the package details for the Triple-Channel Digital Isolator. The table lists the values for the dimensions shown in the illustration. Figure 8.1. WB SOIC-16 31 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 31 Si861x/2x Data Sheet • Package Outline: WB SOIC-16 Table 8.1. WB SOIC-16 Package Diagram Dimensions1, 2, 3, 4 Dimension Min Max A — 2.65 A1 0.10 0.30 A2 2.05 — b 0.31 0.51 c 0.20 0.33 D 10.30 BSC E 10.30 BSC E1 7.50 BSC e 1.27 BSC L 0.40 1.27 h 0.25 0.75 θ 0° 8° aaa — 0.10 bbb — 0.33 ccc — 0.10 ddd — 0.25 eee — 0.10 fff — 0.20 Note: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to JEDEC Outline MS-013, Variation AA. 4. Recommended reflow profile per JEDEC J-STD-020 specification for small body, lead-free components. 32 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 32 Si861x/2x Data Sheet • Land Pattern: WB SOIC-16 9. Land Pattern: WB SOIC-16 The figure below illustrates the recommended land pattern details for the Si861x/2x in a WB SOIC-16 package. The table lists the values for the dimensions shown in the illustration. Figure 9.1. PCB Land Pattern: WB SOIC-16 Table 9.1. WB SOIC-16 Land Pattern Dimensions1, 2 Dimension Feature (mm) C1 Pad Column Spacing 9.40 E Pad Row Pitch 1.27 X1 Pad Width 0.60 Y1 Pad Length 1.90 Note: 1. This Land Pattern Design is based on IPC-7351 pattern SOIC127P1032X265-16AN for Density Level B (Median Land Protrusion). 2. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed. 33 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 33 Si861x/2x Data Sheet • Package Outline: SOIC-8 10. Package Outline: SOIC-8 The figure below illustrates the package details for the Si86xx. The table lists the values for the dimensions shown in the illustration. α Figure 10.1. SOIC-8 Package Table 10.1. SOIC-8 Package Diagram Dimensions Symbol Millimeters Min Max A 1.35 1.75 A1 0.10 0.25 A2 1.40 REF 1.55 REF B 0.33 0.51 C 0.19 0.25 D 4.80 5.00 E 3.80 4.00 e 34 1.27 BSC H 5.80 6.20 h 0.25 0.50 L 0.40 1.27 m 0° 8° Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 34 Si861x/2x Data Sheet • Land Pattern: SOIC-8 11. Land Pattern: SOIC-8 The figure below illustrates the recommended land pattern details for the Si86xx in a SOIC-8. The table lists the values for the dimensions shown in the illustration. Figure 11.1. PCB Land Pattern: SOIC-8 Table 11.1. SOIC-8 Land Pattern Dimensions1, 2 Dimension Feature (mm) C1 Pad Column Spacing 5.40 E Pad Row Pitch 1.27 X1 Pad Width 0.60 Y1 Pad Length 1.55 Note: 1. This Land Pattern Design is based on IPC-7351 pattern SOIC127P600X173-8N for Density Level B (Median Land Protrusion). 2. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed. 35 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 35 Si861x/2x Data Sheet • Package Outline: DFN-8 12. Package Outline: DFN-8 Figure 12.1. DFN-8 Package Outline Dimension MIN NOM MAX A 0.80 0.85 0.90 A1 0 -- 0.05 b 0.25 0.30 0.35 D 4.90 5.00 5.10 e E 0.65 BSC 3.90 E1 4.00 4.10 3.80 REF L 0.45 0.50 0.55 L1 0.05 0.10 0.15 bbb -- -- 0.10 ccc -- -- 0.08 ddd -- -- 0.10 Note: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 36 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 36 Si861x/2x Data Sheet • Land Pattern: DFN-8 13. Land Pattern: DFN-8 Figure 13.1. PCB Land Pattern: DFN-8 Table 13.1. DFN-8 Land Pattern Dimensions Dimension mm C1 4.30 E 0.65 X1 0.65 Y1 0.40 Note: General 1. All dimensions shown are in millimeters (mm). 2. This Land Pattern Design is based on the IPC-7351 guidelines. 3. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm. Solder Mask Design 1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 mm minimum, all the way around the pad. Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125 mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 1:1. Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020D specification for Small Body Components. 37 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 37 Si861x/2x Data Sheet • Top Marking: WB SOIC-16 14. Top Marking: WB SOIC-16 Si86XYSV YYWWRTTTTT e4 CC Figure 14.1. WB SOIC-16 Top Marking Table 14.1. WB SOIC-16 Top Marking Explanation Line 1 Marking: Base Part Number Si86 = Isolator product series Ordering Options X = # of data channels (2, 1) (See Ordering Guide for more information.) Y = # of reverse channels (2, 1, 0)1 S = Speed Grade (max data rate) and operating mode: B = 150 Mbps (default output = low) E = 150 Mbps (default output = high) V = Insulation rating B = 2.5 kV; C = 3.75 kV; D = 5.0 kV; T = 5.0 kV with 10 kV surge capability. Line 2 Marking: YY = Year WW = Workweek RTTTTT = Mfg Code Assigned by assembly subcontractor. Corresponds to the year and workweek of the mold date. Manufacturing code from assembly house “R” indicates revision Line 3 Marking: Circle = 1.7 mm Diameter “e4” Pb-Free Symbol (Center-Justified) Country of Origin ISO Code Ab- CC = Country of Origin ISO Code Abbreviation breviation • TW = Taiwan • TH = Thailand Note: 1. The Si8622 has 1 forward and 1 reverse channel, but directionality is reversed compared to the Si8621, as shown in 5. Pin Descriptions (WB SOIC-16) and 6. Pin Descriptions (SOIC-8) 38 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 38 Si861x/2x Data Sheet • Top Marking: SOIC-8 15. Top Marking: SOIC-8 Si86XYSV YYWWRT e3 TTTT Figure 15.1. SOIC-8 Top Marking Table 15.1. SOIC-8 Top Marking Explanation Line 1 Marking: Base Part Number Si86 = Isolator Product Series Ordering Options XY = Channel Configuration (See Ordering Guide for more information). S = Speed Grade (max data rate) V = Insulation rating Line 2 Marking: YY = Year WW = Workweek R = Product (OPN) Revision T = First character of the manufacturing code Line 3 Marking: Assigned by assembly subcontractor. Corresponds to the year and workweek of the mold date. First two characters of the manufacturing code from Assembly. Circle = 1.1 mm Diameter “e3” Pb-Free Symbol. TTTT = Last four characters of the manufacturing code Last four characters of the manufacturing code. Note: 1. The Si8622 has 1 forward and 1 reverse channel, but directionality is reversed compared to the Si8621, as shown in 5. Pin Descriptions (WB SOIC-16) and 6. Pin Descriptions (SOIC-8) 39 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 39 Si861x/2x Data Sheet • Top Marking: DFN-8 16. Top Marking: DFN-8 Si86XY SV TTTTTT YYWW Figure 16.1. DFN-8 Top Marking Line 1 Marking Base Part Number Ordering Options Si86 = Isolator Product Series XY = Channel Configuration (See Ordering Guide for more information). Line 2 Marking Ordering Options S = Default High or Low Option V = Insulation Rating Line 3 Marking Manufacturing code Line 4 Marking YY = Year WW = Workweek Assigned by assembly subcontractor. Corresponds to the year and workweek of the mold date. Note: The Si8622 has 1 forward and 1 reverse channel, but directionality is reversed as compared to Si8621, as shown in Pin Descriptions sections. 40 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 40 Si861x/2x Data Sheet • Revision History 17. Revision History Revision A July 2022 • Added Agile data sheet revision in footer. Revision 1.76 December 2020 • Added DFN-8 package option • Corrected typos in VT+, VT- and VHYS (HYS is subscript) values in Table 4.4 • Standardized package designations across document Revision 1.75 September 2019 • Updated the Ordering Guide. Revision 1.74 October 2018 • Updated the Ordering Guide for Automotive-Grade OPN options. Revision 1.73 May 2018 • Updated the Ordering Guide for Automotive-Grade OPN options. Revision 1.72 April 2018 • Added Si8610ED-AS to Ordering Guide for Automotive-Grade OPN options. Revision 1.71 • Added new table to Ordering Guide for Automotive-Grade OPN options. Revision 1.7 • Added following note to 1. Ordering Guide: "An 'R' at the end of the part number denotes tape and reel packaging option." Revision 1.6 • Added product options Si862xxT in 1. Ordering Guide. • Added spec line items for Input Leakage Current pertaining to Si862xxT in 4. Electrical Specifications. • Updated IEC 60747-5-2 to IEC 60747-5-5 in all instances in document. Revision 1.5 • Updated Table 5 on page 17. • Added CQC certificate numbers. • Updated "5. Ordering Guide" on page 11. • Removed references to moisture sensitivity levels. • Removed Note 2. 41 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 41 Si861x/2x Data Sheet • Revision History Revision 1.4 • Added Figure 2, “Common Mode Transient Immunity Test Circuit,” on page 8. • Added references to CQC throughout. • Added references to 2.5 kVRMS devices throughout. • Updated "5. Ordering Guide" on page 11. • Updated "10.1. WB SOIC-16 Top Marking" on page 18. Revision 1.3 • Updated Table 11 on page 21. • Added junction temperature spec. • Updated "2.3.1. Supply Bypass" on page 6. • Removed “3.3.2. Pin Connections” on page 22. • Updated "5. Ordering Guide" on page 11. • Removed Rev A devices. • Updated "6. Package Outline: WB SOIC-16" on page 13. • Updated Top Marks. • Added revision description. Revision 1.2 • Updated Table 1 on page 4. • Deleted reference to EN. • Updated "5. Ordering Guide" on page 11 to include MSL2A. Revision 1.1 • Updated High Level Output Voltage VOH to 3.1 V in Table 3, “Electrical Characteristics,” on page 9. • Updated High Level Output Voltage VOH to 2.3 V in Table 4, “Electrical Characteristics,” on page 13. Revision 1.0 • Updated “Table 3. Electrical Characteristics”. • Reordered spec tables to conform to new convention. • Removed “pending” throughout document. Revision 0.3 • Added chip graphics on page 1. • Updated Table 6, “Insulation and Safety-Related Specifications,” on page 18. • Updated Table 8, “IEC 60747-5-5 Insulation Characteristics for Si86xxxx*,” on page 19. • Updated "3. Pin Descriptions (WB SOIC-16)" on page 9. • Updated "4. Pin Descriptions (SOIC-8)" on page 10. • Updated "5. Ordering Guide" on page 11. Revision 0.2 • Added chip graphics on page 1. • Moved Tables 1 and 11 to page 21. • Updated Table 6, “Insulation and Safety-Related Specifications,” on page 18. • Updated Table 8, “IEC 60747-5-5 Insulation Characteristics for Si86xxxx*,” on page 19. • Moved Table 1 to page 4. • Moved “Typical Performance Characteristics” to page 7. • Updated "3. Pin Descriptions (WB SOIC-16)" on page 9. • Updated "4. Pin Descriptions (SOIC-8)" on page 10. • Updated "5. Ordering Guide" on page 11. 42 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206328A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 42 Connecting Everyone and Everything, All the Time Portfolio Quality Support & Resources skyworksinc.com skyworksinc.com/quality skyworksinc.com/support Copyright © 2022 Skyworks Solutions, Inc. All Rights Reserved. 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