DATA SHEET
Part No. Package Code No.
AN18401A
QFN028-P-0405B
Publication date: June 2007
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AN18401A Contents
Overview Features Package Type Applications ………….………………………………………………………………………………………………. 3 …………………………………...………………………………………………………………………. 3 ………………………………………………………………………………………………………. 3 …………………………………...………………………………………………………………………. 3 ….………………...……………………………………………………………………………… 4 …………………..………………………………………………………………………………. 5 ……..………………………………………………………………………………. 6 ……………………..……………..…………………………......………………… 7
……….…….………………………………………………………………………………………………… 3
Block Diagram Pin Descriptions
Application Circuit Example Absolute Maximum Ratings
Operating Supply Voltage Range …………………………………………..……………………………………. 7
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AN18401A
AN18401A
Down Converter IC for GPS
Overview
AN18401A, using SiGe process, realizes on-chip LNA with low noise figure and ultra low-power current consumption. As not only the LNA but also VCO is completely built in the IC, it enables further miniaturization of GPS modules and a reduction of components.
Features
A single chip IC for the LNA block with low noise figure (NF = 1.6 dB) Low current consumption: 24 mA Achievement of saving the space of sets according to significant reduction of external parts (LNA, BPF, VCO, etc)
Applications
For portable terminal, car navigation system
Package
4-direction 28-pin plastic quad flat non-leaded package (QFN type)
Type
SiGe Bi-CMOS IC
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AN18401A
Block Diagram
Lim-amp-in
Mix2-in2 16 MIX2
Lim-out2
PC2
22
20
PC1
17
Mix2-out
21
19
GND3
23
LIM
VCC4
24 AMP 14 Mix1-out2
REF-in
25
18
15
Mix2-in1
Lim-out1
REF/OSC
1/2
ECL/MOS
13
Mix1-out1
GND4
26 PD 1/2(8 × 11 + 7)
1/190
PD
27 VCO 1stMIX 10 VCC3
VCC5
28 9 LNA2 LNA1 LNA1-in
1
2
3
5
6
7
VCC1
VCC2
LNA2-in
GND1
GND2
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LNA1-out
LNA1-E
8
4
AN18401A
Application Circuit Example
C12 260 pF R3 5.1 kΩ R2 5.1 kΩ L7 3.3 μH C11
L8 6.3 μH L6 3.3 μH C10 500 pF 500 pF
C14 1 000 pF
C13 1 000 pF
22
21
20
17
16 MIX2
19
23
C15 1 000 pF
LIM
24 AMP 14
C9 L5 0.39 μH L4 0.39 μH
18
15
25
94 pF
REF/OSC
1/2
ECL/MOS
13
26 PD
C16 1 000 pF C17 R4
1/190 1/2(8 × 11 + 7)
27 VCO 1stMIX 10
C8 1 000 pF
20 000 pF 5.6 kΩ
28
C18 1 000 pF
9 LNA2 LNA1
L3 4.7 nH
1
2
3
5
6
7
8
C1 1 000 pF
C2 1 000 pF
L1 4.7 nH C4 0.5 pF C3 1.5 pF C5 0.5 pF C6 1 000 pF L2 2.2 nH R1 470 Ω
C7 1.5 pF
3.0 V
FL1
SAW filter
SAFSE1G57 AB0T00R00
3.0 V
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211840100506020
AN18401A
Pin Descriptions
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 VCC1 VCC2 LNA2-in N.C. GND1 GND2 LNA1-out LNA1-E LNA1-in VCC3 N.C. N.C. Mix1-out1 Mix1-out2 Mix2-in1 Mix2-in2 Mix2-out Lim-amp-in PC1 PC2 Lim-out1 Lim-out2 GND3 VCC4 REF-in GND4 PD VCC5 Pin name Type Power supply Power supply Input — Ground Ground Output — Input Power supply — — Output Output Input Input Output Input — — Output Output Ground Power supply Input Ground Output Power supply VCC (LNA2) VCC (1st Mix) LNA2 input No connection GND (LNA2) GND (LNA1) LNA1 output LNA1 transistors emitter LNA1 input VCC (LNA1) No connection No connection Mix1 output 1 Mix1 output 2 Mix2 input 1 Mix2 input 2 Mix2 output Lim-amp input Lim-amp bypass capacitor 1 Lim-amp bypass capacitor 2 Lim-amp output 1 Lim-amp output 2 GND (Lim-amp/PLL) VCC (Lim-amp/PLL) REF signal input GND (VCO) PD output VCC (VCO) Description
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AN18401A
Absolute Maximum Ratings
A No. 1 2 3 4 5 Parameter Supply voltage Supply current Power dissipation Operating ambient temperature Storage temperature Symbol VCC ICC PD Topr Tstg Rating 3.2 60 182 −40 to +85 −55 to +150 Unit V mA mW °C °C Note *1 ⎯ *2 *3 *3
Note) *1: The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2: The power dissipation shown is the value at Ta = 85°C for the independent (unmounted) IC package. *3: Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25°C.
Operating Supply Voltage Range
Parameter Supply voltage range Symbol VCC Range 2.7 to 3.15 Unit V Note *
Note) *: The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
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Request for your special attention and precautions in using the technical information and semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.