AN26011A

DATA SHEET Part No. Package Code No. AN26011A SSMINI-5DC Publication date: July 2010 Ver. AEB 1 AN26011A Contents Overview ………………………………………………….…………………………………………………………. 3 Features ………………………………………………….…………………………………………………………. 3 Applications ……………………………………………….…………………………………………………………. 3 Package ………………………………………………….…………………………………………………………. 3 Type ……………………………………………………….…………………………………………………………. 3 Application Circuit Example Pin Descriptions ■ Absolute Maximum Ratings …………….…………….…………………………………………………………. 4 ………………………………………….…………………………………………. 7 ………………………………………………………………………………………………….. 6 Operating Supply Voltage Range ……………………………………….………………………………………. 7 Allowable Current and Voltage Range …………………………………………………………………………… 8 ■ Electrical Characteristics …………………………………………………………………………………………. 9 Electrical Characteristics (Reference values for design) ……………………………………………………… 11 Control Pins Mode Table …………………………………………………………………………………………. 13 Technical Data ……………………………………………….……………………………………………………. 14 PD ⎯ Ta diagram …………………………………………………………………………………………………. 14 Usage Notes ………………………………………….……………………………………………………………. 15 Ver. AEB 2 AN26011A AN26011A LNA-IC for 800 MHz / 450 MHz Band Applications Overview AN26011A is LNA-IC for 800 MHz / 450 MHz Band Applications. Realizing high performance by using 0.18 μm SiGeC Bi-CMOS process (fT = 90 GHz, fmax = 140 GHz). Sleep mode is available, controlled by integrated CMOS logic circuit. Achieving miniaturization by using small size package. Features Low voltage operation High gain Low noise figure Low distortion (IIP3 +10 MHz offset) Small package +2.80 V typ. 15.0 dB typ. fRX = 881.5 MHz 16.0 dB typ. fRX= 450 MHz 1.50 dB typ. fRX = 881.5 MHz 1.40 dB typ. fRX= 450 MHz +10.0 dBm typ.fRX = 881.5 MHz +10.0 dBm typ. fRX= 450 MHz Applications 800MHz Band Applications 450MHz Band Applications Package 5 pin Plastic Small Surface Mount Package (SMINI Type) Type Bi-CMOS IC Ver. AEB 3 AN26011A Application Circuit Example 800 MHz Band Applications OUT 4.0 pF 0.1 μF VCC 10 nH 12 nH OUT 5 VCC 4 1 2 3 IN GND 1000 pF CNT (Gain Control) 12 nH 4.0 pF IN Notes) This application circuit is shown as an example but does not guarantee the design for mass production set. Ver. AEB 4 AN26011A Application Circuit Example (continued) 450 MHz Band Applications OUT 0.1 μF VCC 4.5 pF 22 nH 10 Ω OUT 5 4 VCC 0.5 pF 1.3 kΩ 1 2 3 IN GND CNT (Gain Control) 2.0 pF 12 nH 1000 pF IN Notes) This application circuit is shown as an example but does not guarantee the design for mass production set. Ver. AEB 5 AN26011A Pin Descriptions Pin No. 1 2 3 4 5 IN GND CNT VCC OUT Pin name Type Input Ground Input Power supply Output RF Input GND High-Gain / Low-Gain SW VCC RF Output Description Ver. AEB 6 AN26011A Absolute Maximum Ratings Note) Absolute maximum ratings are limit values which are not destructed, and are not the values to which operation is guaranteed. A No. 1 2 3 4 5 Parameter Supply voltage Supply current Power dissipation Operating ambient temperature Storage temperature Symbol VCC ICC PD Topr Tstg Rating 3.6 18 64.8 –20 to +70 –55 to +125 Unit V mA mW °C °C Notes *1 ⎯ *2 *3 *3 Notes) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2 : The power dissipation shown is the value at Ta = 70°C for the independent (unmounted) IC package without a heat sink. When using this IC, refer to • PD-Ta diagram in the Technical Data and design the heat radiation with sufficient margin so that the allowable value might not be exceeded based on the conditions of power supply voltage, load, and ambient temperature. *3 : Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25°C. Operating supply voltage range Parameter Supply voltage range Symbol VCC Range 2.65 to 2.95 Unit V Notes * Notes) *: The values under the condition not exceeding the above absolute maximum ratings and the power dissipation Ver. AEB 7 AN26011A Allowable Current and Voltage Range Notes) Allowable current and voltage ranges are limit ranges which are not destructed, and are not the ranges to which operation is guaranteed. Voltage values, unless otherwise specified, are with respect to GND. Do not apply external currents or voltages to any pin not specifically mentioned. For the circuit currents, "+" denotes current flowing into the IC, and "−" denotes current flowing out of the IC. Pin No. 1 3 5 Note) Pin name IN CNT OUT Rating — – 0.3 to (VCC + 0.3) – 0.3 to (VCC + 0.3) Unit V V V Notes *1 *2 *2 *1 Do not apply more than 0 dBm to RF input RF signal input pin. Do not apply DC current. *2 (VCC + 0.3) V must not be exceeded 3.6 V Ver. AEB 8 AN26011A Electrical Characteristics at VCC = 2.80 V Notes) All parameters are specified under Ta = 25°C±2°C unless otherwise specified. B No. Parameter Symbol Conditions Limits Min Typ Max Unit Notes DC electrical characteristics DC-1 DC-2 DC-3 DC-4 DC-5 DC-6 Supply current (High Gain mode) Supply current (Low Gain mode) CNT current (High Gain mode) CNT current (Low Gain mode) CNT voltage (High Gain mode) CNT voltage (Low Gain mode) IccHS IccLS IcntHS IcntLS VIHS VILS VCC current at Active mode No input signal VCC current at Sleep mode No input signal CNT current at Active mode No input signal CNT current at Sleep mode No input signal — — — — 2.52 — 11.5 0 5 0 — 0 14.5 10 35 10 3.1 0.3 mA μA μA μA V V — — — — — — Ver. AEB 9 AN26011A Electrical Characteristics (continued) at VCC = 2.80 V Note) All parameters are specified under Ta = 25°C±2°C, fRXa = 881.5 MHz, PRXa = –30 dBm, CW unless otherwise specified. B No. Parameter Symbol Conditions Limits Min Typ Max Unit Notes LNA AC electrical characteristics ( High Gain Mode ) A-1 A-2 Power Gain HG IIP3 +10 MHz offset GHS IIP3S f1 = fRXa + 10 MHz f2 = fRXa + 20 MHz Input 2 signals (f1, f2) 13.0 6.0 15.0 10.0 17.0 — dB dBm — — LNA AC electrical characteristics ( Low Gain Mode ) A-3 Power Gain LG GLS PRX a= –20 dBm –5.0 –3.0 –1.5 dB — Ver. AEB 10 AN26011A Electrical Characteristics (Reference values for design) at VCC = 2.8 V Note) All characteristics are specified under Ta = 25°C±2°C, fRXa = 869 MHz, 881.5 MHz, 894 MHz, PRXa = –30 dBm, CW The characteristics listed below are reference values derived from the design of the IC and are not guaranteed by inspection. If a problem does occur related to these characteristics, we will respond in good faith to user concerns. B No. Parameter Symbol Conditions Reference values Min Typ Max Unit Notes LNA AC electrical characteristics ( High Gain Mode ) B-1 B-2 B-3 Power Gain HG Noise Figure HG IIP3 +10 MHz offset HG IIP3 –10 MHz offset HG Input P1dB Reverse Isolation HG Input Return Loss HG GHa NFHa IIP3H1a f1 = fRXa + 10 MHz f2 = fRXa + 20 MHz Input 2 signals (f1, f2) f1 = fRXa – 10 MHz f2 = fRXa – 20 MHz Input 2 signals (f1, f2) 13.0 — 6.0 15.0 1.5 10.0 17.0 2.1 — dB dB dBm — *1 — B-4 B-5 B-6 B-7 B-8 IIP3H2a IP1dBHa ISOHa S11Ha S22Ha 6.0 –10.0 — 5.5 7.0 10.0 –6.0 –22.0 7.5 9.0 — — –18 — — dBm dBm dB dB dB — — — — — Output Return Loss HG LNA AC electrical characteristics ( Low Gain Mode ) B-9 B-10 Power Gain LG Noise Figure LG IIP3 +10 MHz offset LG Reverse Isolation LG Input Return Loss LG GLa NFLa f1 = fRXa + 10 MHz f2 = fRXa + 20 MHz PRXa = –15 dBm Input 2 signals (f1, f2) PRXa = –20 dBm –5.0 — –3.0 3.0 –1.5 5.5 dB dB — — B-11 IIP3L1a 17.0 20.0 — dBm — B-12 B-13 B-14 ISOLa S11La S22La –5.0 7.0 5.5 –3.0 9.0 7.5 –1.5 — — dB dB dB — — — Output Return Loss LG Note) *1 : Connector & substrate loss (0.1 dB) included. Ver. AEB 11 AN26011A Electrical Characteristics (Reference values for design ; continued) at VCC = 2.8 V Note) All characteristics are specified under Ta = 25°C±2°C, fRXb = 440 MHz, 450 MHz, 460 MHz, PRXb = –30 dBm, CW The characteristics listed below are reference values derived from the design of the IC and are not guaranteed by inspection. If a problem does occur related to these characteristics, we will respond in good faith to user concerns. B No. Parameter Symbol Conditions Reference values Min Typ Max Unit Notes LNA AC electrical characteristics ( High Gain Mode ) D-1 D-2 D-3 Power Gain HG Noise Figure HG IIP3 +10 MHz offset HG IIP3 –10 MHz offset HG Input P1dB Reverse Isolation HG Input Return Loss HG GHc NFHc IIP3H1c f1 = fRXb + 10 MHz f2 = fRXb + 20 MHz Input 2 signals (f1, f2) f1 = fRXb – 10 MHz f2 = fRXb – 20 MHz Input 2 signals (f1, f2) 14.0 — 6.5 16.0 1.4 10.0 18.0 2.1 — dB dB dBm — *1 — D-4 D-5 D-6 D-7 D-8 IIP3H2c IP1dBHc ISOHc S11Hc S22Hc 6.5 –11.0 — 5.5 5.0 10.0 –7.0 –24.0 7.5 7.5 — — –20.0 — — dBm dBm dB dB dB — — — — — Output Return Loss HG LNA AC electrical characteristics ( Low Gain Mode ) D-9 D-10 Power Gain LG Noise Figure LG IIP3 +10 MHz offset LG Reverse Isolation LG Input Return Loss LG GLc NFLc f1 = fRXa + 10 MHz f2 = fRXa + 20 MHz PRXa = –10 dBm Input 2 signals (f1, f2) PRXb = –20 dBm –4.5 — –3.0 3.0 –1.5 5.0 dB dB — — D-11 IIP3L1c 22.0 25.0 — dBm — D-12 D-13 D-14 ISOLc S11Lc S22Lc –4.5 8.5 12.0 –3.0 10.0 15.0 –1.5 — — dB dB dB — — — Output Return Loss LG Note) *1 : Connector & substrate loss (0.1 dB) included. Ver. AEB 12 AN26011A Control Pins Mode Table Note) Control voltage range : See B No. DC-5 / B No. DC-6 at page 9 Pin No. 3 Description Gain control Pin voltage Low Low gain High High gain Remarks — Ver. AEB 13 AN26011A Technical Data PD ⎯ Ta diagram Ver. AEB 14 AN26011A Usage Notes Special attention and precaution in using 1. This IC is intended to be used for general electronic equipment [880 MHz / 450 MHz Band Applications]. Consult our sales staff in advance for information on the following applications: Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (1) Space appliance (such as artificial satellite, and rocket) (2) Traffic control equipment (such as for automobile, airplane, train, and ship) (3) Medical equipment for life support (4) Submarine transponder (5) Control equipment for power plant (6) Disaster prevention and security device (7) Weapon (8) Others : Applications of which reliability equivalent to (1) to (7) is required 2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might smoke or ignite. 3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In addition, refer to the Pin Description for the pin configuration. 4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solderbridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during transportation. 5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pinVCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) . And, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke emission will depend on the current capability of the power supply. 6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. 7. When using the LSI for new models, verify the safety including the long-term reliability for each product. 8. When the application system is designed by using this LSI, be sure to confirm notes in this book. Be sure to read the notes to descriptions and the usage notes in the book. Ver. AEB 15 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202