AN44069A

DATA SHEET Part No. Package Code No. AN44069A HSOP042-P-0400D Publication date: July 2009 SDL00015AEB 1 AN44069A Contents Overview …………………………………………………….……………………………………………………… 3 Features ………………………………………………….………………………………………………………… 3 Applications ………………………………………………….……………………………………………………… 3 Package ………………………………………………….…………………………………………………………. 3 Type ……………………………………………………….…………………………………………………………. 3 Application Circuit Example ……………………………………………………………………………………… 4 Pin Descriptions ………………………………………….………………………………………………………… 5 Absolute Maximum Ratings ……………………………….……………………………………………………… 6 Operating Supply Voltage Range …………………….…………………………………………………………… 6 Allowable Current and Voltage Range ………………………………………………………………………….. 7 Electrical Characteristics …………….…………………………………………………………………………… 8 Electrical Characteristics (Reference values for design) …………….…………………………………………. 10 Technical Data ………………………………………….…………………………………………………………… 11 I/O block circuit diagrams and pin function descriptions ………………………………………………………. 11 Control mode ………………………………………….…………………………………………………………… 16 PD ⎯ Ta diagram …………………………………………………………………………………………………. 21 Usage Notes ………………………………………….……………………………………………………………. 22 Special attention and precaution in using ………………………………………………………………………. 22 Notes of power LSI ………………………………………………………………………………………………. 23 SDL00015AEB 2 AN44069A AN44069A Driver IC for Stepping Motor Overview AN44069A is a two channels H-bridge driver IC. Bipolar stepping motor can be controlled by a single driver IC. 2-phase, half-step, 1-2 (type2) phase, W1-2 phase can be selected. Features 4-phase input control (W1-2 phase excitation enabled) Built-in CR chopping (with frequency selected) Built-in thermal protection and low voltage detection circuit Built-in 5 V power supply Applications IC for stepping motor drives Package 28 pin Plastic Small Outline Package With Heat Sink (SOP Type) Type Bi-CDMOS IC SDL00015AEB 3 AN44069A Application Circuit Example BC1 19 0.01 μF BC2 20 PHB1 2 ENABLEB 9 IN3 6 IN2 5 CHARGE PUMP 21 VPUMP 0.01 μF Gate Circuit 12 BOUT2 SQ R 13 RCSB 14 BOUT1 VREFB 24 TJMON 10 PWMSW 28 VREFA 23 PWMSW BLANK 22 VM2 25 VCC 0.1 μF OSC TSD UVLO 47 μF 8 VM1 15 AOUT2 16 RCSA R IN1 4 IN0 3 ENABLEA 7 PHA1 1 S5VOUT 27 0.1 μF Reg VM Gate Circuit 26 GND 17 AOUT1 Notes) This application circuit is shown as an example but does not guarantee the design for mass production set. SDL00015AEB QS 4 AN44069A Pin Descriptions Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 FIN Pin name PHA1 PHB1 IN0 IN1 IN2 IN3 ENABLEA VM1 ENABLEB TJMON N.C. BOUT2 RCSB BOUT1 AOUT2 RCSA AOUT1 N.C. BC1 BC2 VPUMP VM2 VREFA VREFB VCC GND S5VOUT PWMSW FIN Type Input Input Input Input Input Input Input Power supply Input Output — Output Input / Output Output Output Input / Output Output — Output Output Output Power supply Input Input Power supply Ground Output Input — Phase A phase selection input Phase B phase selection input Phase A output torque control 1 Phase A output torque control 2 Phase B output torque control 1 Phase B output torque control 2 Phase A Enable/Disable CTL Motor power supply 1 Phase B Enable/Disable CTL VBE monitor use N.C. Phase B motor drive output 2 Phase B current detection Phase B motor drive output 1 Phase A motor drive output 2 Phase A current detection Phase A motor drive output 1 N.C. Charge pump capacitor connection 1 Charge pump capacitor connection 2 Charge pump circuit output Motor power supply 2 Phase A torque reference voltage input Phase B torque reference voltage input Signal power supply Signal ground Internal reference voltage (5 V output) PWM frequency selection input Die pad ground (N.C.) Description SDL00015AEB 5 AN44069A Absolute Maximum Ratings Note) Absolute maximum ratings are limit values which are not destructed, and are not the values to which operation is guaranteed. A No. 1 2 3 4 5 6 7 8 Parameter Supply voltage 1 (Pin 8, 22) Supply voltage 2 (Pin 25) Power dissipation Operating ambient temperature Storage temperature Output pin voltage (Pin 12, 14, 15, 17) Motor drive current (Pin 12, 14, 15, 17) Flywheel diode current (Pin 12, 14, 15, 17) Symbol VM VCC PD Topr Tstg VOUT IOUT If Rating 37 –0.3 to +6 0.717 –20 to +70 –55 to +150 37 ±1.5 1.5 Unit V V W °C °C V A A Notes *1 *1 *2 *3 *3 *4 *4 *4 Notes) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2 : The power dissipation shown is the value at Ta = 70°C for the independent (unmounted) IC package without a heat sink. When using this IC, refer to the PD-Ta diagram of the package standard and design the heat radiation with sufficient margin so that the allowable value might not be exceeded based on the conditions of power supply voltage, load, and ambient temperature. *3 : Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25°C. *4 : Do not apply current or voltage from outside to any pin not listed above. In the circuit current (+) means the current flowing into IC and (–) means the current flowing out of IC. Operating supply voltage range Parameter Supply voltage range 1 Supply voltage range 2 Symbol VM VCC Range 16.0 to 34.0 4.5 to 5.5 Unit V V Notes * * Note) * : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. SDL00015AEB 6 AN44069A Allowable Current and Voltage Range Notes) Voltage values, unless otherwise specified, are with respect to GND. Do not apply external currents or voltages to any pin not specifically mentioned. For the circuit currents, "+" denotes current flowing into the IC, and "−" denotes current flowing out of the IC. Pin No. 1 2 3 4 5 6 7 9 13 16 19 20 21 23 24 28 Pin name PHA1 PHB1 IN0 IN1 IN2 IN3 ENABLEA ENABLEB RCSB RCSA BC1 BC2 VPUMP VREFA VREFB PWMSW Rating –0.3 to 6 –0.3 to 6 –0.3 to 6 –0.3 to 6 –0.3 to 6 –0.3 to 6 –0.3 to 6 –0.3 to 6 2.5 2.5 VM + 0.3 (VM – 1) to 43 (VM – 1) to 43 –0.3 to 6 –0.3 to 6 –0.3 to 6 Unit Notes V V V V V V V V V V V V V V V V — — — — — — — — — — *1 *1 *1 — — — Pin No. 27 Pin name S5VOUT Rating –7 to 0 Unit Notes mA *1 Notes) *1 : External voltage must not be applied to these pins. Design so that the voltage does not exceed ratings even transiently. SDL00015AEB 7 AN44069A Electrical Characteristics at VM = 24.0 V, VCC = 5.0 V Note) Ta = 25°C±2°C unless otherwise specified. B No. Power Block 1 2 3 4 5 Parameter Symbol Conditions Limits Min Typ Max Unit Notes High-level output saturation voltage Low-level output saturation voltage Flywheel diode forward voltage Output leakage current 1 Supply current VOH VOL VDI ILEAK1 IM I = –0.8 A I = 0.8 A I = 0.8 A VM = 37 V, VRCS = 0 V ENABLEA = ENABLEB = 5 V VM – 0.75 VM – 0.50 — 1.14 1.5 20 6 V V V μA mA — — — — — — 0.5 — — 0.75 1.0 10 4 I/O Block 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Supply current (with two circuits turned OFF) High-level IN input voltage Low-level IN input voltage High-level IN input current Low-level IN input current High-level PHA1, PHB1 input voltage Low-level PHA1, PHB1 input voltage High-level PHA1, PHB1 input current Low-level PHA1, PHB1 input current High-level ENABLEA, ENABLEB input voltage Low-level ENABLEA, ENABLEB input voltage High-level ENABLEA, ENABLEB input current Low-level ENABLEA, ENABLEB input current High-level PWMSW input voltage Low-level PWMSW input voltage High-level PWMSW input current Low-level PWMSW input current ICC VINH VINL IINH IINL VPHAH VPHBH VPHAL VPHBL IPHAH IPHBH IPHAL IPHBL VENABLEAH VENABLEBH VENABLEAL VENABLEBL IENABLEAH IENABLEBH IENABLEAL IENABLEBL VPWMSWH VPWMSWL IPWMSWH IPWMSWL ENABLEA = ENABLEB = 5 V — 2.2 0 –10 –15 2.2 0 16.5 –15 2.2 0 –10 –15 2.2 0 16.5 –15 1.4 — — ― ― — — 33 ― — — ― ― — — 33 ― 2.2 VCC 0.6 10 15 VCC 0.6 66 15 VCC 0.6 10 15 VCC 0.6 66 15 mA V V μA μA V V μA μA V V μA μA V V μA μA — — — — — — — — — — — — — — — — — 8 — — IN0 = IN1 = IN2 = IN3 = 5 V IN0 = IN1 = IN2 = IN3 = 0 V — — PHA1 = PHB1 = 3.3 V PHA1 = PHB1 = 0 V — — ENABLEA = ENABLEB = 5 V ENABLEA = ENABLEB = 0 V — — PWMSW = 3.3 V PWMSW = 0 V SDL00015AEB AN44069A Electrical Characteristics (continued) at VM = 24.0 V, VCC = 5.0 V Note) Ta = 25°C±2°C unless otherwise specified. B No. Parameter Symbol Conditions Limits Min Typ Max Unit Notes Torque control Block 23 24 25 26 27 28 29 Input bias current PWM frequency 1 PWM frequency 2 Pulse blanking time Comp threshold H (100%) Comp threshold C (67%) Comp threshold L (33%) IREFA IREFB fPWM1 fPWM2 TB VTH VTC VTL VREFA = 5 V VREFB = 5 V PWMSW = 0 V PWMSW = 5 V VREFA = VREFB = 0 V IN0 = IN1 = 0.6 V IN2 = IN3 = 0.6 V IN0 = 2.2 V, IN1 = 0.6 V IN2 = 2.2 V, IN3 = 0.6 V IN0 = 0.6 V, IN1 = 2.2 V IN2 = 0.6 V, IN3 = 2.2 V 83.3 34 17 0.38 475 308 151 100 52 26 0.75 500 333 167 125 70 35 1.12 525 359 184 μA kHz kHz μs mV mV mV — — — — — — — Reference voltage Block 30 31 Reference voltage Output impedance VS5VOUT ZS5VOUT IS5VOUT = –2.5 mA Impedance of IS5VOUT = –2.5 mA, –5 mA 4.5 — 5.0 18 5.5 27 V Ω — — SDL00015AEB 9 AN44069A Notes) Ta = 25°C±2°C unless otherwise specified. The characteristics listed below are reference values derived from the design of the IC and are not guaranteed by inspection. If a problem does occur related to these characteristics, we will respond in good faith to user concerns. Electrical Characteristics (Reference values for design) at VM = 24.0 V, VCC = 5.0 V B No. Output Drivers 32 33 34 Parameter Symbol Conditions Reference values Min Typ Max Unit Notes Output slew rate 1 Output slew rate 2 Dead time VTr VTf TD Rising edge Falling edge — — — — 270 330 2.8 — — — V/μs V/μs μs — — — Thermal Protection 35 36 Thermal protection operating temperature Thermal protection hysteresis width TSDon ΔTSD — — — — 150 40 — — ºC ºC — — I/O Block 37 Note) High-level PHA1, PHB1, PWMSW input current 2 IPWMSWH2 IPHAH2 IPHBH2 — — 68 — μA *1 *1 : For the input current characteristic of PHA1, PHB1, and PWMSW, refer to Usage Notes described in Page 33. SDL00015AEB 10 AN44069A Technical Data I/O block circuit diagrams and pin function descriptions Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed. Pin No. Waveform and voltage Internal circuit Impedance Description 21 3k 3k 12 13 14 15 16 17 Pin 12 BOUT2 14 BOUT1 15 AOUT2 17 AOUT1 — 100k — Pin 12 : Phase B motor drive output 2 13 : Phase B current detection 14 : Phase B motor drive output 1 15 : Phase A motor drive output 2 16 : Phase A current detection 17 : Phase A motor drive output 1 100k Pin 13 RCSB 16 RCSA 4k 150k 20 21 BC2 — 20 125 VPUMP 21 — Pin20 : Charge pump capacitor connection 2 21: Charge pump circuit output SDL00015AEB 11 AN44069A Technical Data (continued) I/O block circuit diagrams and pin function descriptions (continued) Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed. Pin No. Waveform and voltage Internal circuit Impedance Description 150 BC1 19 — 200 19 — Pin 19 : Charge pump capacitor connection 1 Pin23 VREFA 24 VREFB 23 24 — 45k 4k 2.231k 8.935k 4.96k 50 kΩ Pin 23 : Phase A torque reference voltage input 24 : Phase B torque reference voltage input SDL00015AEB 12 AN44069A Technical Data (continued) I/O block circuit diagrams and pin function descriptions (continued) Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed. Pin No. Waveform and voltage Internal circuit Impedance Description Pin27 S5VOUT 27 — 2k 102k 27 102 kΩ Pin 27 : Internal reference voltage (5 V-output) Pin 1 PHA1 2 PHB1 28 PWMSW 1 2 28 — 4k 100 kΩ Pin 1 : Phase A phase selection input 2 : Phase B phase selection input 28 : PWM frequency selection 100k 50k SDL00015AEB 13 AN44069A Technical Data (continued) I/O block circuit diagrams and pin function descriptions (continued) Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed. Pin No. Waveform and voltage Internal circuit Impedance Description 3 4 5 6 7 9 Pin 3 IN0 4 IN1 5 IN2 6 IN3 7 ENABLEA 9 ENABLEB — 4k — Pin 3 : Phase A output torque control 1 4 : Phase A output torque control 2 5 : Phase B output torque control 1 6 : Phase B output torque control 2 7 : Phase A Enable/Disable signal input 9 : Phase B Enable/Disable signal input 100k 10 — 10 800 — Pin10 : VBE monitor Pin 10 TJMON SDL00015AEB 14 AN44069A Technical Data (continued) I/O block circuit diagrams and pin function descriptions (continued) Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed. Pin No. Waveform and voltage Internal circuit Impedance Description VCC (Pin 25) VM(Pin 8, Pin 22) Symbols ― Diode Zener diode Ground — — SDL00015AEB 15 AN44069A Technical Data (continued) Control mode 1. Truth table ENABLEA/ENABLEB "L" "L" "H" IN0/IN2 "L" "H" "L" "H" Note 1) Rs : Current detection resistance Note2) ENABLEA = ENABLEB = "H" or IN0 = IN1 = "H" / IN2 = IN3 = "H", all outputs transistors turn off at the same time. PHA1/PHB1 "H" "L" — IN1/IN3 "L" "L" "H" "H" AOUT1/BOUT1 "H" "L" OFF AOUT2/BOUT2 "L" "H" OFF Output current (VREF / 10) × (1 / Rs) = IOUT (VREF / 10) × (1 / Rs) × (2 / 3) = IOUT (VREF / 10) × (1 / Rs) × (1 / 3) = IOUT 0 SDL00015AEB 16 AN44069A Technical Data (continued) Control mode (continued) 2. Drive of full step (4steps sequence) (IN0 to IN3 = const.) 1 2 3 4 1 2 3 4 VPHA1 VPHA1 VPHB1 VPHB1 Flow-out flow-in flow-out flow-in FWD flow-in B-ch. Motor current B-ch. Motor current flow-out flow-in A-ch. Motor current A-ch. Motor current flow-out REV SDL00015AEB 17 AN44069A Technical Data (continued) Control mode (continued) 3. Drive of half step (8steps sequence) (Ex.) 12345678 12345678 VPHA1 VPHB1 VIN0 VIN1 VPHA1 VPHB1 VIN0 VIN1 VIN2 VIN3 VIN2 VIN3 flow-out flow-in flow-in FWD REV flow-in B-ch. Motor current B-ch. Motor current flow-out flow-in A-ch. Motor current flow-out A-ch. Moto current flow-out REV FWD SDL00015AEB 18 AN44069A Technical Data (continued) Control mode (continued) 4. 1-2 phase excitation (8steps sequence) (Ex.) 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 VPHA1 VPHB1 VIN0 VIN1 VPHA1 VPHB1 VIN0 VIN1 VIN2 VIN3 VIN2 VIN3 flow-in flow-in flow-in B-ch. Motor current flow-out B-ch. Motor current flow-out flow-in A-ch. Motor current flow-out A-ch. Motor current flow-out FWD REV REV FWD SDL00015AEB 19 AN44069A Technical Data (continued) Control mode (continued) 5. W1-2 phase excitation (16steps sequence) 1 2 3 4 5 6 7 8 9 101112 13 1415 16 1 2 3 4 5 6 7 8 9 1011 12 131415 16 VPHA1 VPHB1 VIN0 VIN1 VIN2 VIN3 VPHA1 VPHB1 VIN0 VIN1 VIN2 VIN3 flow-out flow-in flow-in FWD REV flow-in B-ch. Motor current B-ch. Motor current flow-out flow-in A-ch. Motor current flow-out A-ch. Motor current flow-out REV FWD SDL00015AEB 20 AN44069A Technical Data (continued) PD ⎯ Ta diagram SDL00015AEB 21 AN44069A Usage Notes Special attention and precaution in using 1. This IC is intended to be used for general electronic equipment [Stepping motor drive]. Consult our sales staff in advance for information on the following applications: Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (1) Space appliance (such as artificial satellite, and rocket) (2) Traffic control equipment (such as for automobile, airplane, train, and ship) (3) Medical equipment for life support (4) Submarine transponder (5) Control equipment for power plant (6) Disaster prevention and security device (7) Weapon (8) Others : Applications of which reliability equivalent to (1) to (7) is required 2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might smoke or ignite. 3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In addition, refer to the Pin Description for the pin configuration. 4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solderbridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during transportation. 5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pinVCC short (Power supply fault), output pin-GND short (Ground fault), output-to-output-pin short (load short), or leakage between pins. Especially, for the pins below, take notice of Power supply fault, Ground fault, load short, and short to the current detection pins. (1) AOUT1(Pin 17), AOUT2(Pin 15), BOUT1(Pin 14), BOUT2(Pin 12) (2) BC2(Pin 20), VPUMP(Pin 21) (3) VM1(Pin 8), VM2(Pin 22), VCC(Pin 25), S5VOUT(Pin 27) (4) RCSA(Pin 16), RCSB(Pin 13) And, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke emission will depend on the current capability of the power supply. 6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. 7. When using the LSI for new models, verify the safety including the long-term reliability for each product. 8. When the application system is designed by using this LSI, be sure to confirm notes in this book. Be sure to read the notes to descriptions and the usage notes in the book. 9. Connect the metallic plate (fin) on the back side of the IC with the GND potential. The thermal resistance and the electrical characteristics are guaranteed only when the metallic plate (fin) is connected with the GND potential. SDL00015AEB 22 AN44069A Usage Notes (continued) Notes of Power LSI 1. Design the heat radiation with sufficient margin so that the allowable value might not be exceeded base on the conditions of power supply voltage, load, and ambient temperature. (It is recommended to design the junctions of the IC with 70% to 80% of absolute maximum rating or less.) 2. The protection circuit is for maintaining safety against abnormal operation. Therefore, the protection circuit should not work during normal operation. Especially for the thermal protection circuit, if the area of safe operation or the absolute maximum rating is momentarily exceeded due to output pin to VM/VCC short (Power supply fault), or output pin to GND short (Ground fault), the LSI might be damaged before the thermal protection circuit could operate. 3. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not applied to the pins because the device might be damaged, which could happen due to negative voltage or excessive voltage generated during the ON and OFF timing when the inductive load of a motor coil or actuator coils of optical pick-up is being driven. 4. The product which has specified ASO (Area of Safe Operation) should be operated in ASO. 5. Verify the risks which might be caused by the malfunctions of external components. 6. Set the capacitance between VPUMP and GND so that VPUMP(Pin 21) must not be exceeded 43 V even transiently from motor standby to motor start. 7. This IC employs PWM drive method that switches the output transistor by high-current. Therefore it is apt to generate noises which might cause the IC to malfunction or have fatal damage. To prevent these problems, supply voltage must be stable enough. Take into consideration that the capacitor between VCC and GND is set to minimum 0.1 μF and that between VM and GND is set to minimum 47 μF. Moreover, set the capacitors to the IC as closely as possible to avoid malfunctions and damages caused by noises. 8. Pulse blanking time In order to prevent mistakes in current detection caused by noises, this IC is provided with pulse blanking time of 0.75 μs (Typ. value). In the result, the motor current will not be less than the current determined by pulse blanking time. Therefore, pay attention to controlling minute current. The Figure 1 shows the relation between the pulse blanking time and minimum current. Increase and decrease in motor current is determined by L value, winding resistance, induced voltage, and PWM ON duty in the motor. Set current At normal operation In case of setting current less than minimum TB 1/fPWM fPWM TB Minimum current Set current : PWM frequency : Pulse blanking time (Refer to ■Electrical Characteristics No.24 to 26) Figure 1. RCS current waveform SDL00015AEB 23 AN44069A Usage Notes (continued) Notes of Power LSI (continued) 9. VREF voltage In case of setting VREF voltage to low level, noises might cause malfunctions due to that Comp threshold (SPEC No. 27/28/29 in Page 10)gets low. Under the condition of set VREF voltage, use the IC after checking that malfunctions do not occur. 10. Note of interface For Pin 1 to7, Pin 9, Pin 23, 24, and 28, absolute maximum ratings are –0.3 to 6 V. When current is set to high level for a motor and lead line of GND is long, the electric potential of GND of the LSI will be raised. Therefore, take notice that interface pin might get negative to the potential of reference of GND of the LSI though applying 0 V to interface pin. Even in this case, pay attention to not exceeding allowable voltage range. 11. PWMSW(Pin 28), PHA1(Pin 1), PHB1(Pin 2) The current flowing into PEMSW, PHA1, and PHB1 changes from that determined by pull-down resistance owing to that parasitic elements in the LSI make the current flow when applying voltage of about 0.7 V or more to PWMSW, PHA1,and PHB1 under the condition of shutdown of VCC. The current flowing into PHA1/PHB1/PWMSW is set to 341.4 μA (input impedance : about 9.1 kΩ) at 3.3 V. There is no problem that the voltage up to rating is applied to above-mentioned pins. Nonetheless, it is recommended that the voltage of 0.7 V or less is applied to above-mentioned pins at shutdown of VCC. In addition, in case of the voltage of the above-mentioned pins > VCC(Pin 25) – 0.2 V at power-on of VCC, the parasitic elements in the LSI also make the current flow and the current flowing into the above-mentioned pins will change (Refer to Figure 2). There is no problem that the voltage up to rating is applied to above-mentioned pins. Nonetheless, it is recommended to set the voltage applied to the above-mentioned pins to 4.3 V or less. PHA1/PHB1/PWMSW current PHA1/PHB1/PWMSW電流 [uA] [μA] PHA1/PHB1/PWMSW = 4.3 V VCC = 4.5 V VCC = 5.0 V Z = 100 kΩ VCC = 5.5 V 400 300 200 100 0 0 1 2 約4.7 kΩ Z = about 4.7 kΩ 3 4 5 6 PHA1 / PHB1/PWMSW 電圧[V] PHA1/PHB1/PWMSW voltage [V] Figure 2. Input impedance of PHA1/PHB1/PWMSW at power-on of VCC SDL00015AEB 24 AN44069A Usage Notes (continued) Notes of Power LSI (continued) 12. In case of measuring the chip temperature of the IC, measure the voltage of TJMON(Pin 10) and presume the chip temperature from the following data. Use the following data as reference data. Before applying the IC to a product, conduct a sufficient reliability test of the IC along with the evaluation of the product with the IC incorporated VBE[V] Temperature characteristic of TJMON ΔVBE / Δtemp = –1.82 [mV / °C] 0 150 Temp[°C] 13. Power supply sequence If two type of power supply are used; Rise : It is recommended to comply with the sequence of [VCC power supply rise] → [VM power supply rise] Fall : Although there is no particular specification, confirm that VM falls for about 1 s. If it is difficult to perform the recommended sequence above, design based on the below sequence. For slew rate of rise, design with [VM : 0.1 V/μs or less, VCC : 0.1 V/μs or less]. Supply voltage VM VCC Delay : 100 ms or less If one type of power supply is used; Slew rate of rise : Design with [VM : 0.1 V/μs or less] 1s Time SDL00015AEB 25 AN44069A Usage Notes (continued) Notes of Power LSI (continued) 14. Notes of RCS line Take the figure and points below into consideration and design PCB pattern. (1) Point 1 Make the wiring to current detection pins (RCSA/RCSB) thick and short ,and design so as to lower impedance. Or else current might not be detected properly due to wiring impedance and the current might not be applied to a motor sufficiently. (2) Point 2 Make the wiring from current detection resistor shown at Point 2 in the figure below to connector GND thick and short, and design so as to lower impedance. As Point 1, sufficient current might not be applied due to wiring impedance. Set the wirings on the side of GND of RCSA and RCSB independently because peak detection might not be detected properly if there is a common impedance on the side of GND of RCSA and RCSB. (3) Point 3 Connect GND of the IC to a connector on the PBC independently. Set the wiring where current detection resistor with high current line is removed (Point 2) apart from the GND wiring of the IC and make them shorted at a point as shown in the below figure. That can minimize the flactuation of GND of the IC. Point 2 Current limit detection resistor (A) Point 1 Motor Connector GND RCSA/RCSB IC Point 3 GND 15. A high current flows into the IC. Therefore, the common impedance of the PCB pattern cannot be ignored. Take the following points into consideration and design the PCB pattern of the motor. A high current flows into the line between the VM1(Pin 8) and VM2(Pin 22). Therefore, noise is generated with ease when switching at the inductance (L) of the line, which may result in the malfunctioning or destruction of the IC (Figure 3). As shown in Figure 4, the escape way of the noise is secured by connecting the capacitor to the connector from VM pin of the IC. This makes it possible to suppress the direct VM pin voltage of the IC. Make the settings based on Figure 4 as much as possible. Low spike amplitude due to the capacitor between VM pin and GND VM L VM IC C RCS GND VM L VM IC C RCS GND GND GND Figure 3. Non-recommended pattern SDL00015AEB Figure 4. Recommended pattern 26 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805