AXT7, 8
NARROW-PITCH FOR BOARD-TO-FPC CONNECTION
NARROW PITCH (0.35 mm) CONNECTORS F35S SERIES
2. Strong resistance to adverse environments construction
Ni barrier construction
(Tough against solder rise!)
FEATURES
1. Space-saving design (0.35 mm pitch) The footprint when mated is down approx. 15% from our existing F4S model (40 contacts), contributing to the functionality enhancement and size reduction of target equipment.
Socket Header
Suction face 0.8mm
Bellows contact construction
(Tough against dropping!)
Porosity treatment
(Tough against corrosive gases!)
Compliance with RoHS Directive
F4 S3
3.4 mm
.6
mm
ts) s) tac tact n on 0 c 0 co (4 (4 m mm 5m 9.3 0.50 S1 Socket F4
V notch and Double contact constructions
(Tough against foreign particles and flux!)
Clips (soldering terminals) at the four corners Suction face 0.8mm
) cts ts) nta tac co con (40 (40 mm m .62 .80 m 8 S9 Header F4
3. The clips (soldering terminals) at the four corners enhance the mounting strength. 4. The simple lock structure ensures a superior mating/unmating operation feel. 5. The gull-wing-shaped terminals facilitate imaging inspections.
2.6
mm
APPLICATIONS
Particularly suitable for board-to-FPC connections in ultra-compact mobile equipment that requires size and thickness reduction and functionality enhancement
Clips (soldering terminals) at the four corners
ORDERING INFORMATION
AXT
7: Narrow Pitch Connector F35S (0.35 mm pitch) Socket 8: Narrow Pitch Connector F35S (0.35 mm pitch) Header Number of contacts (2 digits) Mated height / 1: For mated height 1.0 mm Functions 2: Without positioning bosses Surface treatment (Contact portion / Terminal portion) 4: Base: Ni plating, Surface: Au plating (for Ni barrier available) 4: Base: Ni plating, Surface: Au plating
1
2
4
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Narrow-pitch connectors
AXT7, 8
Narrow-pitch connectors
PRODUCT TYPES
Mated height Number of contacts 40 50 60 70 80 Part number Socket AXT740124 AXT750124 AXT760124 AXT770124 AXT780124 Header AXT840124 AXT850124 AXT860124 AXT870124 AXT880124 Inner carton Packing Outer carton
1.0mm
3,000 pieces
6,000 pieces
Notes: 1. Order unit: For mass production: in 1-inner-box (1-reel) units Samples for mounting check: in 50-connector units. Please contact our sales office. 2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our sales office. 3. Please contact us for connectors having a number of contacts other than those listed above.
SPECIFICATIONS
1. Characteristics
Item Rated current Rated voltage Electrical characteristics Breakdown voltage Insulation resistance Contact resistance Composite insertion force Composite removal force Contact holding force (Socket contact) Ambient temperature Soldering heat resistance Storage temperature Specifications 0.25A/contact (Max. 4 A at total contacts) 60V AC/DC 150V AC for 1 min. Min. 1,000MΩ (initial) Max. 100mΩ Max. 0.981N/contacts × contacts (initial) Min. 0.165N/contacts × contacts Min. 0.49N/contacts –55°C to +85°C Peak temperature: 260°C or less (on the surface of the PC board around the connector terminals) 300°C within 5 sec. 350°C within 3 sec. –55°C to +85°C (product only) –40°C to +50°C (emboss packing) 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 48 hours, contact resistance max. 100mΩ 50 times 40-contact type: Socket: 0.04 g Header: 0.02 g Measuring the maximum force. As the contact is axially pull out. No freezing at low temperatures. No dew condensation. Infrared reflow soldering Soldering iron No freezing at low temperatures. No dew condensation. Sequence 1. –55 −0 °C, 30 minutes 3 2. ~ , Max. 5 minutes +3 3. 85 0 °C, 30 minutes 4. ~ , Max. 5 minutes Bath temperature 40±2°C, humidity 90 to 95% R.H. Bath temperature 35±2°C, saltwater concentration 5±1% Bath temperature 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. Repeated insertion and removal speed of max. 200 times/ hours Conditions
No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute. Using 250V DC megger (applied for 1 min.) Based on the contact resistance measurement method specified by JIS C 5402.
Mechanical characteristics
Environmental characteristics
Thermal shock resistance (header and socket mated)
Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) H2S resistance (header and socket mated) Lifetime characteristics Unit weight Insertion and removal life
2. Material and surface treatment
Part name Molded portion Contact and Post Material LCP resin (UL94V-0) Surface treatment — Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Clips (soldering terminals): Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips) Headers: Base: Ni plating, Surface: Au plating (except the terminal tips)
Copper alloy
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AXT7, 8
Socket (Mated height: 1.0 mm)
0.80 (Suction face) A B±0.1 0.35±0.05 0.12±0.03 0.97 Terminal coplanarity
0.08
(Contact and clips (soldering terminals))
3.00
C0.15
3.40
Y note
Dimension table (mm)
Number of contacts/ dimension 40 50 60 70 80
2.00 3.40
A 9.35 11.10 12.85 14.60 16.35
B 6.65 8.40 10.15 11.90 13.65
C 8.25 10.00 11.75 13.50 15.25
Z note 0.30±0.03 C±0.1 0.35 (0.70)
General tolerance: ±0.2
Note: Since the clips (soldering terminals) are built into the body, the sections Y and Z are electrically connected.
Header (Mated height: 1.0 mm)
A B±0.1 0.35±0.05 Terminal coplanarity 0.83 0.12±0.03
0.80 (Suction face)
0.
15
0.08
(Post and clips (soldering terminals)) 2.60
R
1.86
1.90 Clips (soldering terminals)
C
0.
13
Dimension table (mm)
Number of contacts/ dimension 40 50 60 70 80 A 8.62 10.37 12.12 13.87 15.62 B 6.65 8.40 10.15 11.90 13.65 C 8.05 9.80 11.55 13.30 15.05
Clips (soldering terminals)
0.12±0.03 C±0.1
(0.48) 0.94
General tolerance: ±0.2
• Socket and Header are mated
Header Socket 1.00±0.15
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Narrow-pitch connectors
DIMENSIONS (Unit: mm)
C 0. 13
AXT7, 8
Narrow-pitch connectors
EMBOSSED TAPE DIMENSIONS (Unit: mm) (Common to all sockets and headers)
• Specifications for taping (In accordance with JIS C 0806-1990. However, not applied to the mounting-hole pitch of some connectors.)
Tape I
Dimension A: 24 mm or less (A±0.3) (C) (1.75) (4.0)
• Specifications for the plastic reel (In accordance with EIAJET-7200B.)
Tape II
Dimension A: 32 mm or less (A±0.3) (B) (C) (1.75) (4.0) (D±1) Label Top cover tape Embossed carrier tape
Leading direction after packaging
Leading direction after packaging
380 dia.
(2.0)
(2.0)
Embossed mounting-hole Taping reel
8.0
8.0
5 1.
.1 +0 0
• Dimension table (Unit: mm)
Type/Mated height Common for sockets and headers: 1.0mm Number of contacts 40 to 70 80 Type of taping Tape I Tape II A 24.0 32.0 B — 28.4 C 11.5 14.2 D 25.4 33.4 Quantity per reel 3,000 3,000
• Connector orientation with respect to embossed tape feeding direction
Type Direction of tape progress Socket Common for F35S Header
5 1.
.1 +0 0
a. di
a. di
Note: There is no indication on this product regarding top-bottom or left-right orientation.
NOTES
1. Regarding the design of PC board patterns Conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas. 2. Recommended PC board and metal mask patterns Appropriate control of solder amount is required to minimize solder bridges and other defects for connectors with 0.35mm, 0.4-mm or 0.5-mm pitch terminals, which require high-density mounting. Refer to the right-hand drawing for recommended patterns. • Socket (Mated height: 1.0 mm)
Recommended PC board pattern (TOP VIEW)
0.60 or less 2.36±0.03 0.35±0.03 (1.00) (0.72) 0.20±0.03
• Header (Mated height: 1.0 mm)
Recommended PC board pattern (TOP VIEW)
2.06±0.03 0.75±0.03 1.70±0.03 3.00±0.01 0.45±0.01 0.70±0.01 3.20±0.03 0.45±0.03 : Insulation area 0.35±0.01 (0.655) 0.18±0.01 (0.50) 2.00±0.01 0.35±0.03 (0.655) 0.20±0.03 1.00 or less
3.80±0.03
1.80±0.03
0.70±0.03 0.80±0.03
: Insulatin area
Recommended metal mask opening pattern
Metal mask thickness: When 120µm (Terminal opening ratio: 65%) (Metal-part opening ratio: 100%)
1.80±0.01 (0.52) 0.18±0.01
Recommended metal mask opening pattern
Metal mask thickness: When 120µm (Terminal opening ratio: 60%) (Metal-part opening ratio: 100%)
2.06±0.01 0.75±0.01
0.35±0.01 (1.00)
2.56±0.01
3.80±0.01
0.70±0.01 0.80±0.01
3.60±0.01
For other details, please verify with the product specification sheets.
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(0.75)
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