PLBT3838D-WCIR94

PRODUCT SPECIFICATION Part Number PLBT3838D-WCIR94 Details • • • • 3838 Infrared Emitter 3.85mm x 3.85mm x 2.21mm 940nm - 90° v/a Package: Clear Silicone Features • • • • Corrosion robustness class: 3B ESD: 2KV (HBM: MIL-STD-883 Class 2) Dual junction emitter RoHS & REACH Compliant Mechanical Dimensions Notes: 1. Specifications subject to change without notice 2. All dimensions are in millimeters unless otherwise noted 3. Tolerance is ±0.1mm unless otherwise noted www.p-tec.net 062422 Rev0 MS 1 Device Selection Guide Model Number PLBT3838D-WCIR94 Emitting Color Infrared (IR) Lens Color Clear Notes: 1. Forward voltage (VF ) ±0.05V；Luminous flux (ΦV) ±7%；CRI ±2；Viewing angle(2θ1/2) ±10° 2. IS standard testing. Viewing Angle 90° Absolute Maximum Ratings at Ta=25°C Parameter Symbol Forward Current Power Consumption Reverse Voltage Junction Temperature Operating Temperature Range Storage Temperature Range Thermal Resistance Junction / Solder Point ESD (withstand voltage (HBM : MIL-STD-883 Class 2) IF Ptot Vr TJ Topr Tstg RTH VESD Notes: 1. For other ambient, limited setting of current will depend on de-rating curves. 2. When drive on maximum current, Junction temperature must be kept below 145oC Min. -----40 -40 --- Rating Typ. --------- Max 1 3.4 5 145 100 100 12 2 Unit A W V °C °C °C K/W kV Electrical Characteristics at Ta=25°C, IF: 1A, TP: 10ms www.p-tec.net Parameter Symbol Peak Wavelength Spectral Bandwidth Viewing Angle Total Radiated Power Radiant Intensity Forward Voltage Reverse current (VR=5V) λp Δλ 2θ1/2 Φe IE VF IR 062422 Rev0 MS Min. -------- Rating Typ. 940 25 -1300 760 3.1 -- Max --90° 1500 -3.4 10 Unit nm nm deg mW mW/sr V μA 2 Typical Electrical Optical Characteristic Curves Radiation Characteristics Relative Radiant Intensity Forward Current www.p-tec.net Relative Total Radiant Power Relative Spectral Emission 062422 Rev0 MS 3 Reflow Soldering Profile Product complies to MSL Level 2 according to JEDEC J-STD-020E Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Ramp-up rate to preheat 25 oC to 150 oC Time tS tS TSmin to TSmax 60 Ramp-up rate to peak TSmax to TP Recommendation Maximum 2 3 K/s 100 120 s 2 3 K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 Peak temperature 5 oC Time within of the specified peak temperature TP - 5 K TP TP 10 Ramp-down Rate TP to 100 oC Time 25 oC to TP 1. 2. Unit oC 100 s 245 260 oC 20 30 s 3 4 K/s 480 s Do not stress the silicone resin while it is exposed to high temperature. The reflow process should not exceed 2 times. www.p-tec.net 062422 Rev0 MS 4 Approved By PLBT3838D-WCIR94 Customer Approval Signatures Record of Revisions Rev. Comments Page Date 0 Released Spec -- 6/23/22 www.p-tec.net 062422 Rev0 MS 5